Patent
Method for forming a flip-chip bond from a gold-tin eutectic
TLDR
In this article, a flip-chip-based method was proposed to flipchip an integrated circuit die to a substrate and a gold-tin eutectic bond was formed between the die and the conductive bonding areas of the substrate.Abstract:
A method for flip-chip bonding an integrated circuit die to a substrate. A substrate (21) having conductive bonding areas (22) coated with tin (23) is secured to a bottom end effector of a flip-chip bonding apparatus. An integrated circuit die (26) having gold bumps (28) is secured to a die tool of the flip-chip bonding apparatus. A gold-tin eutectic bond is formed between the integrated circuit die (26) and the conductive bonding areas (22) of the substrate (21).read more
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Patent
Integral copper column with solder bump flip chip
Chris M. Schreiber,Bao Le +1 more
TL;DR: In this article, an integral copper column with a solder bump flip chip is presented, where a thin layer of barrier metallization is provided over the contact pads, and a support substrate is provided having a circuit layer with raised features including copper traces.
Patent
Semiconductor device and its manufacturing method
TL;DR: In this paper, a disclosed COC type semiconductor device, a bump electrode (21) of a second semiconductor chip (2) is joined to a first semiconductor chips (1) having a bump electrodes (11) formed thereon, where the bump electrodes are both made of first metal such as Au having a relatively high melting point, while a joining portion of these bump electrodes is formed of an alloy layer of the first metal and second metal, which second metal is made of such a material that can melt at a lower temperature than the melting point of the one
Patent
Flip chip interconnection structure
TL;DR: A flip-chip interconnection structure is formed by mechanically interlocking joining surfaces of a first and second element as mentioned in this paper, which includes a soft, deformable material with a low yield strength and high elongation to failure.
Patent
Metallic microstructure springs and method of making same
TL;DR: In this article, a spring suitable for use in interposers such as those used to electrically interconnect electronic devices such as integrated circuits and printed wiring boards was presented. But the spring was not suitable for the use in the Internet.
Patent
Package for power semiconductor chips
TL;DR: In this article, an electronic packaging module for bonding power semiconductor devices is produced, where the semiconductor device is mounted on a base, and enclosed by a frame and lid, which is an insulating substrate with protuberances on the conductive pattern of the substrate.
References
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Patent
Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
Nakao Takashi,Yoshiaki Emoto,Koichiro Sekiguchi,Masayuki Iketani,Kunizo Sahara,Ikuo Yoshida,Akiomi Kohno,Masaya Horino,Hideaki Kamohara,Shouichi Irie,Hiroshi Akasaki,Kanji Otsuka +11 more
TL;DR: In this article, a technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, is described.
Patent
Method for forming a bump electrode for a semiconductor device
TL;DR: In this paper, a bump electrode structure of a semiconductor device comprises an electrode pad consisting of an aluminum alloy, an insulating oxide layer covering only the peripheral edge portion of the electrode pad, an under-bump layer formed of an alloy of titanium and tungsten, and a gold bump electrode formed of gold.
Patent
Semiconductor transducer packaged assembly
TL;DR: A semiconductor transducer chip is flip-chip bonded to a semiconductor interface chip, which is mounted on the ceramic package as discussed by the authors, to minimize the thermal coupling between the package and the transducers.
Patent
Bonding sheet for electronic component and method of bonding electronic component using the same
Thunekazu C,O Patent Division Yoshino,Hiroshi C,O Patent Division Morita,Hirotaka C,O Patent Division Nakano,Nobuo c,o Patent Division Hayashi,Yuko c,o Patent Division Kubota +9 more
TL;DR: In this article, a low-melting point bonding metal is interposed between a conductor pattern of a substrate and electrode terminals of an electronic component, and is bonded by thermocompression at a low temperature.
Patent
Bump structure for reflow bonding of IC devices
TL;DR: In this article, the fingers of a copper tape are reflow soldered to metal bumps located on the semiconductor device and the copper assembly tape is lightly pressed against the bumps by means of a thermode, which is quickly heated to a temperature well above the gold-tin eutectic melting temperature.