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Design of Electronic Equipment Casings for Natural Air Cooling: Effects of Height and Size of Outlet Vent on Flow Resistance

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TLDR
In this article, the authors studied the effect of the distance between the outlet vent location and the heat source on the cooling capability of natural-air-cooled electronic equipment casings.
Abstract
As the power dissipation density of electronic equipment has continued to increase, it has become necessary to consider the cooling design of electronic equipment in order to develop suitable cooling techniques. Almost all electronic equipment is cooled by air convection. Of the various cooling systems available, natural air cooling is often used for applications for which high reliability is essential, such as telecommunications. The main advantage of natural convection is that no fan or blower is required, because air movement is generated by density differences in the presence of gravity. The optimum thermal design of electronic devices cooled by natural convection depends on an accurate choice of geometrical configuration and the best distribution of heat sources to promote the flow rate that minimizes temperature rises inside the casings. Although the literature covers natural convection heat transfer in simple geometries, few experiments relate to enclosures such as those used in electronic equipment, in which heat transfer and fluid flow are generally complicated and three dimensional, making experimental modeling necessary. Guglielmini et al. (1988) reported on the natural air cooling of electronic boards in ventilated enclosures. Misale (1993) reported the influence of vent geometry on the natural air cooling of vertical circuit boards packed within a ventilated enclosure. Lin and Armfield (2001) studied natural convection cooling of rectangular and cylindrical containers. Ishizuka et al. (1986) and Ishizuka (1998) presented a simplified set of equations derived from data on natural air cooling of electronic equipment casings and showed its validity. However, there is insufficient information regading thermal design of practical electronic equipment. For example, the simplified set of equations was based on a ventilation model like a chimney with a heater at the base and an outlet vent on the top, yet in practical electronic equipment, the outlet vent is located at the upper part of the side walls, and the duct is not circular. Therefore, here, we studied the effect of the distance between the outlet vent location and the heat source on the cooling capability of natural-air-cooled electronic equipment casings.

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Citations
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Patent

Heat dissipation structure for an electronic device

TL;DR: In this article, a flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion, where the second portion is flexibly coupled to the first housing by a hinge or other type of joint.
Patent

Flexible thermal conduit for an electronic device

TL;DR: In this article, a flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion, where the second portion is flexibly coupled to the first housing by a hinge or other type of joint.
Proceedings ArticleDOI

Performance assessment of integrated hybrid converter for Indian environmental conditions

TL;DR: In this article, the performance study of integrated hybrid converter at different levels of temperature and humidity as per international standards is discussed, and a prototype is tested in specific environmental chamber, integrated hybrid converters characteristics and efficiencies are observed.
References
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Book

Heat Transfer

J. P. Holman
Book

Heat transfer in electronic and microelectronic equipment

A. E. Bergles
TL;DR: Wang et al. as discussed by the authors presented a detailed analysis of the conductive/convective heat transfer in a single electronics board, Y.Bertin and J.B.Saulnier convective heattransfer in electronic apparatus.
Journal ArticleDOI

Air Resistance Coefficients for Perforated Plates in Free Convection

TL;DR: In this article, a measuring system for determining the resistance values for perforated plates in an air free convection path was designed, and the measuring system and resistance values were obtained by using the system.
Journal ArticleDOI

On the Cooling of Natural-air-cooled Electronic Equipment Casings : Proposal of a Practical Formula for Thermal Design

TL;DR: In this article, a simple formula for thermal designing of natural-air-cooled electronic equipment casings with standard arrangement of circuit boards and power supplies was presented, since it represents an air cooling system in its simplified form with due regard to such factors as the stack effect, air flow resistance, natural convective transfer and so on.
Proceedings ArticleDOI

A thermal design approach for natural air cooled electronic equipment casings

TL;DR: In this article, an attempt has been made to study the effects of the outlet vent area and power dissipation unit location on the natural air-cooled electronic equipment casings.
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