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Journal ArticleDOI

Underpotential deposition of copper and silver on polycrystalline ruthenium electrodes

C. Nguyen Van Huong, +1 more
- 08 Apr 1988 - 
- Vol. 244, pp 249-259
TLDR
In this article, the electrodeposition of copper and silver on polycrystalline ruthenium was studied by the potentiodynamic method, in aqueous and aprotic media (propylene carbonate).
About
This article is published in Journal of Electroanalytical Chemistry.The article was published on 1988-04-08. It has received 27 citations till now. The article focuses on the topics: Underpotential deposition & Monolayer.

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Citations
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Journal ArticleDOI

Determination of the platinum and ruthenium surface areas in platinum-ruthenium alloy electrocatalysts by underpotential deposition of copper. I. Unsupported catalysts

TL;DR: In this article, the potential deposition of copper has been used to characterize platinum, ruthenium, and platinum−ruthensium high-surface-area unsupported (powder black) electrocatalysts.
Journal ArticleDOI

Pt–Ru electrocatalysts for fuel cells: a representative review

TL;DR: In this article, the main idea of the review is to balance various aspects of Pt-Ru electrochemistry related to material science and electrocatalysis as well as to remember the early basic results being of importance for future understanding of Pt−Ru functional properties.
Journal ArticleDOI

Electrodeposition of Copper Thin Film on Ruthenium A Potential Diffusion Barrier for Cu Interconnects

TL;DR: In this article, the electrochemical deposition of copper (Cu) thin film on polycrystalline ruthenium (Ru) electrode surface was investigated in a sulfuric acid plating bath.
Journal ArticleDOI

Seedless superfill: Copper electrodeposition in trenches with ruthenium barriers

TL;DR: In this article, a single-step deposition of fine trenches by direct copper electrodeposition onto a ruthenium banier was demonstrated, where the ruthensium layer, as well as an adhesion promoting titanium or tantalum layer, was deposited by physical vapor deposition onto patterned silicon dioxide.
Journal ArticleDOI

Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing

TL;DR: In this paper, the authors show that the Cu nucleation and growth mode is sensitive to the oxidation state of the Ru surface as well as the copper deposition parameters, and that early film coalescence is favored by deposition at high (η -0.25 V) overpotentials.
References
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Book

Constitution of Binary Alloys

Max Hansen, +1 more
Journal ArticleDOI

Electrocatalysis by ad-atoms: Part II. Enhancement of the oxidation of methanol on platinum by ruthenium ad-atoms

TL;DR: The ad-electrode has the same electrocatalytic characteristics as the alloy electrode for the oxidation of methanol on the Ru-Pt catalyst system as discussed by the authors.
Journal ArticleDOI

Work function, electronegativity, and electrochemical behaviour of metals

TL;DR: In this article, it was shown that the best relationship between the two above quantities is expressed by the equations: E z =−4.61 −0.40 α, where α=(2.10−x M )/0.6 is defined as the degree of orientation of water at the interface.
Journal ArticleDOI

Underpotential deposition of metals and work function differences

TL;DR: In this article, the potential difference between monolayer and bulk deposition is closely related to the difference in the work functions of substrate and deposit, causing a partial charge of the adatoms.
Journal ArticleDOI

Electrocatalysis by ad-atoms

TL;DR: In this paper, the surface composition of Au-Pt and Au-pd alloy electrodes has been investigated for methanol oxidation and the results indicate that surface composition plays predominant roles in the methenol oxidation.
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