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Showing papers on "Flexible electronics published in 1993"


Patent
13 Apr 1993
TL;DR: In this article, a flexible sensor assembly for detecting optical pulses is presented, in which the flexible sensor is adapted to be folded so that the photoelectric detector can be spaced from and disposed over the light emitting diode.
Abstract: A flexible sensor assembly for detecting optical pulses in which said sensor assembly comprises a flexible printed circuit having mounted thereon at least one light emitting diode and at least one photoelectric detector connected to different circuit patterns with an insulative tape secured over the circuit and components and wherein the flexible sensor is adapted to be folded so that the photoelectric detector can be spaced from and disposed over the light emitting diode.

170 citations


Patent
Hiroyuki Hashimoto1
18 Oct 1993
TL;DR: In this article, a flexible printed circuit is disposed inside the frame member without being exposed therefrom, and the flexible circuit is used to drive a liquid crystal display device with a circuit board carrying electric circuits for driving it.
Abstract: A liquid crystal display device has a liquid crystal panel, a circuit board carrying electric circuits for driving the liquid crystal panel, a flexible printed circuit electrically connected between the liquid crystal panel and the circuit board, and a frame member having a substantially U-shaped cross-sectional shape. The frame member supports the liquid crystal panel and the circuit board in a planar manner with its inner wall surfaces. The flexible printed circuit is disposed inside the frame member without being exposed therefrom.

57 citations


Patent
08 Sep 1993
TL;DR: In this article, a flexible printed circuit is used to provide control signals to a liquid crystal cell in a box-like molded housing with an open front, the printed circuit having a terminal array attached to a housing flange adjacent the front opening.
Abstract: A box-like molded housing with an open front has a flexible printed circuit wrapped around it, the printed circuit having a terminal array attached to a housing flange adjacent the front opening. A frame having a translucent web or filter covers the open front and contains a liquid crystal cell. A slot in the frame contains an elastomeric connector for joining terminals on the cell with terminals on the printed circuit to provide control signals to the cell. The housing interior is a reflector cavity and contains lamps for illuminating the web and the cell through the web. The printed circuit carries surface mount components, supplies power to the lamps, and has a contact array for connection to spring contacts of an external connector.

38 citations


Patent
22 Jan 1993
TL;DR: In this article, a DC motor has a housing (2), a hub member (8) rotatably supported by the housing, a flexible printed circuit board (40) fixedly mounted on the housing and an IC chip (48) mounted on a flexible circuit board and located facing a recess (32) formed in the housing.
Abstract: A DC motor having a housing (2), a hub member (8) rotatably supported by the housing, a flexible printed circuit board (40) fixedly mounted on the housing, and an IC chip (48) mounted on the flexible printed circuit board and located facing a recess (32) formed in the housing. The hub member has a shaft (24) rotatably supported by a bearing (4,6) within the recess. The flexible printed circuit board has a metal layer (50) for mounting the IC chip, the metal layer being isolated from a wiring pattern (44) formed on the printed circuit board. The wiring pattern on the flexible printed circuit board is directly connected to a connection pin (36) connected to the motor wiring (20).

33 citations


Patent
25 Mar 1993
TL;DR: In this paper, an electric wiring/optical wiring combined flexible printed circuit board is formed by using a high-polymer film having optical waveguide and metallic wiring formed on it as main constituting elements.
Abstract: PURPOSE:To provide the electric wiring/optical wiring combined flexible printed circuit board formed by housing electric wiring and optical wiring in the same wiring board and the substrate for such circuit board. CONSTITUTION:This electric wiring/optical wiring combined flexible printed circuit board is formed by using a high-polymer film having optical waveguide and metallic wiring formed on it as main constituting elements. The electric wiring/optical wiring combined flexible printed circuit board is formed by using the high-polymer film having the optical waveguide and metallic foil formed on it as main constituting elements. The main base materials of the respective high-polymer films are polyimide and more particularly adequately polyimide of org. tetracarboxylic acid and 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl. Since the circuit boards have characteristics, such as resilience and lightness, the circuit board makes contribution for high advancement of future optical communication apparatus, optical information device, etc. The circuit boards are easily made from the substrates.

