How does the acidic etching process affect the morphology and surface characteristics of samples before analysis using SEM?
Best insight from top research papers
The acidic etching process plays a crucial role in affecting the morphology and surface characteristics of samples before SEM analysis. Different acid concentrations and etching durations impact the visualization of structures. For instance, in bone samples embedded in PMMA, acid etching with 9% phosphoric acid provided the most informative visualization of the osteocyte lacuno-canalicular network (LCN). Similarly, in the study of nano crystalline silicon, etching with solutions like Nitric acid and Hydrofluoric acid influenced the characteristics of porous silicon, leading to varied morphological properties. Acid etching solutions can enhance the visibility of specific patterns, such as the lamellar bone structure, while strong etching may cause surface decalcification and damage to the collagen matrix. Therefore, the choice of acid type, concentration, and exposure time significantly impacts the surface features observed under SEM analysis.
Answers from top 5 papers
More filters
| Papers (5) | Insight |
|---|---|
| Acid-etching of non-decalcified bone samples embedded in PMMA, particularly with 9% phosphoric acid, enhances visualization of the osteocyte lacuno-canalicular network morphology for SEM analysis, aiding in studying bone structure. | |
4 Citations | Weak acid etching, like citric or acetic acid, enhances the visibility of the lamellar pattern in cortical bone samples, while strong acid etching can lead to severe damage compromising analysis. |
| The acidic etching process, specifically with Nitric acid and Hydrofluoric acid, influences the morphological properties of porous silicon samples, impacting their surface characteristics before SEM analysis. | |
10 Citations | The etching treatment alters the surface morphology of dental structures, impacting their characteristics for SEM analysis, as discussed in the research paper. |
| Not addressed in the paper. |
Related Questions
How does the use of IA in conjunction with SEM affect the detection and identification of corrosion types?5 answersThe use of IA in conjunction with SEM can significantly improve the detection and identification of corrosion types. One study developed an automated approach based on self-supervised deep learning methods to analyze SEM images and detect cells and microbially induced corrosion (MIC) byproducts. Another study proposed the identification of corrosion wear factors using an experimental and theoretical approach, which increases the accuracy of assessing corrosion wear. Additionally, features extracted from electrochemical noise were analyzed to identify types of corrosion, and machine learning techniques achieved high accuracy in this task. Furthermore, the use of signal processing and machine learning techniques, such as wavelet transform and recurrence quantification analysis, proved effective in the classification of different types of localized corrosion and the identification of corrosive substances. These findings demonstrate the potential of IA and SEM in enhancing the detection and identification of corrosion types.
How does the etching process affect the microstructure and properties of NiCr thin films?4 answersThe etching process of NiCr thin films affects their microstructure and properties. An improved wet etching process with a protective film results in clear and burr-free patterns with good uniformity. Reactive ion etching (RIE) treatment of the dielectric substrate weakens the transmission and reflection of NiCr films, enhancing their absorption of terahertz radiation. Dry etching technology using a mixed gas of chlorine and sulfur hexafluoride improves the uniformity of etching and reduces the etching speed ratio of the photoresist, enabling dry imaging on NiCr films. Ion beam dry etching on a 4-micron NiCr alloy film solves the difficulty of using photoresists as masks and is suitable for mass production. Electron cyclotron resonance etching with a Cl∕Ar gas mixture achieves high etch rates and pattern transfer without redeposits for NiCr films.
During the semiconductor etching process, which parameter had the most significant impact on the residual halogen amount?5 answersDuring the semiconductor etching process, the parameter that had the most significant impact on the residual halogen amount was the introduction of hydrogen gas into the processing chamber. By exhausting the chamber to ultra-high vacuum and introducing a small quantity of hydrogen gas, the desorption of reaction products from the semiconductor substrate surface was promoted, enabling the removal of halogen at a low temperature. This method allowed for the etching of the semiconductor surface using halogen gas, followed by the removal of remaining halogen from the surface through heat treatment in low pressure hydrogen gas. This process effectively reduced the halogen concentration in the material layer, as the halogen atoms diffused into an overlying dielectric layer during annealing and were subsequently removed by removing the dielectric layer.
What are the drawbacks of etching the MAX phase with HF acid?5 answersEtching the MAX phase with HF acid has several drawbacks. Firstly, HF acid is hazardous to humans and the environment, making it a safety concern. Secondly, the etching process using HF acid can result in the loss of certain species, such as aluminum, from the material being etched. This loss of species can affect the properties and composition of the material. Additionally, the etching rate of HF acid can vary depending on the orientation of the material, with etching through the edges being isotropic and more pronounced than etching through the basal planes. Lastly, HF etching can lead to the restructuring of the surface of the material being etched, which can affect subsequent processes, such as oxidation, and result in the formation of different compounds.
How to prepare mic corrosion specimen before sem analysis for non bacteria specimen or control specimen?5 answersTo prepare mic corrosion specimens before SEM analysis for non-bacterial or control specimens, there are several methods described in the abstracts. One method involves immersing the specimens in an etching solution. Another method includes impregnating the tissues with osmium tetroxide and thiocarbohydrazide, followed by embedding in hard polyethylene glycol and planing a ultrasmooth surface with glass knives. Additionally, a method is described that involves sampling the specimen in a first container, optically measuring it, sampling it in a second container, and preparing it for measurement by mixing with a reagent. It is important to note that these methods are described in the abstracts and further details may be available in the full text papers.
If we want to analys surface from mic corrosion, we use secondary electron or Backscattered Electrons SEM?4 answersTo analyze surface corrosion, both secondary electrons (SE) and backscattered electrons (BSE) can be used in scanning electron microscopy (SEM). SE are commonly used to obtain topographical contrast, while BSE show differences in chemical composition (Z-contrast). SE provide information about the surface texture and structure, while BSE can provide additional information such as orientation contrast, residual stress, and different allotropic modifications. Therefore, both SE and BSE can be valuable for analyzing surface corrosion in SEM.