Patent
Heat pipe heat sink for semiconductor devices
Takashi Murase,Tatsuya Koizumi +1 more
TLDR
In this article, a heat pipe heat sink for air cooling of semiconductor devices characterized by arranging heat pipes in a zigzag form toward the direction of air flow around the fin section in the heat sinks is presented.Abstract:
A heat pipe heat sink for air cooling of semiconductor devices characterized by arranging heat pipes in a zigzag form toward the direction of air flow around the fin section in the heat sinks. A block for mounting the semiconductor device is fitted to the heat-in sections of the plural heat pipes arranged in parallel, and a large number of radiating fins crossing over the heat pipes are fitted to the heat-out sections of the heat pipes protruding from the block.read more
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Patent
Electroosmotic microchannel cooling system
Kenneth E. Goodson,Chuan-Hua Chen,David E. Huber,Linan Jiang,Thomas W. Kenny,Jae-Mo Koo,Daniel J. Laser,James C. Mikkelsen,Juan G. Santiago,Evelyn N. Wang,Shulin Zeng,Lian Zhang +11 more
TL;DR: In this article, the authors describe an electroosmotic pump that is capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as associated reduction in reliability.
Patent
Use of a heat pipe integrated with the IC package for improving thermal performance
TL;DR: In this article, a CERDIP housing is provided with a heat pipe that passes through the closure seal lid whereby the heat pipe terminates within the housing cavity at the hot end thereof.
Patent
Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
TL;DR: In this paper, a high speed, high density VLSI module within a limited space and in a single assembly that attaches, aligns, and manages electromagnetic interference and heat dissipation of the module is presented.
Patent
Power conditioning module
TL;DR: In this article, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit devices, including a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface.
Patent
Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
TL;DR: In this article, the authors propose a field replaceable unit (FRU) for heat sinks and semiconductor components that adequately dissipates heat from semiconductor component without damaging or bending the electrical grid terminals and without imposing mechanical stress on the SVC component.
References
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Patent
Heat pipe cooled capacitor
Corman James C,Kelly Peter E +1 more
TL;DR: In this article, a capacitor in which the electrodes are in the form of elongated conductive sheets separated by elongated dielectric sheets and wound in a compact convolute or roll form with exposed electrodes at each roll edge, heat dissipation is augmented by a chill plate in contact with one of the exposed sheet electrodes at a roll edge and by a plurality of heat pipes connected to the chill plate.
Patent
Drill steel idler guide
TL;DR: In this paper, a drill steel idler guide with an internal sleeve rotatably supported in a base by means of ball bearings fitting in opposed annular grooves in the sleeve and base is described.
Patent
Thermosiphonntype heat exchanger
TL;DR: In this paper, the authors proposed a method to eliminate the imbalance in the operation of thermosiphon pipes by a method wherein blocks are formed by the groups of thermophon pipes and each block is made to function as one unit in a large-sized heat exchanger.