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Patent

Method and apparatus for plating composite

TLDR
In this article, a method and apparatus for improving the integrity of metal plated composites is described, which is achieved by first irradiating a nickel plated substrate, prior to application of a noble metal plating layer, to smooth any surface discontinuities or irregularities.
Abstract
A method and apparatus for improving the integrity of metal plated composites is disclosed. Plating improvements are achieved by first irradiating a nickel plated substrate, prior to application of a noble metal plating layer, to smooth any surface discontinuities or irregularities. Excimer laser pulses, having a duration of less than 100 nanoseconds, are employed to partially liquefy the upper surface of the nickel plating on the substrate. This invention is compatible with conventional plating processes, such as electroplating.

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Laser polishing of medical devices

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Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards

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Method for smoothing and polishing surfaces by treating them with energetic radiation

TL;DR: In this article, the authors proposed a method for smoothing and polishing surfaces by treating them with energetic radiation, especially laser radiation. And they provided a fast, inexpensive and automated method for polishing any three-dimensional surfaces.
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Microstructured tool and method of making same using laser ablation

TL;DR: In this paper, a micro-structured tool has been proposed for optical applications using laser ablation, where the base layer is made from an aromatic acrylate polymer that is a reaction product of an oligomer and a radiation curable diluent.
References
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Patent

Surface melting of a substrate prior to plating

TL;DR: In this article, the surface roughness characteristics are obtained by shorter-duration melting, typically by means of a pulsed YAG laser, and this technique has shown improved resistance to sulfur and chlorine corrosive atmospheres.
Patent

Planarization of metal films for multilevel interconnects by pulsed laser heating

TL;DR: In this article, a planarization of each metal layer eliminates irregular and discontinuous conditions between successive layers, which is useful for the fabrication of VLSI circuits, particularly for wafer-scale integration.
Patent

Automated system for laser mask definition for laser enhanced and conventional plating and etching

TL;DR: In this article, the authors describe a continuous electrochemical processing system with a sheet of material to be treated electrochemically passed from a supply roller to a plating bath and out over an exit roller with the plating system under automatic control.