Patent
Power semiconductor switching apparatus with heat sinks
Masaru Ishizuka,Yasuyuki Yokono,Asako Matsuura,Yoshio Kamei,Hiromichi Ohashi,Mitsuhiko Kitagawa,Tomiya Sasaki,Shigeki Monma +7 more
TLDR
A semiconductor switching apparatus includes a member for radiating heat generated from semiconductor switches and for reducing a thermal stress as mentioned in this paper, and the lengths of gate electrode wires are equally set.Abstract:
A semiconductor switching apparatus includes a member for radiating heat generated from semiconductor switching element chips and for reducing a thermal stress. The lengths of gate electrode wires are equally set. The semiconductor switching apparatus has a large capacity and good switching characteristics.read more
Citations
More filters
Patent
Cooling system for integrated circuits
Robert J. Hastings,Carl E. Davis +1 more
TL;DR: A cooling member for an integrated circuit, the member having a recess therein for receiving the integrated circuit and contacting a portion of exterior surfaces of the integrated circuits, including a metal heat sink, is defined in this article.
Patent
Controlled-turn-off high-power semiconductor component
TL;DR: In this paper, a large-area controlled-turn-off high-power semiconductor component containing a multiplicity of finely-structured individual components is formed by a small-area semiconductor chips which are accommodated alongside one another in a common housing and connected in parallel.
Patent
Advanced and integrated cooling for press-packages
Richard S. Zhang,Richard Alfred Beaupre,Ramakrishna Venkata Mallina,Arun Virupaksha Gowda,Le Yan,Ljubisa Dragoljub Stevanovic,Peter Morley,Stephen A. Solovitz +7 more
TL;DR: In this article, a heat sink for cooling at least one electronic device package is provided, where the electronic device packages have an upper contact surface and a lower contact surface, and the heat sink comprises a thermally conductive material and defines multiple inlet manifolds configured to receive a coolant, multiple outlet manifold configured to exhaust the coolant.
Patent
Heat sink and cooling and packaging stack for press-packages
Satish Sivarama Gunturi,Mahadevan Balasubramaniam,Ramakrishna Venkata Mallina,Richard Alfred Beaupre,Le Yan,Richard S. Zhang,Ljubisa Dragoljub Stevanovic,Adam Gregory Pautsch,Stephen A. Solovitz +8 more
TL;DR: In this paper, a heat sink for directly cooling at least one electronic device package is provided, which consists of a cooling piece formed of thermally conductive material, such that the heat sink comprises an integral heat sink.
Patent
Semiconducting device with radiation structure has connecting components between first and second radiating components and chip with better conductivity than tungsten and molybdenum
Kuniaki Mamitsu,Yasuyoshi Hirai,Kazuhito Nomura,Yutaka Fukuda,Kazuo Kajimoto,Takeshi Miyajima,Tomoatsu Makino,Yoshimi Nakase +7 more
TL;DR: In this paper, a semiconducting chip (1a, 1b) and first and second radiating parts (2, 3) are thermally and electrically connected to it to carry away heat from it via radiating surfaces.
References
More filters
Patent
Mounting structure of disc form thyristor
Hideaki Rokutan,Jinichi Toyama +1 more
TL;DR: In this paper, the authors propose to finish at least one of the side edges of a pair of fins holding the side face of a disc-form thyristor to a flat plate, and bonding and fixing a heat conducting plate to this face via heat conductive resin.