Showing papers on "Sodium hypophosphite published in 1969"

Nickel or cobalt wear-resistant compositions and coatings

Abstract: METALLIC COMPOSITIONS AND SUBSTRATES COATED THEREWITH HAVING IMPROVED WEAR RESISTANCE AND OTHER PROPERTIES ARE PROVIDED. IN A PREFERRED EMBODIMENT, THE COATING COMPRISES AN INTIMATE DISPERSION OF HARD NICKEL-BORIDE (NI3B) OR NICKEL PHOSPHIDE (NI3P) IN A SOFT MATRIX OF NICKEL AND THALLIUM. THE COATING IS PREPARED BY CHEMICAL REDUCTION OF NICKEL AND THALLIUM SALTS USING BOROHYDRIDES SUCH AS SODIUM BOROHYDRIDE AND DIMETHYLAMINE BORANE (DMAB) OR SODIUM HYPOPHOSPHITE. THE PROPORTIONS OF THE METALS IN THE PREFERRED COATING ARE ABOUT 99.4 TO 82 PERCENT BY WEIGHT NICKEL, ABOUT 0.1 TO 12 PERCENT BY WEIGHT BORON OR PHOSPHORUS AND ABOUT 0.5 TO 6 PERCENT BY WEIGHT THALLIUM. COBALT CAN BE USED AS WELL AS THE PREFERRED NICKEL. IN THE METALLIC COMPOSITIONS, ABRASIONRESISTANT PARTICLES SUCH AS METAL CARBIDES CAN BE PRESENT IN THE SOFT MATRIX OF NICKEL AND THALLIUM. THE COATING CAN BE HEAT-TREATED AT 300 TO 500*C. TO ACHIEVE OPTIMUM METALLURGICAL STRUCTURE. SHAPED STRUCTURES SUBJECT TO WEAR, SUCH AS PISTON RINGS AND BEARINGS, AND STRUCTURES SUBJECTED TO CUTTING ACTION, SUCH AS TWIST DRILLS, ARE PARTICULARLY BENEFITED BY THE COATINGS.

Electrosensitive recording thermal development processes for sheets

Abstract: 1275929 Electrosensitive compositions SONY CORP 17 July 1969 [20 July 1968] 36084/69 Heading C3P [Also in Divisions B6 C4 and D2] Compositions used in making sheets for use in a recording process (see Division D2) comprise in the Examples: (1) a solution in toluene of a styrene-butadiene copolymer, nickel acetate, sodium hypophosphite, conductive tin oxide, and titanium oxide milled in a ball mill; a mixture of the same copolymer solution, metallic zinc powder and zinc oxide; (2) a solution in dioxan of polyvinyl butyral and polyvinyl chloride, nickel formate, sodium hypophosphite, aluminium powder, conductive tin oxide and titanium oxide; (3) a solution in dioxan and methyl ethyl ketone of polyvinyl formal, nickel acetate, sodium hypophosphite, conductive tin oxide powder, titanium oxide and sodium acetate; (4) a solution in dioxan and methyl ethyl ketone of polyvinyl formal, nickel acetate, aluminium powder, titanium dioxide and potassium fluoride; a solution in dioxan and methyl ethyl ketone of polyvinyl formal, sodium hypophosphite and titanium oxide; (5) a solution in dioxan of polyvinyl formal, sodium hypophosphite, aluminium powder and titanium oxide; a solution in dioxan and methyl ethyl ketone of polyvinyl formal and nickel acetate; (6) polyvinyl formal, nickel hypophosphite, sodium succinate, titanium oxide and dioxan mixed in a ball mill; styrene-butadiene copolymer, conductive tin oxide powder, nickel hypophosphite, sodium succinate and toluene; (7) polyvinyl formal, copper formate, sodium citrate, titanium oxide and dioxan mixed in a ball mill; styrene-butadiene copolymer, conductive tin oxide powder, copper formate sodium citrate and toluene mixed in a ball mill. The conductive tin oxide of the examples is made by coprecipitating hydroxides of tin and antimony with ammonia in a solution of tin chloride mixed with a small proportion of antimony chloride, heating and pulverizing.

