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Ceramics in microelectronic packaging

Rao Tummala
- 01 Jan 1988 - 
- Vol. 67, Iss: 4, pp 752-758
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TLDR
In this paper, a synthese sur l'utilisation des ceramiques comme support d'emballages des puces electroniques is presented, in which l'usage of ceramique is discussed.
Abstract
Article de synthese sur l'utilisation des ceramiques comme support d'emballages des puces electroniques

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