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Proceedings ArticleDOI

Ic defects-based testability analysis

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TLDR
Simulation results with a new cell library demonstrate that physical design improvements can significantly enhance the circuit’s qualit,y and testability.
Abstract
High quality IC design involves not only performance and silicon area, but also testability. Product quality, measured by low dejects levels (as low as 100 p.p.m.), requires that test patterns must detect nearly all circuit faults caused by likely physical defects. This requires a careful examination of the testability of the physical design, and its enhancement. The purpose of this contribution is to present a methodology for physical testability evaluation, and to demonstrate its usefulness. The methodology allows realistic fault extraction and classification, and the identification of hard to detect faults, their layout location and physical origin, prior to simulation. Measures of physical testability and fault hardness are introduced. When possible, suggestions for design improvement by layout reconfiguration, are provided, as a better solution than simple test improvement, either by test pattern refinement, or by using more sophisticated detection techniques, like current testing. Simulation results, with several design examples, show that layout styles exhibit characteristic pat.terns, in terms of t,he incidence of faults caused by the different, physical defects. Hence, for each layout style, the sensivity of physical designs to each physical defect can be analysed and decreased. Moreover, simulation results with a new cell library demonstrate that physical design improvements can significantly enhance the circuit’s qualit,y and testability.

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Citations
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Proceedings ArticleDOI

The concept of resistance interval: a new parametric model for realistic resistive bridging fault

TL;DR: A new parametric bridging fault model is proposed allowing to realistically represent the faulty behavior according to the intrinsic resistance which is not known a priori.
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Resistive bridge fault modeling, simulation and test generation

TL;DR: In this article, the authors developed a model of resistive bridging faults and studied the fault coverage on ISCAS85 circuits of different test sets using resistive and zero-ohm bridges at different supply voltages.
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Automatic fault extraction and simulation of layout realistic faults for integrated analogue circuits

TL;DR: A comprehensive tool has been implemented for the comparison of different test preparation techniques and target faults consisting of the realistic fault characterisation program LIFT that can extract sets of various faults from a given analogue or mixed-signal circuit layout.
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CMOS bridging fault modeling

TL;DR: A general electrical model which can be used to determine if a particular structure of transistors gives an intermediate voltage which is higher or lower than a given threshold voltage is proposed and a global procedure to simulate bridging fault is given.
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Defect-oriented vs schematic-level based fault simulation for mixed-signal ICs

TL;DR: This paper evaluates and compares two fault list generation approaches and the implications on test optimization and Fault lists derived from both Inductive Fault Analysis and a transistor fault-model are compared for a testability analysis on a self-test function for a high-performance switched-current design.
References
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Fault modeling and logic simulation of CMOS and MOS integrated circuits

TL;DR: This paper provides a methodology for creating simulator models for tri-state and other dynamic circuit elements that provide for both classical and stuck-open/stuck-on faults, and can be adopted for use on essentially any general purpose logic simulator.
Journal ArticleDOI

Inductive Fault Analysis of MOS Integrated Circuits

TL;DR: Given the layout of an IC, a fault model and a ranked fault list can be automatically generated which take into account the technology, layout, and process characteristics.
Journal ArticleDOI

Physical Versus Logical Fault Models MOS LSI Circuits: Impact on Their Testability

TL;DR: At the end of an IC production line, integrated circuits are generally submitted to three kinds of tests: 1) parametric tests to check electrical characteristics (voltage, current, power consumption), 2) dynamic tests to Check response times under nominal operating conditions, and 3) functional tests toCheck its logical behavior.
Proceedings ArticleDOI

Realistic Fault Modeling for VLSI Testing

TL;DR: It will be demonstrated that inadequate insight into the physics of processing defects and the manufacturing process may lead to inefficient testing of actual VLSI circuits.