Patent
High density air cooled wafer package having improved thermal dissipation
TLDR
In this paper, a high density low profile air cooled wafer package including flip chip and embedded logic or memory islands was mounted within a heat dissipating cover, with pressure being applied to the interface by partially deflected electrical connectors secured there between.Abstract:
A high density low profile air cooled wafer package including flip chip and embedded logic or memory islands upon a wafer package mounted within a heat dissipating cover having improved thermal dissipation. Heat dissipation is achieved through a thermal grease interface provided between the wafer carrier and the heatsink cover, with pressure being applied to the interface by partially deflected electrical connectors secured there between.read more
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Patent
Attaching heat sinks directly to flip chips and ceramic chip carriers
TL;DR: In this article, an aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicon or flexible-epoxy adhesive, which is especially useful for flip chip attachment to flexible or rigid organic circuit boards or modules such as CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L.
Patent
Chip carrier modules with heat sinks attached by flexible-epoxy
TL;DR: In this paper, an aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance, which is useful for CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, single layer ceramic, and other chip carrier packages.
Patent
Heat sink clip assembly
TL;DR: A heat sink clip assembly for attaching a heat sink to a DIP or similar electronic device package has been described in this article, which includes a nonconductive attachment clip which extends between the leads on the underside of the DIP and means for latching the attachment clip to a heat-sink disposed adjacent the opposite side of the electronic devices package with the heat sink in intimate thermal contact with the device package.
Patent
Method for attaching heat sinks directly to chip carrier modules using flexible-epoxy
TL;DR: In this paper, an aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance, which is useful for CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, single layer ceramic, and other chip carrier packages.
Patent
Probe card cooling assembly with direct cooling of active electronic components
TL;DR: A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling as mentioned in this paper, which allows a coolant to enter the high-density package and directly cool the active electronic components of the dies during a testing operation.
References
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Patent
Liquid encapsulated air cooled module
TL;DR: In this paper, a plurality of heat generating components are mounted on a substrate which has a container attached thereto in sealed relationship such that the heat generating component are exposed to the inside of the container.
Patent
Improved thermally conductive and electrically insulative mounting systems for heat sinks
TL;DR: In this article, a two-part adhesive system for mounting heat sinks to power supply cases is presented, where a heat sink made of some suitable material such as aluminum is provided having holes or slots for mounting semiconductors thereon.
Patent
Arrangement for adhesively joining heat-dissipating circuit components to heat sinks and method of making them
TL;DR: In this paper, the switching element is glued inseparably to an intermediate layer consisting of cleavable material, such that a moderate impact on the mounting plate of the element in parallel to the surface of the heat sink is sufficient to cause an exact cleavage.