Showing papers on "Substrate (printing) published in 1979"

Method for fabricating articles by sequential layer deposition

Abstract: A method is described for the production of bulk rapidly solidified metallic articles of near-net shape, by depositing multiple thin layers of feedstock using an energy beam to fuse each layer onto a substrate. The feedstock may be in the form of metal powder or wire. Different finished geometries are also described.

Process of doping silver image in chalcogenide layer

Abstract: A layer of a chalcogenide glass resist material, on a substrate on which a microlithographic pattern is to be formed, has a deposit of silver halide on its outer surface. By actinic irradiation a latent silver image replicating the desired pattern is formed in the silver halide deposit. This image is developed to a metallic silver, which is used to photodope the resist material for subsequent etching to produce the microlithographic pattern on the substrate. Positive and negative patterns are possible from the same starting laminate. One form of a microlithographic pattern is a mask for producing electronic circuits.

Microelectrode and assembly for parallel recording of neurol groups

Abstract: A multi-microelectrode has a plurality of sensing elements formed in a linear array along a face of a metal foil substrate. The foil substrate is sufficiently rigid and tough to have a very small volume along a needle length yet support the array of sensing elements and their leads. The preferred substrate materials are tungsten and molybdenum. The leads are insulated from the substrate and from the surrounding environment. A multi-microelectrode is supported in a microelectrode assembly by a connector which includes a guide channel on a support plate. Electrical contacts which may be conformable to the microelectrode are located in the guide channel, and the microelectrode is clamped against those contacts.

Method of forming semiconducting materials and barriers

Abstract: In a gaseous glow-discharge process for coating a substrate with semiconductor material, a variable electric field in the region of the substrate and the pressure of the gaseous material are controlled to produce a uniform coating having useful semiconducting properties. Electrodes having concave and cylindrical configurations are used to produce a spacially varying electric field. Twin electrodes are used to enable the use of an AC power supply and collect a substantial part of the coating on the substrate. Solid semiconductor material is evaporated and sputtered into the glow discharge to control the discharge and improve the coating. Schottky barrier and solar cell structures are fabricated from the semiconductor coating. Activated nitrogen species is used to increase the barrier height of Schottky barriers.

Spin coating process

Abstract: A process for spin coating a substrate such as a semi-conductor wafer uniformly with a coating solution such as a photographic emulsion by rotating the substrate at a first speed while simultaneously applying the coating solution at a radially moving position. Once the substrate has been initially covered, the speed of rotation of the substrate is increased and rotation continues until a uniform coating is obtained.

Methods and apparatus for bonding an article to a metallized substrate

Abstract: A chip carrier (5) having a plurality of first ends (21--21) is aligned with and bonded to mating lands (34--34) on a PCB substrate (31) by positioning the carrier in a recess of a nozzle (66) on the tool and directing individual streams of hot gas horizontally onto the terminals and lands to cause previously deposited solder thereon to reflow to bond the articles together. Alternatively, articles bonded with reflowable material may be de-bonded in a like manner.

Multi-layered glass-ceramic substrate for mounting of semiconductor device

Abstract: A method for fabricating an interconnection package for a plurality of semiconductor chips which include the fabrication of a multi-layered glass-ceramic superstructure with a multi-layered distribution of conductors on a preformed multi-layered glass-ceramic base, by the repeatable steps of depositing a conductor pattern on the base and forming thereon a crystallizable glass dielectric layer which is then crystallized to a glass-ceramic prior to further additions of conductor patterns and crystallizable glass layers to form a monolithic compatible substrate all through. Semiconductor chips can be electrically connected to expose conductor patterns at the top surface of the resultant glass-ceramic package.

