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SAW-MEMS (surface acoustic waves-micro electro mechanical system) acceleration sensor and manufacturing method thereof

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TLDR
In this article, an SAW-MEMS (surface acoustic waves-micro electro mechanical system) acceleration sensor which relates to the field of microelectronic inertial components is presented.
Abstract
The invention discloses an SAW-MEMS (surface acoustic waves-micro electro mechanical system) acceleration sensor which relates to the field of microelectronic inertial components. The acceleration sensor comprises an SAW metal interdigital transducer, a quartz plate and a silicon substrate, wherein the quartz plate is provided with a micro cantilever, and the silicon substrate is provided with a preset groove; the SAW metal interdigital transducer is manufactured on the micro cantilever in the quartz plate; the micro cantilever is bonded on the silicon substrate provided with the preset groove; the quartz plate is thinned through bonding with another silicon substrate without groove firstly, then transferred to the silicon substrate provided with the preset groove by using a bonding process; the SAW metal interdigital transducer is manufactured on the part, corresponding to the preset groove, of the quartz plate; and the micro cantilever structure is etched on the quartz plate, so that the SAW metal interdigital transducer is arranged on the micro cantilever. Because the acceleration sensor disclosed by the invention is prepared by using an MEMS process, the acceleration sensor is small in component size and suitable for mass production, therefore, the acceleration sensor provided by the invention is high in reliability, large in sensitive range, low in power consumption, high in precision, small in size and easy to package.

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Citations
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References
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Manufacturing method of cavity-type film bulk acoustic resonator (FBAR)

TL;DR: In this article, the authors proposed a cavity-type film bulk acoustic resonator (FBAR) consisting of a silicon on insulator (SOI) substrate with a cavity and a piezoelectric thin film transducer arranged on the substrate.
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Process of forming and controlling rough interfaces

TL;DR: In this paper, a process for forming a semiconductor component with a buried rough interface is described, where the formation of a rough interface of predetermined roughness R 2 in a first semiconductor substrate is described.
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TL;DR: In this paper, an SAW-MEMES (surface acoustic wave micro-electromechanical system) acceleration sensor is described, which is suitable for batch production and has small-sized device.
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TL;DR: In this article, a beam 11 and supporting member 13 are formed out of a sheet of plate material and extended in a manner to surround the periphery of the beam 11, which is supported in cantilever by a fixing part 13A.
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