28 citations


Journal ArticleDOI
TL;DR: In this article, a method of fabricating a transformer winding assembly having a large number of conductive and insulating layers is presented, along with a synthesis procedure for practical winding configurations and the steps to assemble interleaved planar windings from flex circuits are described.
Abstract: Z-folding of flex circuits is presented as a method of fabricating a transformer winding assembly having a large number of conductive and insulating layers. Flex-circuit patterns. for practical winding configurations are described along with a synthesis procedure. The steps to assemble interleaved planar windings from flex circuits are described. Equations relating winding resistance to geometrical parameters are derived for design purpose. >

25 citations


Patent
02 Jun 1993
TL;DR: A display means an apparatus comprising a printed circuit board having an integrated circuit etc. for controlling display information; a backlighting plate being fixed on the printed circuit boards; a glass-electrode liquid crystal display device which is disposed on the backlighting plates and is electrically connected with the printed circuits through a flexible printed circuit plate and fixed thereon; a decorative panel being located above the glass-electric liquid crystal displays device; and an elastic packing which is disposing between the glasselectric device and the decorative panel and is fixed on this side of the printed board to hold
Abstract: A display means for an apparatus comprising a printed circuit board having an integrated circuit etc. for controlling display information; a backlighting plate being fixed on the printed circuit board; a glass-electrode liquid crystal display device which is disposed on the backlighting plate and is electrically connected with the printed circuit board through a flexible printed circuit plate and fixed thereon; a decorative panel being located above the glass-electrode liquid crystal display device; and an elastic packing which is disposed between the glass-electrode liquid crystal display device and the decorative panel and is fixed on this side of the printed circuit board to hold the glass-electrode liquid crystal display device.

22 citations


Patent
03 Feb 1993
TL;DR: In this paper, a flexible printed circuit consisting of a plurality of electrical paths surrounded by a sheath of pliable MYLAR (polyester film) plastic is presented. But it does not eliminate the need for lead wire routing.
Abstract: In summary, the present invention is a flexible printed circuit that eliminates the need for lead wire routing. The flexible printed circuit of the present invention comprises a plurality of electrical paths surrounded by a sheath of pliable MYLAR (polyester film) plastic. One side of the plastic is an adhesive that holds the circuit in place after it is wrapped around the shaft of the motor. On the other side, the mylar sheath opens to expose the ends of each electrical path. Small amounts of solder are pre-deposited at these exposed ends. A probe, suitably heated and applied to these ends, releases the solder to form a electrical and physical contact.

21 citations


Patent
12 Apr 1993
TL;DR: In this article, a multi-layer flexible printed circuit for tape automated bonding (TAB) is assembled from three components during the process of TAB bonding the circuit to a semiconductor device for burn in and testing prior to assembly into a system comprising a plurality of tested TAB circuit bonded devices.
Abstract: A novel multi-layer flexible printed circuit for tape automated bonding (TAB) is assembled from three components during the process of TAB bonding the circuit to a semiconductor device for burn in and testing prior to assembly into a system comprising a plurality of tested TAB circuit bonded devices. The first layer comprises a conductive signal plane layer mounted on top of a flexible dielectric layer. The second layer comprises a dielectric spacer layer mounted on top of the conductive signal plane layer. The third layer comprises a conductive ground plane layer mounted on the bottom of a dielectric layer. The conductive ground plane layer is mounted on top of the dielectric spacer layer. Before testing, the inner leads of the composite multi-layer circuit are bonded to the electrode pads of a semiconductor device to be tested. After testing the outer portions of the TAB circuit are cut away leaving the outer leads exposed. The semiconductor device is then connected to its carrier circuit by bonding the outer leads of the tested TAB circuit to the leads of a carrier circuit or package.

