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MOS device structure and method for reducing PN junction leakage

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TLDR
To reduce p-n junction leakage at the boundary between lightly doped wells formed in lightly-doped bulk materials, a high concentration region is implanted at the junction as mentioned in this paper, which contains a relatively high dopant level.
Abstract
To reduce p-n junction leakage at the boundary between lightly doped wells formed in lightly doped bulk materials, a high concentration region is implanted at the junction. The high concentration region contains a relatively high dopant level, and thus reduces the width of the depletion region at the junction. The reduced width of the depletion region in turn reduces junction leakage.

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Method for engineering the threshold voltage of a device using buried wells

TL;DR: In this paper, the dopant concentration distribution of the buried platform wells is used to change the threshold voltage of the platform transistors of the invention by introducing a tail-dopant concentration into the active region of the transistors.
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Method for introducing an equivalent RC circuit in a MOS device using resistive wells

TL;DR: In this article, a method for providing low power MOS devices that include buried wells specifically designed to provide a resistive path between the bulk material of the device and a well tie contact was proposed.
References
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An integrated semiconductor device having a buried semiconductor layer and fabrication method thereof

TL;DR: In this article, a well is formed in the semiconductor substrate within windows of a field oxide layer, and a lightly-doped semiconductor layer is selectively formed on the exposed surface of the well.