Melt transfer web

Abstract: A melt transfer web useful for transferring pre-printed inked graphic patterns onto natural or synthetic base fabric sheets, as well as other porous, semi-porous or non-porous material workpieces, is disclosed The transfer web is comprised of a flexible, heat-stable substrate, preferably a saturated paper having a top surface coated with a first film layer of a given polymer serving as a heat-separable layer, and a second film layer superposed on the first film layer and comprised of another given polymer selected to cooperate with the first film layer to form a laminate having specific adhesion to porous, semi-porous or non-porous materials when heat softened For use in the melt transfer process, the coated surface has printed thereon with compatible inks, any desired pattern or design Decorating or printing workpieces is effected by contacting the workpieces with the printed surface of the melt transfer web and hot pressing the assembly at a suitable temperature and pressure for a predetermined period of time, to transfer the polymeric laminate to the workpiece While the assembly is still hot, the substrate is peeled away and the printed pattern along with the second film layer which now overcoats the pattern and a major portion of the first film layer which is released from the substrate during the peeling process are transferred onto the workpiece The transferred first and second film layers adhesively bond the inked pattern onto the workpieces in a manner which does not substantially degrade the physical properties, touch, feel and washability of the workpiece

Electrophotographic plate comprising a conductive substrate and a photosensitive layer containing an organic photoconductor layer composed of a hydrazone compound

Abstract: An electrophotographic plate comprising a conductive substrate and a photosensitive layer containing an organic photoconductor layer composed of a hydrazone compound represented by the general formula (I): ##STR1## (wherein R1 and R2 are an alkyl, aralkyl or aryl group which may or may not have a substituent, n is a number of 1 or 2, and A is an aromatic hydrocarbyl group or aromatic heterocyclic group which may or may not have a substituent) and a binder.

Ceramic faced structures and methods for manufacture thereof

Abstract: CERAMIC FACED STRUCTURES AND METHODS FOR MANUFACTURE THEREOF ABSTRACT OF THE DISCLOSURE A method of adhering a ceramic facing material to an underlying substrate is disclosed. Substrates to which the concepts apply include unsupported low modulus, porous wire pads as well as low modulus, porous wire pads backed by a solid metallic form. The ceramic application techniques employed are centered around the impregnation of the regions of the pad to be ceramic coated with an underlayment coating, such as MCrAlY material. Deep penetration of the underlayment material into the pad is achieved with a high velocity, spraying process. Ceramic material is applied over the underlayment material by conventional spraying techniques. Articles of manufacture which are suited to fabrica-tion in accordance with the concepts disclosed herein include, but are not limited to, outer air seals, combustion chambers, and airfoils of gas turbine engines.

Method and apparatus for controlling plasma etching

Abstract: A method and apparatus are disclosed for controlling plasma etching processes in which a thin layer is etched away to expose a substrate. Coherent light is directed onto the surface being etched, so that the change in reflectivity of the surface upon exposure of the underlying substrate produces a detectable change in the characteristics of the light reflected. A derivative detector having a variable timer is provided to sample continuously the reflected light and provide a control signal in response to a predetermined change in the characteristics of the light reflected, which is used to terminate the plasma etch process before an overetch condition occurs. The method and apparatus of the invention will detect a desired end point of etching through insulation to an underlying metal substrate, through metal to an underlying insulation substrate, through one insulation type to an underlying substrate of another insulation type and through one metal to an underlying substrate of another metal.

Substrate coupled floating gate memory cell

Abstract: Nonvolatile semiconductor electrically-alterable, floating-gate memory methods and devices which utilize substrate coupling for self-regulated, tunnel-current-shaping to provide improved device characteristics. The substrate coupling also facilitates the cell interconnection to other circuit elements.

Method of polishing a semiconductor wafer

Abstract: A semiconductor wafer (31) is placed on a non-porous, flat, substrate (10), with a thin layer of water (21) interposed therebetween. The substrate (10) with the wafer (31) thereon is placed in a polishing machine (40) where a rotating polishing pad (43) polishes the wafer which is permitted to float free and rotate on the thin layer of water (21) during the polishing operation.

Process for coating a metallic surface with a wear-resistant material

Abstract: The surface of a metallic substrate is coated with wear-resistant material by depositing on the surface a layer of a mixture of a coating powder including a metallic carbide with powdery silicon and heating said layer by exposure to a source of high density energy to bring about simultaneous evaporation of said silicon and fusion of said coating powder with bonding to said substrate. A coating of high surface porosity can be obtained. The substrate may be a piston ring for heavy-duty internal combustion engines.

Manufacture of thinned substrate imagers

Abstract: The front surface of a semiconductor wafer and the peripheral edge of the back surface of the wafer are protected by either coating them or by placing the wafer in a special fixture. The so protected wafer is then placed in a chemical bath and thinned to the desired thickness over the entire center region of the back surface. Then a sheet of glass which fits into the thin region within the unthinned rim on the back surface is glued to the back surface to provide a laminated structure. Next, the individual imager devices are separated from one another by cutting through the glass and thinned substrate along lines between the devices.