19 citations


Patent
Masaki Sano1
07 Jul 1993
TL;DR: In this article, a flexible printed circuit board is provided including a flexible sheet having at least one electrically conductive layer, with a printed circuit pattern and a fold retainer pattern formed in one of the electricallyconductive layers.
Abstract: A flexible printed circuit board is provided including a flexible sheet having at least one electrically conductive layer, with a printed circuit pattern and a fold retainer pattern formed in one of the electrically conductive layers. The fold retainer pattern is electrically isolated from the printed circuit pattern. The fold retainer pattern has notches that indicate where the sheet is to be folded when the flexible sheet is folded, it is held in its folded shape by the fold retainer pattern.

19 citations


Patent
14 Jan 1993
TL;DR: In this article, a multi-layer rigid-flex circuit (20) is formed of a number of flexible layers on a rigid substrate (100) with individuals ones of the layers having laterally projecting arms (32,38) that define flexible circuit connections to individual ones of a many ceramic circuit boards (10,12,14,16).
Abstract: A multi-layer rigid-flex circuit (20) is formed of a number of flexible layers (62-70) on a rigid substrate (100) with individuals ones of the layers having laterally projecting arms (32,38) that define flexible circuit connections to individual ones of a number of ceramic circuit boards (10,12,14,16). The laterally projecting flexible arms (32,34,36,38) are each formed with gold dot or projecting feature pressure contacts (40a-40g) which are pressed against mating sets of circuit board contact pads (40a-40g) by a clamping bar (120) that is bolted to the rigid circuit board. Thus the interconnections between the rigid-flex circuit and the circuit boards are effectively built into the rigid-flex circuit, requiring only a clamp to complete the connection.

Patent
23 Dec 1993
TL;DR: In this article, a launch-protected electronic assembly including a printed circuit board having several conductor paths is provided, where an electronic component is provided that is secured to the printed circuit boards.
Abstract: A launch-protected electronic assembly including a printed circuit board having several conductor paths. An electronic component is provided that is secured to the printed circuit board. The electronic component has several electrical connections each contacting a corresponding conductor path. The assembly further includes a support and at least one of a flexible adhesive layer and a dot-shaped flexible adhesive location connecting the printed circuit board to the support.

Patent
Hitoshi Tanaka1
21 Jun 1993
TL;DR: In this article, an elastically deformable mounting member is fitted in the mounting opening by elastically deforming the same flexible board, in a manner such that the bent portion of the flexible board is perpendicular to the direction of relative movement of the first and second electrical members.
Abstract: A mounting apparatus of a flexible board which connects a first electrical member, movable in an optical axis direction, to a second electrical member, which is movable relative to the first electrical member. The apparatus includes a cylindrical support provided between the first and second electrical members, and an axially elongated mounting opening is provided in the cylindrical support, in which the flexible board can be received. An elastically deformable mounting member is fitted in the mounting opening by elastically deforming the same. The elastically deformable mounting member holds the flexible board, which is wrapped around the mounting member, in a manner such that the bent portion of the flexible board is perpendicular to the direction of relative movement of the first and second electrical members.

Patent
12 Feb 1993
TL;DR: In this paper, a flexible printed circuit carrier is provided with at least electrical conductive pathways, which carrier is made of a flexible material, for example Kapton, and which conductive pathway on the carrier are electrically connected to at least two terminals of the adapter.
Abstract: Adapter, comprising a housing preferably made of plastic, which housing contains at least one flexible printed circuit carrier provided with at least electrical conductive pathways, which carrier is made of a flexible material, for example Kapton, and which conductive pathways on the carrier are electrically connected to at least two terminals of the adapter, wherein the flexible carrier is provided with electronic components on at least one side thereof, the carrier having a metallized side and being folded around the components to shield them from electromagnetic interference, and further having a flap-like portion disposed between the components and an electrical connector mated with the adapter to provide electrostatic protection for the components.

