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Nonvolatile memory device and method of manufacturing the same

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TLDR
In this article, the memory cells are arranged at intersection points of a plurality of first metal wirings extending along a first direction with a second metal wire length orthogonal to the first direction, and voids are formed in the interlayer film provided between the adjacent memory elements.
Abstract
Provided is a nonvolatile memory device including a phase-change memory configured with cross-point memory cells in which memory elements formed of a phase-change material and selection elements formed with a diode are combined. A memory cell is configured with a memory element formed of a phase-change material and a selection element formed with a diode having a stacked structure of a first polycrystalline silicon film, a second polycrystalline silicon film, and a third polycrystalline silicon film. The memory cells are arranged at intersection points of a plurality of first metal wirings extending along a first direction with a plurality of third metal wirings extending along a second direction orthogonal to the first direction. An interlayer film is formed between adjacent selection elements and between adjacent memory elements, and voids are formed in the interlayer film provided between the adjacent memory elements.

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Semiconductor device, and manufacturing method of the same

TL;DR: In this paper, a semiconductor chip is mounted on a lead frame with a bonding layer 13 between them, and they are sealed with a sealing resin 14. The lead frame has a base member consisting of Cu and an oxide film 11b essentially consisting of an oxide of the base member 11a formed on the base members and having a thickness of about 50 nm or below.
Patent

Cross-point memory and methods for fabrication of same

TL;DR: In this article, a cross-point memory array includes a plurality of variable resistance memory cell pillars, separated by a partially filled gap that includes a buried void, and storage material elements that are at least partially interposed by the buried void.
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Device switching using layered device structure

Sung Hyun Jo, +1 more
TL;DR: In this article, a resistive switching device with buffer material is defined, where the buffer material provides a blocking region between the switching material and the first electrode so that the blocking region is substantially free from metal particles from the second metal material when a first voltage is applied to the second electrode.
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Conductive path in switching material in a resistive random access memory device and control

Sung Hyun Jo
TL;DR: In this paper, a nonvolatile memory (NVM) was proposed, which consists of a first electrode, a second electrode, and a resistive switching material comprising an amorphous silicon material overlying the first electrode and a thickness of dielectric material having a thickness ranging from 5 nm to 10 nm disposed between the second electrode and the resistive layer.
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Switching device having a non-linear element

Wei Lu, +1 more
TL;DR: In this paper, a switching device is configured to change from a first resistance state to a second resistance state on application of a voltage greater than a threshold, and a nonlinear element is disposed between the first and second electrodes and electrically coupled in series to the first electrode and switching medium.
References
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Patent

Resistance change memory device

TL;DR: A resistance change memory device as discussed by the authors is a memory cell array with memory cells arranged therein, the memory cell having a variable resistance element for storing a rewritable resistance value; a reference cell formed of the same memory cells as those set in a high resistance state in the array, the reference cell being trimmed with selection of the number of parallel-connected memory cells to have a reference current value used for detecting data in the memory cells array.
Patent

Self-aligned, programmable phase change memory

TL;DR: A self-aligned, nonvolatile memory structure based upon phase change materials, including chalcogenides, can be made with a very small area on an integrated circuit as mentioned in this paper.
Patent

Modified contact for programmable devices

TL;DR: In this paper, an aspect is provided such that an opening is formed through a dielectric exposing a contact formed on a substrate, which is modified by implanting ions into the contact, depositing a material on the contact and treating the contact with plasma.
Patent

Semiconductor memory device

TL;DR: In this article, a command analyzer 160 determines whether or not a first write command after power-on is issued and a new block reserve determinator 170 determines that a new physical block is reserved.
Patent

Semiconductor memory cell and method of forming same

TL;DR: In this article, a semiconductor memory cell and forming method thereof utilizes a vertical select transistor to eliminate the problem of a large cell surface area in memory cells of the related art utilizing phase changes.