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Patent

Voltage controlled oscillator module with ball grid array resonator

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TLDR
In this article, a voltage controlled oscillator (VCO) assembly and module incorporating a ball grid array resonator as part of the tank circuit of the VCO is described.
Abstract
A voltage controlled oscillator (VCO) assembly and module incorporating a ball grid array resonator as part of the tank circuit of the voltage controlled oscillator. The VCO module preferably incorporates at least an oscillator circuit, the tank circuit, and an output buffer stage circuit all defined by a plurality of interconnected electrical/electronic components including the ball grid array resonator which are mounted to a printed circuit board. In another embodiment, the oscillator assembly also includes a phase-locked loop circuit defined at least in part by an integrated circuit mounted to the printed circuit board.

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Citations
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References
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Patent

Circuit structure including a passive element formed within a grid array substrate and method for making the same

TL;DR: In this paper, a circuit structure combines an integrated circuit with a passive circuit element formed within a grid-array substrate, which is used for packaging of integrated circuits, and a low-loss substrate may be mounted onto the grid array substrate, and laterally displaced from the integrated circuit such that the lateral extent of the low loss substrate overlaps that of the passive element element.
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TL;DR: In this article, a dielectric resonator antenna has a main surface and a conducting layer formed on the main surface of the D resonator and a side surface is not on the same plane of the main plane.
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TL;DR: In this paper, an integrated circuit package consisting of at least one substrate, each substrate including at least 1 layer, one semiconductor die, one terminal, and an antenna is presented.
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TL;DR: In this paper, a single bandpass ceramic filter is coupled with a multi-band filter for combining and sorting by frequency two or more signals into a composite signal or from the latter.
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TL;DR: In this paper, an organic device that can be integrated in a multilayer board made of organic material is presented. And the passive devices can be integrally fabricated on a circuit board in either surface mount device (SMD) or ball grid array (BGA) form, or they can be constructed in a stand alone SMD or BGA/chip scale package (CSP) form to make it mountable on a multi-layer board, ceramic carrier or silicon platform.