Showing papers on "Electronic packaging published in 1978"

Trends in Packaging Technology

Abstract: Some obvious trends in electronic technology today are the movement of packaging (i.e., the interconnection of circuit elements) into the semiconductor technology and both cost and reliability are benefiting from this move. Figure 1 shows the relative cost of making an interconnection at the various levels of circuit packaging. Figure 2 shows the relative reliability of those interconnections. Given these trends, the future emphasis in electronic technology development will be on increasing levels of semiconductor integration and increasing packaging density at the first or module level. I would like to briefly describe the module package currently in production at IBM-Endicott, New York and the advantages it provides in Large Scale Integration (LSI) packaging.

Electronics for a Focal Plane Crystal Spectrometer

Abstract: The HEAO-B program forced the usual constraints upon the spacecraft experiment electronics: high reliability, low power consumption, and tight packaging at reasonable cost. The programmable high voltage power supplies were unique in both application and simplicity of manufacture. The hybridized measurement chain is a modification of that used on the SAS-C program; the charge amplifier design in particular shows definite improvement in performance over previous work.

Some Package Reliability Implications of Current Trends in Large Scale Silicon Integrated Circuits

Abstract: Increasing scale of integration has tended to change the focus of integrated circuit packaging from low cost to high electrical and thermal performance and improved reliability. Today's high-speed, densely-packed LSI chips pose some new packaging reliability challenges. These are explored briefly.