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What failure mechanisms could cause capacitance degradationa and not insulation resistance or dissipation factor degradation? 


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Capacitance degradation in electronic components, specifically varactors, can be attributed to various failure mechanisms distinct from insulation resistance or dissipation factor degradation. One significant cause is electron trapping at the side of shallow trench isolation (STI) in varactors, leading to systematic capacitance degradation over time and under stress conditions . Additionally, fretting damage in electrical connector systems can induce capacitance effects due to the physical separation of the blade and receptacle by corrosion products, impacting signal phase and frequency response across the connector interface . Furthermore, crack development during the assembly process of multilayer ceramic chip capacitors (MLCCs) can result in short mode failures due to moisture ingress and metal migration, affecting capacitance without directly impacting insulation resistance or dissipation factor .

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Vibration-induced fretting motion can lead to capacitance degradation in electrical connectors, distinct from insulation resistance or dissipation factor degradation, due to the localized buildup of an insulating layer.
Not addressed in the paper.
Failure mechanisms causing capacitance degradation, not insulation resistance or dissipation factor, include electron trapping at the side of shallow trench isolation in Hyper-abrupt junction varactors due to dimension scaling.
Failure mechanisms causing capacitance degradation instead of insulation resistance or dissipation factor degradation are not addressed in the paper.

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