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Patent

Electroless nickel polyalloys

TLDR
In this article, a plated deposit in an electroless nickel plating bath containing an ester complex of a polyhydric acid or alcohol such as the diboron ester of glucoheptonic acid is described.
Abstract
Electroless, polymetallic nickel alloys containing an element of boron or phosphorus and one or more metals selected from tin, tungsten, molybdenum or copper which have unique properties and are produced as a plated deposit in an electroless nickel plating bath containing an ester complex of a polyhydric acid or alcohol such as the diboron ester of glucoheptonic acid.

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Patent

Semiconductor processing system and methods using capacitively coupled plasma

TL;DR: In this paper, a capacitively coupled plasma (CCP) unit is described inside a process chamber, and a pedestal is positioned below a gas reaction region into which the activated gas travels from the CCP unit.
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Semiconductor processing systems having multiple plasma configurations

TL;DR: In this paper, the authors describe a system that includes a first plasma unit fluidly coupled with a first access of the chamber and configured to deliver a first precursor into the chamber through the first access.
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Integrated electroless deposition system

TL;DR: In this paper, the authors describe a cluster tool configured to deposit a material onto a substrate surface by using one or more electroless, electrochemical plating, CVD and/or ALD processing chambers.
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Electroless deposition apparatus

TL;DR: In this paper, a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate is described.
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Magnetic recording medium

TL;DR: In this paper, the non-magnetic layer is a nickel-copper-phosphorus film containing 20 to 65 wt% of copper, which layer is formed by electroless plating.
References
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Patent

Metal finishing alloy of nickel-copperphosphorus

M Gulla
TL;DR: In this paper, a new METAL COATING is proposed, which is used as a PROTECTIVE and DECORATIVE finisher, which has UNUSUAL FUNCTIONAL PROPERTIES and to a METAL PLATING SOLUTION CAPABLE of DEPOSITING SAID COATING.