Patent
Use of a heat pipe integrated with the IC package for improving thermal performance
TLDR
In this article, a CERDIP housing is provided with a heat pipe that passes through the closure seal lid whereby the heat pipe terminates within the housing cavity at the hot end thereof.Abstract:
A CERDIP housing is provided with a heat pipe that passes through the closure seal lid whereby the heat pipe terminates within the housing cavity at the hot end thereof. A quantity of working fluid, such as fluorinated octane, is contained within the package cavity. The heat pipe communicates with cooling fins that produce a cold end thereof. Heat from the semiconductor device inside the housing boils the working fluid and is cooled thereby. The fluid vapor passes along the heat pipe and is condensed at the cold end to be converted back to liquid. As a result the semiconductor device is in direct communication with the heat pipe working fluid.read more
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Patent
Integrating remotely-hosted and locally rendered content on a gaming device
TL;DR: In this paper, a wager gaming machine is configured to provide wagering games, but also communicate with one or more hosts that can provide information and/or services pertaining to local wager games events, including but not limited to local tournaments, local restaurants, local messages (e.g., messages from other players in the gaming establishment), local social events, local sporting events, and local dating opportunities.
Patent
Methods and systems for interfacing with a third-party application
Reid M. Weber,William C. Little,Steven G. Lemay,Adrian R. Marcu,Warner R. Cockerille,Nicole M. Beaulieu,David A. Gipp,Daniel de Waal,Vincent S. Manfredi,Bryan Bullard,Cara L. Iddings,Richard J. Schneider,Glen Keith Russell,Jacob Graham,Gregory A. Schlottmann,Richard E. Rowe,David C. Williams,Kurt M. Larsen,Jae Man Yi,Erik B. Petersen,Higgins Kevin,Gregory H. Parrott,David L. Salls +22 more
TL;DR: In this paper, a system for interfacing with a third-party application is described, which includes a third party device, a server-based system configured to communicate with the thirdparty device, and a gaming device configured to display content of the product or service.
Patent
Distributed side wagering methods and systems
Dwayne A. Davis,Christiaan R. Champagne,Damien C. Ennis,Michael P. Khamis,David N. Myers,David M. Palmer,Richard E. Rowe,Richard J. Schneider,Darryll Pleasant +8 more
TL;DR: In this article, various techniques are disclosed for facilitating side wagering activities conducted at a casino which includes a casino gaming network in at least one embodiment, the gaming network includes a plurality of gaming devices, including a first gaming device.
Patent
Method and apparatus for integrating remotely-hosted and locally rendered content on a gaming device
Steven G. Lemay,Nicole M. Beaulieu,David A. Gipp,William C. Little,Daniel de Waal,Vincent S. Manfredi,Bryan Bullard,Cara L. Iddings,Richard J. Schneider,Keith Russell +9 more
TL;DR: In this article, a host-controlled process that is authenticated by a gaming machine and executed in a secure memory location such that it is isolated from other processes executing on the gaming machine is utilized.
Patent
Gaming device having a three dimensional display device
TL;DR: In this paper, a wagering gaming device having a three-dimensional display device which includes a plurality display screens is described. The display screens display three dimensional images having an height, actual width and depth.
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Patent
Cooling module for integrated circuit chips
Minoru Yamada,Akira Masaki,Masakazu Yamamoto,Keiichirou Nakanishi,Takashi Nishida,Takahiro Daikoku,Fumiyuki Kobayashi,Imai Kuninori +7 more
TL;DR: In this article, a cooling module for integrated circuit chips is described, which is characterized by cooling members through which a coolant circulates, and which are connected directly, or via insulating plates, to a plurality of integrated circuits mounted on a wiring substrate, and pipes which introduce the coolant into the cooling members.
Patent
Heat pipe heat sink for semiconductor devices
Takashi Murase,Tatsuya Koizumi +1 more
TL;DR: In this article, a heat pipe heat sink for air cooling of semiconductor devices characterized by arranging heat pipes in a zigzag form toward the direction of air flow around the fin section in the heat sinks is presented.
Patent
Power module with isolated substrates cooled by integral heat-energy-removal means
TL;DR: In this article, the evaporating area of a heat pipe or thermosiphon evaporator is used as the thermal sink for one face of an electrically isolated substrate upon the opposite face of which are mounted and interconnected one or more power semiconductors and other components requiring cooling.
Patent
Cooling apparatus for flat semiconductors using one or more heat pipes
TL;DR: An improved cooling apparatus for flat semiconductors in which the semiconductor is held between two base members each having one or more heat pipes inserted in holes formed therein is described in this paper, where the vaporized working fluid in the heat pipe from the end inserted into the base member to other end is condense the vapor, which in liquid form then returns by capillary action through a wick.
Patent
Heat transferring apparatus
TL;DR: In this paper, a heat transferring or transmitting apparatus characterized by an evaporator containing a semiconductive or heat generating device and connected by two conduits substantially vertically arranged therebetween, such that a coolant gas is passed upwardly through one of the conduits and a liquid is passed downwardly through the other one, features a resistant element, which may be in the form of a liquid reservoir, disposed in the coolant liquid passage so as to prevent flowing of the cooledant gas into and through the liquid passage.