Patent
03 Dec 1993
TL;DR: In this article, the authors proposed a method to obtain a film having anisotropic electrical conductivity and usable for the connection of a liquid crystal display (LCD) to a flexible printed circuit board and the microbonding of a semiconductor IC to an IC-mounting board by dispersing specific electrically conductive particles in an insulating adhesive resin.
Abstract: PURPOSE: To obtain a film having anisotropic electrical conductivity and usable for the connection of a liquid crystal display (LCD) to a flexible printed circuit board and the microbonding of a semiconductor IC to an IC-mounting board by dispersing specific electrically conductive particles in an insulating adhesive resin. CONSTITUTION: This film is produced by preparing electrically conductive particles having a center core composed of a polymeric core material 1 (e.g. epoxy resin and urethane resin), a metallic film 2 (e.g. gold, silver, copper and indium) formed on the surface of the core and a film 3 of a metal having a melting point lower than that of the metal film 2 (e.g. nickel, silver, copper and zinc) and formed on the surface of the metal film 2 and dispersing the particles in an insulating adhesive resin. COPYRIGHT: (C)1995,JPO

Patent
12 Mar 1993
TL;DR: In this article, the authors proposed a composite flexible printed board 30 consisting of a first flexible board 10 formed with a circuit wiring part, and a second printed board 20 formed with the outer terminal of the circuit wires part, interconnected electrically and integrated.
Abstract: PURPOSE:To increase production yield while minimizing material loss when highly accurate formation of a wiring layer is required on a flexible printed board at a fine pitch. CONSTITUTION:The composite flexible printed board 30 comprises a first flexible printed board 10 formed with a circuit wiring part, and a second printed board 20 formed with the outer terminal of the circuit wiring part, i.e., a terminal part 20b, interconnected electrically and integrated.

Patent
26 Feb 1993
TL;DR: In this paper, a flexible printed circuit (FPC) 11 deforms by bending when external force FZ is applied in the direction of the thickness (Z direction), since it is made of soft materials.
Abstract: PURPOSE:To provide a flexible printed circuit with more uses capable of increasing the mounting efficiency by making it deformable in two directions. CONSTITUTION:A flexible printed circuit(FPC) 11 deforms by bending when external force FZ is applied in the direction of the thickness (Z direction), since it is made of soft materials. And it also becomes possible for the FPC to deform also in the X direction by a constant amount, since slits 11a are formed in the Y direction, and it is easy for the FPC 11 to deform along the slits 11a when external force FX in the X direction is applied to the FPC 11.

Patent
17 Dec 1993
TL;DR: In this paper, a transducer is mounted in an enclosure (100) and connection device (500,600) consisting of coaxial-type cable (600) and flexible printed circuit (500) in isolating material.
Abstract: The sensor includes a transducer(300) mounted in an enclosure (100) and connection device (500,600) consisting of coaxial-type cable (600) and flexible printed circuit (500) in isolating material. The connection circuit includes two conducting strips to which the sensor leads are soldered. The circuit substrate is formed with two folded tabs each carrying a perforation (520,522) surrounded by a conducting ring (514,518). The core (602) and sheath (606) of a coaxial cable (600) are passed through the perforations and are soldered to the conducting rings. USE/ADVANTAGE - As displacement, anti-skid or anti-lock system sensor. Improved rotation sensor exhibits simple structure, low cost and improved reliability.

Patent
Toshio Enomoto1
07 May 1993
TL;DR: In this paper, a probe for an in-circuit emulator for use in program verification and debugging during development of an equipment using a microcomputer is presented, which is formed by a flexible printed circuit board on which a plurality of conductive lines and solder-connecting elements are provided.
Abstract: A probe for an in-circuit emulator for use in program verification and debugging during development of an equipment using a microcomputer is disclosed. The probe is formed by a flexible printed circuit board on which a plurality of conductive lines and a plurality of solder-connecting elements are provided. The conductive lines and the solder-connecting elements are electrically connected through a plurality of through-holes provided in the flexible printed circuit board. The solder-connecting elements of the probe are solder-connected to conductive lines of a target board to be emulated. The in-circuit emulator does not require a dummy chip, which makes the probe simple in its structure and economical in the fabrication thereof.

