Patent
Packaged electronic circuit
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The article was published on 1954-01-18. It has received 18 citations till now. The article focuses on the topics: Electronic circuit.read more
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Patent
Three-dimensional circuit component assembly and method corresponding thereto
TL;DR: In this article, a plurality of plate-like circuit component carrier packages having the same size and shape are stacked adjacent one to another with the flat faces thereof in contact to form a carrier package assembly in the form of a prismatic or cylindrically solid.
Patent
Electronic module using flexible printed circuit board with heat sink means
TL;DR: In this article, flatpack integrated circuits are attached to the board oriented with their covers toward and their heat sink base portions away from the board, by placing all flatpacks on one side of the flexible board structure and looping the structure back on itself, a high circuit component density can be achieved with the heat sink portions of flatpacks exposed exteriorly of the loops of the structure facilitating placing the flatpacks in heat conducting contact with a casing.
Patent
Flexible elongate member having one or more electrical contacts
TL;DR: A flexible elongate member such as a pressure guide wire (1000) includes an electrical device such as pressure sensor (1002), which is electrically connected to conductive bands located on electrical connector (300).
Patent
Portable memory module
TL;DR: In this article, a portable memory module was constructed in a compact cylindrical form facilitating its use in oceanographic and environmental data acquisition environments, where individual integrated circuit memory components were carried and interconnected by a flexible printed circuit.
Patent
Electrical circuit package
TL;DR: In this paper, an electrical circuit package is disclosed that provides an electrically insulating protection cover for an integral circuit board assembly, which includes a flexible dielectric substrate 10 and one or more electrically conductive paths.
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Manufacture of electric circuit components
TL;DR: In this paper, the authors describe a method to facilitate and cheapen quantity production of electric circuit components, such as the resistances, and their purpose is to facilitate the manufacture of electric and magnetic circuits.