Patent
Apparatus for controlling thermal transfer in a cyclic vacuum processing system
TLDR
In this article, a platen is used to define a thermal transfer region between a semiconductor wafer and a heat sink or source in a vacuum processing chamber, and a fluid-actuated valve is closed when the pressure in the chamber reaches a predetermined value.Abstract:
Apparatus for providing thermal transfer between a semiconductor wafer and a heat sink or source in a vacuum processing chamber includes a platen against which the wafer is sealed to define a thermal transfer region therebetween. The platen includes a passage for gas flow between the chamber and the thermal transfer region and a conduit for circulation of a cooling fluid. The platen further includes a fluid-actuated valve responsive to the pressure of the cooling fluid for closing the passage. When the pressure in the chamber reaches a predetermined value, the cooling fluid is turned on and closes the valve. Gas at the predetermined pressure, typically in the range of 0.5 to 100 Torr, is trapped in the thermal transfer region and conducts thermal energy. In a preferred embodiment, a plurality of platens are positioned on a rotating disc in an ion implantation system.read more
Citations
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Patent
Wafer support system
Michael W. Halpin,Mark R. Hawkins,Derrick W. Foster,Robert M. Vyne,John F. Wengert,Cornelius A. van der Jeugd,Loren R. Jacobs,Frank B.M. No. Phoenix Van Bilsen,Matthew G. Goodman,Hartmann Glenn,Jason M. Layton +10 more
TL;DR: In this paper, a wafer support system consisting of a segmented susceptor having top and bottom sections and gas flow passages therethrough is described, where the sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer.
Patent
Gas-based substrate protection during processing
Everhardus Van De Ven P,Eliot K. Broadbent,Jeffrey C. Benzing,Barry L. Chin,Christopher W. Burkhart +4 more
TL;DR: In this article, the backside gas is heated in and about the bottom of the platen, and introduced through a circular groove in the peripheral region outside of the outermost vacuum groove of the vacuum chuck.
Patent
Physical vapor deposition clamping mechanism and heater/cooler
TL;DR: In this article, a clamping ring and temperature regulated platen are used for clamping a wafer to the platen and regulating the temperature of the wafer, where a roof shields all but a few contact regions of the interface between wafer and clamp from receiving depositing particles.
Patent
Single-chamber sequential curing of semiconductor wafers
TL;DR: In this paper, the authors proposed a cure chambers containing multiple cure stations, each featuring one or more UV light sources, which can be used to independently modulate the cross-linking, density and increase in stress of a cured material by providing independent control of the wafer temperature and UV intensity.
Patent
Measuring in-situ uv intensity in uv cure tool
TL;DR: In this article, a semiconductor processing apparatus for radiative cure includes a process chamber and a radiation assembly external to the process chamber, which transmits radiation into the chamber on a substrate holder through a chamber window.
References
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Patent
Apparatus for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer
TL;DR: In this paper, a semiconductor wafer is loaded at its periphery onto a shaped platen, and sufficient contact pressure from the loading is produced between the wafer and the platen so that significant gas pressure may be accommodated against the back side of the Wafer.
Patent
Method for conducting heat to or from an article being treated under vacuum
TL;DR: In this paper, a method and apparatus for providing heat conduction between an article being treated in a vacuum and a support member by providing a gas under pressure of about 0.5 to 2.0 Torr between the article and the support member is described.
Patent
Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
TL;DR: In this paper, an active cooling system for semiconductor wafers during implantation in an ion implantation chamber includes a housing incorporating a convexly curved platen, which has a coating of a pliable thermally conductive material adhered to the surface thereof.
Patent
Rotatable inspection table
TL;DR: In this article, an improved device for supporting and holding an object in place under temperature controlled conditions is described, which comprises a shaft mounted for rotation about a rotation axis, and a top plate coupled to and rotatable with the shaft.
Patent
Optimum surface contour for conductive heat transfer with a thin flexible workpiece
Scott C. Holden,Peter R. Hanley +1 more
TL;DR: In this article, the authors optimized conductive heat transfer between a thin deformable workpiece and heat sink by imposing a load over the workpiece resulting in a uniform contact pressure distribution in said workpiece which is also the maximum stress consistent with the elastic properties of the work piece.