Proceedings ArticleDOI
PIR security sensors: developing the next generation
Kevin C. Liddiard
- Vol. 6542, pp 629-637
Reads0
Chats0
TLDR
It will be reasoned that three competing technologies have the potential to be successful in the short term: silicon resistance and diode microbolometers (two options of the former), and an update will be given on the development at Electro-optic Sensor Design of amorphous silicon microbolometer security sensor technology employing non-evacuated packaging and plastic optics.Abstract:
Passive infrared (PIR) security sensors employ decades old pyroelectric technology for short range detection. This
ubiquitous technology serves a major market which receives little attention in the international IR forum. It is, however,
a market ripe for exploitation using modern IR sensor technology.
In this paper a review will be made of various IR technologies, as applied to this application. It will be reasoned that
three competing technologies have the potential to be successful in the short term: silicon resistance and diode
microbolometers (two options of the former). An update will also be given on the development at Electro-optic Sensor
Design (EOSD) of amorphous silicon microbolometer security sensor technology employing non-evacuated packaging
and plastic optics.
Establishment of a new generation PIR security sensor technology also paves the way for high performance low cost IR
sensors for numerous short range applications.read more
Citations
More filters
Journal ArticleDOI
Non-Imaging Digital CMOS-SOI-MEMS Uncooled Passive Infra-Red Sensing Systems
Tanya Blank,Igor Brouk,Sharon Bar-Lev,Gavriel Amar,Elie Meimoun,Shlomi Bouscher,Maxim Meltsin,Michele Vaiana,Amedeo Maierna,Maria Eloisa Castagna,Giuseppe Bruno,Yael Nemirovsky +11 more
TL;DR: In this article, a non-imaging digital passive infrared-red (PIR) sensing system using a CMOS-SOI-MEMS transistor as the thermal sensor is presented.
Journal ArticleDOI
Modeling the Performance of Mosaic Uncooled Passive IR Sensors in CMOS–SOI Technology
TL;DR: The overall figures of merit of these sensors indicate why they are most suitable for consumer electronics, including smart homes, wearables, Internet of Things as well as mobile applications.
Proceedings ArticleDOI
Application of mosaic pixel microbolometer technology to very high-performance, low-cost thermography and pedestrian detection
TL;DR: In this article, the authors discuss low cost thermography and non-imaging cheap sensors for pedestrian detection and other applications, and discuss development of miniaturised IR sensors, as initially conceived for mosaic pixel technology.
Proceedings ArticleDOI
Further applications for mosaic pixel FPA technology
TL;DR: In this paper, the development of novel technology for next generation PIR security sensors has been described and two specific applications are highlighted: high performance imaging IRFPA design and forest fire detection.
Proceedings ArticleDOI
Next-generation PIR security sensors: concept testing and evaluation
TL;DR: The results of new laboratory and field tests of a laboratory prototype sensor are reported and extrapolates these results to performance of production sensors, and results are presented for NETD, detection range for human targets and detection of simulated electrical faults and developing fires.
References
More filters
Journal ArticleDOI
A brief guide to pyroelectric detectors
TL;DR: The principles of operation of a pyroelectric detector are summarized and responsivity, noise, noise equivalent power and detectivity are derived in this paper, where the relationship between responsivity and frequency is discussed as are the various sources of noise.
Proceedings ArticleDOI
MOEMS development of infrared security sensors
TL;DR: In this article, the development of a new generation of passive infrared (PIR) security sensors for the high volume military, industrial and consumer markets is discussed, including the mosaic pixel focal plane array concept (MP-FPA), which enables enhanced sensor performance to be achieved with low cost optics and cheap packaging.