Patent
03 Feb 1993
TL;DR: In this article, a flat display panel and a driving board are connected via the series body composed of the one-side land type flexible printed circuit board 14 formed by mounting a driver IC 6 on a printed circuit 5 and a connecting cable 17 conducted and connected to one end thereof.
Abstract: PURPOSE: To enhance the reliability of conduction performance and to prevent an increase in the size of the device by decreasing the curves of a flexible printed circuit board, thereby eliminating the stress concentration of conductive junctures CONSTITUTION: A flat display panel 1 and a driving board 3 are conducted and connected to each other via the series body composed of the one-side land type flexible printed circuit board 14 formed by mounting a driver IC 6 on a printed circuit 5 and a connecting cable 17 conducted and connected to one end thereof This connecting cable 17 is formed zigzag to, for example, in an S shape to decrease the curving quantity of the flexible printed circuit board 14 COPYRIGHT: (C)1994,JPO&Japio

Patent
26 Feb 1993
TL;DR: In this paper, a reinforcement plate for each surface of a flexible printed-circuit board and a proper window hole at the reinforcing plate is provided to expose a terminal soldering surface.
Abstract: PURPOSE:To enable design and manufacture of a double-sided mounting to be facilitated by providing a reinforcing plate for each surface of a flexible printed-circuit board and a proper window hole at the reinforcing plate and then exposing a terminal soldering surface. CONSTITUTION:Reinforcing plates 7 and 7' for each of front and rear surfaces of a flexible printed-circuit board 1 are made of an insulation material and are bonded to each side of the printed-circuit board. Each terminal 10 of switches 8 and 9 passes through terminal holes 11 and 11' which are provided on the reinforcing plates 7 and 7'. Window holes 12 and 12' which are provided at the reinforcing plates 7 and 7' allow the terminal 10 of a push button switch 9 and the terminal 10 of a slide switch 8 to be soldered to a printed-wiring portion 2 of the flexible printed-circuit board 1. Parts which are mounted to both sides of the flexible printed-circuit board are mounted to the reinforcing plates 7 and 7' at each side. The window holes 12 and 12' are provided at an region of the reinforcing plate of the other side which opposes a parts- mounting region on the reinforcing plate of one side, thus enabling restrictions when designing a printed-circuit wiring pattern to be reduced.

Patent
10 Nov 1993
TL;DR: In this article, a flexible part 3 comprising a flexible printed wiring board is integrated with rigid parts 1, 2 comprising a rigid printed wire board 8 and a protective layer 6 is then formed entirely on the flexible part and the rigid parts of the rigid board including the contiguous part of the wire board.
Abstract: PURPOSE:To realize a rigid flex printed wiring board which resists against bending even at the contiguous part by forming the protective layers of a flexible printed wiring board and a rigid printed wiring board integrally including its contiguous parts and simultaneously with the formation of protective layer for the rigid flex printed wiring board. CONSTITUTION:A flexible part 3 comprising a flexible printed wiring board is integrated with rigid parts 1, 2 comprising a rigid printed wiring board 8. A protective layer 6 is then formed entirely on the flexible part 3 and the rigid parts 1, 2 including the contiguous part of the rigid printed wiring board 8. Since the step for forming a protective layer is not required in the production of flexible printed wiring board, inner layer step can be simplified.

Patent
28 Dec 1993
TL;DR: In this paper, a silicon oxidized film is formed on a silicon substrate and contact point P patterns to bring probes into contact with ITO electrodes are formed on this oxide film.
Abstract: PURPOSE: To produce main parts not by manual operations by using means using techniques of ICs and printed wirings, etc. CONSTITUTION: A silicon oxidized film is formed on a silicon substrate 10 and contact point P patterns to bring probes into contact with ITO electrodes are formed on this oxidized film. Inverted pyramid-shaped cavities arriving at the silicon substrate 10 are formed by anisotropic etching in these pattern parts. Vapor deposited metal layers are formed from the parts formed with these cavities to the positions where the terminals to be connected to external circuits are formed. Hard metallic films are formed by electroplating thereon to form metallic wiring layers of prescribed shapes. The unnecessary exposed silicon parts are removed by an etching means and an assembly formed by connecting the electroplating layers and a connector 12 via the printed wirings formed on the flexible printed circuit board 13 is joined and fixed to a mounting base plate 9b. The probe card is produced by applying the means established as the means for producing semiconductor devices in such a manner. COPYRIGHT: (C)1995,JPO

