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How does the use of different materials and processes affect the likelihood of tunneling in semiconductor devices? 


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The use of different materials and processes can significantly affect the likelihood of tunneling in semiconductor devices. Researchers have explored various materials and device architectures to improve the characteristics of tunnel field-effect transistors (TFETs) . Material bandgap engineering has been employed to enhance the ability of TFETs to resist off-state leakage currents, by incorporating a material-based band offset component . The stoichiometry of semiconductor heterostructures also plays a role in the electron-hole dynamics and time-resolved optical responses in resonant tunneling devices . The composition of the devices, such as Sb-based tunneling devices, can lead to different time scales of current flux intensity compared to As-based devices . These findings highlight the importance of material selection and device design in controlling tunneling behavior in semiconductor devices.

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The paper discusses the role of stoichiometry and composition in Sb-based tunneling devices, highlighting the correlation between structural parameters, radiative recombination processes, and relaxation mechanisms. However, it does not directly address the likelihood of tunneling in semiconductor devices.
The provided paper does not directly address the likelihood of tunneling in semiconductor devices.
The paper discusses how using different materials and bandgap engineering techniques can enhance the ability of tunneling transistors to resist off-state leakage currents. It does not specifically mention the likelihood of tunneling in semiconductor devices.
The answer to the query is not provided in the paper. The paper discusses the advantages and limitations of using different materials and device architectures in the design of Tunnel Field Effect Transistors (TFETs), but it does not specifically address how the use of different materials and processes affects the likelihood of tunneling in semiconductor devices.
The answer to the query is not provided in the paper. The paper discusses the advantages and limitations of using different materials and device architectures in the design of Tunnel Field Effect Transistors (TFETs), but it does not specifically address how the use of different materials and processes affects the likelihood of tunneling in semiconductor devices.

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