What is the detailed mechanism for TMAH to etch silicon?
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Tetramethyl ammonium hydroxide (TMAH) is commonly used to etch silicon. The etching mechanism involves the interaction of TMAH with silicon and other components in the solution. TMAH solutions containing surfactant and alcohol additives have been studied, and the presence of these additives affects the etching rates and surface morphologies of silicon . The addition of alcohol, especially butanol-2, to a TMAH solution improves the surface finish of the etched silicon . TMA+ ions in the TMAH solution increase the wettability of the textured surface, resulting in the formation of uniform pyramids during etching . Surfactant-modified TMAH is used for etching in the fabrication process of a capacitive MEMS accelerometer, as it provides control over the spring thickness and minimizes undercutting at the mass corner . TMAH solutions containing Si and oxidizing agents can be used for silicon anisotropic etching, and the formation of micropyramids can be controlled by adjusting the etch rate ratio of different crystal orientations . Ultrasonic vibration and the use of additives in TMAH solutions improve surface quality during silicon etching .
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26 Citations | The detailed mechanism for TMAH to etch silicon is not provided in the paper. The paper focuses on investigating the influence of etchant concentration, dissolving silicon content, and additives during silicon anisotropic etching in TMAH. |
31 Citations | The detailed mechanism for TMAH to etch silicon is not provided in the paper. |
| The detailed mechanism for TMAH to etch silicon is not mentioned in the provided paper. | |
33 Citations | The detailed mechanism for TMAH to etch silicon is not provided in the paper. |
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