Patent
27 Jul 1993
TL;DR: In this article, a parallel processor packaging structure and a method for manufacturing the structure is described, and the printed circuit cards are mounted on or connected to a plurality of circuitized flexible substrates, with one printed circuit card at each end of the circuitised flexible circuit.
Abstract: Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outwardly from a laminate of the circuitized, flexible substrates. Intercommunication is provided through a switch structure that is implemented in the laminate. The printed circuit cards are mounted on or connected to a plurality of circuitized flexible substrates, with one printed circuit card at each end of the circuitized flexible circuit. The circuitized flexible substrates connect the separate printed circuit boards and cards through the central laminate portion. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication. The planar circuitization, as data lines, address lines, and control lines of a logic chip or a memory chip are on the individual printed circuit boards and cards, which are connected through the circuitized flex, and communicate with other layers of flex through Z-axis circuitization (vias and through holes) in the laminate. The individual circuitized flexible strips are discrete subassemblies. These subassemblies are laminates of at least one internal power core, and at least one signal core, with a layer of dielectric between.

Patent
29 Jan 1993
TL;DR: In this article, a flexible printed circuit board is constructed of polyimide resin, polyester resin and the like, and a circuit pattern is formed on the rear surface thereof.
Abstract: PURPOSE:To provide terminal structure of a printed circuit board advantageous for high density packaging, excellent in mechanical connection strength and reliability of electrical connection and without limitation on materials for construction. CONSTITUTION:A printed circuit board 3 is a flexible printed circuit board constructed of a polyimide resin, polyester resin and the like, and a circuit pattern 4 is formed on the rear surface thereof. Engaging parts 1a, 1a of a terminal piece 1 are calking-fixed to the printed circuit board 3. Accordingly, tips of the engaging parts 1a, 1a are brought into contact with a terminal part 5 in a biting-in manner to be electrically connected. Further, the engaging parts 1a, 1a are electrically connected to the terminal part 5 and mechanically reinforced by means of a conductive fixing agent 7.

Patent
17 May 1993
TL;DR: In this article, an adhesive composition for a flexible printing circuit board, keeping heat durability, solder reflow heat resistance, flexural resistance and adhesive properties and excellent in shelf life in a solution state, was provided.
Abstract: PURPOSE: To provide an adhesive composition for a flexible printing circuit board, keeping heat durability, solder reflow heat resistance, flexural resistance and adhesive properties and excellent in shelf life in a solution state. CONSTITUTION: There is provided an adhesive composition for a flexible printing circuit board, containing (A) (a) an epoxy resin containing two or more epoxy groups, (b) maleic anhydride, (c) a tetracarboxylic acid dianhydride and (B) hydrogenated acrylonitrile butadiene rubber as the essential components. The ratio of the component (A) is 10 to 70 pts.wt. based on 100 pts.wt. total weight of the components (A) and (B). COPYRIGHT: (C)1994,JPO

Patent
26 Feb 1993
TL;DR: In this paper, the authors proposed a method to form a through hole of high reliability in a multilayer by coating a part to become a flexible part with a film cover lay, laminating a hard printed circuit board material on a part, and eliminating the lay on the multi-layer.
Abstract: PURPOSE:To form a through hole of high reliability in a multilayer by coating a part to become a flexible part with a film cover lay, laminating a hard printed circuit board material on a part to become a multiplex part, and eliminating the lay on the multilayer. CONSTITUTION:Only a part to become a flexible part 7 of a flexible printed circuit board material 1 is coated with a film cover lay 3 to protect an inner layer conductor pattern 2. A hard printed circuit board material 5 is laminated on a part to become a multilayer 6 of the material 1 through an insulating layer 4. After through holes are opened in place the multilayer 6, through holes 9 are formed by copper plating. The lay 3 does not exist on the multilayer 6 formed with the holes 9. Accordingly, a defect, etc., in the through hole generated due to adhesive of the lay 3, does not occur. Thus, the holes 9 of high reliability can be formed at the multilayer 6.