Brilliant colour nickel coated flake pigmen - ts

Abstract: Flake pigments having wide use in coatings, plastics pigments etc. are prepared by dispersing a surface-conditioned flake substrate in a slightly acid dilute nickel salt solution at above 55 degrees C and containing less than 1% by wt. of salt, and rapidly depositing a nickel coat on the substrate by adding sodium hypophosphite. Suitable flake substrates are mica or glass particles of surface 1.0 to 4.5 m/2 gram pretreated with a combination of stannous chloride and palladous chloride metal salts.

Process for providing contacts on a semiconductor body

Abstract: Contacts on a semiconductor body are formed by depositing a nickel coating through reduction of a nickel salt with sodium hypophosphite, followed by treating the semiconductor with a solvent for elemental yellow phosphorus to remove phosphorus from the contact area.

Improvements in or relating to electrical resistors

Abstract: 1,149,512. Reistors. WELWYN ELECTRIC Ltd. 27 Sept., 1967 [27 Sept., 1966], No. 43028/66. Heading H1S. [Also in Division C7] A precision resistor comprising an insulating former has deposited thereon an electrical resistance film of a nickel-phosphorus alloy having a surface resistivity in the range of from 0A01 ohm to 1 Megohm per square, said alloy containing from 5 to 20% by weight of phosphorus, said film having a thickness of at least 150S and the root-mean-square deviation of film thickness between different samples of area with a dimension greater than 0A01 cm. x 0A01 cm. being at most 8% of the mean thickness at the lowest resistance value and at most 4% at the highest resistance value. In a process for producing such resistors, and which is used to produce simultaneously a quantity of resistors, formers of, e.g. porcelain, steatite, alumina or other ceramic or plastics material, are cleaned and activated by rinsing in a solution of a stannous salt (i.e. stannous chloride) which may contain hydrochloric acid, rinsing in water and then rinsing in a solution of a palladium salt (i.e. palladium chloride), which may contain hydrochloric acid, to deposit at least a uni-molecular layer of palladium on the former, washing the former and then treating it with a reactivating solution containing from 0A1 to 2A5% weight/ volume of sodium hypophosphite or an equivalent amount of other water soluble hypophosphite (i.e. alkali or alkaline earth metal hypophosphite such as potassium- or calcumihypophosphite), and from 0A00005 to 0A005% weight/volume of nickel salt in solution at a temperature suitable for deposition of the nickelphosphorus film, and for a time sufficient to restore the activity of the palladium layer, then effecting electroless deposition of the nickelphosphorus film, and stabilizing the film by heating. The resistivity of the film depends on the substrate, activity of the palladium film, temperature, time of deposition as well as the concentration of nickel and phosphorus. Phosphorus can be removed from the film by washing with alkali solutions. The value of the resistor is adjusted after deposition by known methods, and one or more insulating layers, e.g. pigmented variable prepared from a silicone lacquer, followed by another layer, e.g. a pigmented varnish prepared from an epoxy lacquer and hardener, are finally applied. A number of examples and other details are described.

Method of Metallizing Non-metallic Articles, predominantly with Nickel

Abstract: 1,159,844. Coating with metals. NAUCHNOISSLEDOVATELSKY INSTITUT PHIZIKI POLUPROVODNIKOVYKH PRIBOROV. June 2, 1967, No.25600/67. Heading C7F. Non-metallic surfaces, e.g. piezoids and ceramics, are electroless plated with e.g. Ni by first contacting with a solution of stannous chloride in hydrochloric acid containing 0A2 to 2A0 g. /1. of a surface active agent which is polyethyleneglycol naphthenate or polyethyleneglycol anhydroxylite oleate, followed by a solution of palladium chloride. A nickel plating solution (#H 4A5 to 5A5) comprises (g. /1.) malonic acid 20 nickel chloride 20, sodium hypophosphite 16, sodium succinate 15. The plated article may be heated at e.g. 350‹C. for 30 to 60 minutes. The nickel may be subsequently lead or tin soldered.