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Journal ArticleDOI

A new concept for electroless nickel plating: aluminium as reducing agent

Xingkai Zhang, +1 more
- 22 Mar 2016 - 
- Vol. 6, Iss: 36, pp 30695-30698
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TLDR
In this article, a facile electroless plating strategy to obtain nickel coatings on copper substrates was designed to simplify the plating baths and procedure, which contained only nickel sulfate and ammonia.
Abstract
A facile electroless plating strategy to obtain nickel coatings on copper substrates was designed to simplify the plating baths and procedure. The plating baths contained only nickel sulfate and ammonia. The aluminium connected to the copper substrates served as the electron source for nickel deposition. The nickel coatings obtained via this approach were tested and proved to possess excellent anticorrosion behavior.

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Citations
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Journal ArticleDOI

Metallic Layered Polyester Fabric Enabled Nickel Selenide Nanostructures as Highly Conductive and Binderless Electrode with Superior Energy Storage Performance

TL;DR: In this paper, a single-step chronoamperometry voltage-assisted electrochemical deposition (ECD) method was used to synthesize cauliflower-like nickel selenide nanostructures (Ni3Se2 NSs) for supercapacitors.
Journal ArticleDOI

Tribological behavior of sodium borohydride reduced electroless nickel alloy coatings at room and elevated temperatures

TL;DR: In this article, the authors compared the tribological behavior of sodium borohydride reduced electroless (Ni-B, Ni-B-W and NiB-Mo) coatings at room temperature (25°C), 100°C, 300°C and 500°C.
Journal ArticleDOI

The Importance of Electroless Metallic Build-Up on Surface Modified Substrates for Multifunctional Engineering Applications: A Recent Progress Update

TL;DR: In this article, a review article enumerates the various metallic electroless plating like nickel, copper, gold and silver with respect to copious substrates like metals, ceramics and polymers for above-mentioned engineering applications.
Journal ArticleDOI

Investigation of Al-induced electroless Sn film deposition on Cu substrate

TL;DR: In this paper, the galvanic couple between Cu-Al initiates the metal reduction reaction from a bath without traditional reducing agent and additives, and a sodium borohydride as a chemical reducing agent was also added for codeposition of boron.
References
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Journal ArticleDOI

Electroless nickel, alloy, composite and nano coatings – A critical review

TL;DR: The development of metal deposition processes based on electroless nickel, alloy and composite coatings on various surfaces has witnessed a surge in interest among researchers, with many recent applications made possible from many excellent properties as mentioned in this paper.
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Electrochemical corrosion of unalloyed copper in chloride media––a critical review

TL;DR: The literature dealing with the electrochemical corrosion characteristics of unalloyed copper in aqueous chloride media is examined in this paper, where a wide range of electrode geometries, the importance of the chloride ion and the mass transport of anodic corrosion products on the corrosion behaviour of copper are made clear for both freshly polished and ‘filmed’ surfaces.
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Protecting copper from electrochemical degradation by graphene coating

TL;DR: Graphene coating on copper (Cu) is shown to increase the resistance of the metal to electrochemical degradation by one and half orders of magnitude as discussed by the authors, which can bring paradigm changes in the development of anti-corrosion coatings using conformal ultrathin graphene films.
Journal ArticleDOI

Adsorption and corrosion inhibition of new synthesized thiophene Schiff base on mild steel X52 in HCl and H2SO4 solutions

TL;DR: In this article, a corrosion inhibitor was synthesized and its inhibiting action on the corrosion of mild steel X52 in 1M hydrochloric acid and 1M sulfuric acid was examined by different corrosion methods, such as weight loss, potentiodynamic polarization and electrochemical impedance spectroscopy (EIS).
Journal ArticleDOI

The behavior of aluminum in alkaline media

TL;DR: In this article, a high frequency capacitive loop related to the charge transfer due to dissolution of the metal, an inductive loop at medium frequency which was attributed to surface roughening and a second capacive loop obtained at low frequency which has been ascribed to the adjustment of the surface film to the change in potential resulting in higher charge transfer resistance.