Patent
Thomas Kosikowski1
15 Jul 1993
TL;DR: In this article, a stabilisation frame with three-sided U-shaped profile and a closure strip on the fourth side is proposed to stabilize thin and flexible printed circuit boards in order to allow chemical and/or electrolytic treatment in vertically operating electroplating systems.
Abstract: The invention relates to a device for stabilising thin and therefore flexible printed circuit boards, in order to allow chemical and/or electrolytic treatment in vertically operating electroplating systems such that the said printed circuit board can be handled as an intrinsically rigid plate. The device consists of a stabilisation frame with three-sided U-shaped profile and a closure strip on the fourth side. The printed circuit board is fitted loose into the stabilisation frame and fixed thereto on only one side. The unfixed sides make it possible for the printed circuit board to flex in the loose guides when forces act on it so that it is not damaged.

Patent
26 Mar 1993
TL;DR: In this paper, a flexible printed circuit board is disposed in contact with a seal packing provided between an upper cover and a lower cover and takes outside a magnetic disk device a signal from a magnetic head 2 provided inside the magnetic disk devices.
Abstract: PURPOSE:To prevent invasion of dust into a magnetic disk device from a gap between a flexible printed circuit board and a seal means. CONSTITUTION:A flexible printed circuit board 6 has an indented part 9 formed by expanding the edge part thereof in the width direction thereof, and the flexible printed circuit board 6 is disposed in contact with a seal packing 5 provided between an upper cover 3 and a lower cover 4 and takes outside a magnetic disk device a signal from a magnetic head 2 provided inside the magnetic disk device. When the upper cover 3 and the lower cover 4 are fastened to be closed by a screw 7, the flexible printed circuit board 6 is held by the seal packing 5 and the upper cover 3 between, and due to the existence of the indented part 9 in the width direction of the flexible printed circuit board 6, a gap 8 formed by the thickness of the flexible printed circuit board 6 forms a labyrinth 10 and thereby prevents invasion of dust from outside of the magnetic disk device.

Patent
05 Apr 1993
TL;DR: In this article, the flexible printed circuit board is arranged within a lens barrel having a photographic optical system at the center on the plane approximately perpendicular to the optical axis of the optical system, projecting circuit board parts 11, 12, 13 which project outward from the toric shape part 10, are packaged with electronic parts 22, 23, 24, and overlap on the circular shape part of 10 and bend the front ends forward approximately parallel with optical axis when arranged in the lens barrel.
Abstract: PURPOSE:To provide the flexible printed circuit board having good wiring efficiency. CONSTITUTION:The flexible printed circuit board 9 to be arranged within a lens barrel having a photographic optical system has a circular shape part 10 which is formed to a circular shape having an aperture to be passed with the luminous flux of the photographic optical system at the center on the plane approximately perpendicular to the optical axis of the photographic optical system, projecting circuit board parts 11, 12, 13 which project outward from the circular shape part 10, are packaged with electronic parts 22, 23, 24, and overlap on the circular shape part 10 and bend the front ends forward approximately parallel with the optical axis when arranged in the lens barrel and extension circuit board parts 14, 15, 16, 17 which project from the parts of the projecting circuit board parts 11, 12, 13 overlapping on the toric shape part 10, are disposed with checking land parts 18 for inspecting electric parts and overlap on the projecting circuit board parts 11, 12, 13 before the projecting circuit board parts 11, 12, 13 overlap on the circular shape part 10.