Solar panel module

Abstract: A solar panel module is provided, wherein a plurality of solar panel units are electrically interconnected and supported within a low cost frame assembly, which may conveniently be formed from wood products. Each solar panel unit is provided with extending conductors for electrical connections with adjacent solar panels. Each solar panel unit is formed in a back-wall configuration where solar radiation is incident on a transparent vitreous substrate. The panel surface opposite the substrate is sealed, preferably with a bituminous material, to minimize permeation of the solar panel by environmental elements. The sealing material cooperates with the frame to provide an insulated exposed surface. In one embodiment, the completed module is formed to external dimensions generally standard in the building industry for easy installation.

Vacuum deposition system and method

Abstract: A large scale vacuum deposition facility is disclosed in which substrates, in the form of architectural glass lights on supporting racks, are moved through an evacuated working chamber system where the substrates are coated by cathodic sputtering The substrate racks are moved by a conveyor system through the working chamber system via an access chamber system, enabling substantially continuous production of coated substrates without requiring the working chamber system be opened to atmosphere Operation of the working chamber system, the access chamber system, the conveyor system and associated components is monitored and governed from a process control console

Method for applying a hot melt adhesive pattern to a moving substrate

Abstract: Hot melt adhesive is applied to a moving substrate in a pattern including at least two lines which extend transversely to one another, by conveying the substrate past a nozzle orifice through which a first line of molten adhesive is applied, as by extrusion, to the substrate parallel to the direction of substrate movement and, while continuing to move the substrate in the same direction, projecting another portion of the molten hot melt adhesive onto the substrate as a burst in the form of a flat sheet issuing from a fan spray orifice, this orifice being oriented so that the sheet is projected transversely to the direction of substrate movement, and terminating the burst so rapidly that the adhesive so projected is deposited on the moving substrate in the form of a line having a length in the crosswise direction that is several times its width.

Process for producing a silicone elastomer emulsion and use thereof

Abstract: A latex of crosslinked silicone is prepared by emulsifying a vinyl endblocked polydiorganosiloxane and an organosilicon compound having silicon-bonded hydrogen atoms with water and surfactant, adding a platinum catalyst and then heating the emulsion to form the latex. Colloidal silica can be added to the latex to provide a product which is tougher. The water in the latex can be evaporated to provide an elastomer film. Coating the latex on a substrate, such as a textile or paper, provides an elastomeric coated substrate, which provides water repellency, insulation and release properties to the substrate.

Catalyst comprising a metal substrate

Abstract: A catalyst comprising a metal or alloy substrate, an oxidation resistant coating applied to the substrate, the coating comprising aluminum metal powder in a ceramic binder, a high surface area catalytic washcoat over the oxidation resistant coating and a catalytically active material, eg a platinum group metal, associated with the washcoat

Field effect devices and their fabrication

Abstract: A method of fabricating a field effect transistor comprising the steps of forming an active layer of semiconductor material (GaAs) over a surface of a first substrate of semiconductor material (GaAs), applying a second substrate of insulating material, e.g. glass, over the surface of the active layer, removing the first substrate so that the active layer is now supported on the insulating second substrate, and forming source, drain and gate electrodes over the free surface of the active layer. To facilitate removal of the GaAs first substrate by selective etching, a buffer layer of GaAlAs resistant to the GaAs etchant, may be formed between the active layer and the first substrate, which buffer layer is removed, following removal of first substrate, using a selective etchant to which the GaAs active layer is resistant. The technique is particularly applicable to high frequency FETs requiring a very thin active channel region interfaced to a substrate having good insulating properties.

Signal coupling element for substrate-mounted optical transducers

Abstract: Where a solid state optical transducer is mounted on a ceramic substrate, an improved optical signal path is provided by adding a preformed hole to the substrate in alignment with the active region of the transducer. A metal pin having a light transmitting core is inserted into the preformed hole using the same pin insertion techniques used to secure other solid pins to the substrate. The core provides an optical signal path while the cylindrical metal pin can be used both as a heat sink and to provide an additional electrical path to the transducer.

Semiconductor embedded layer technology including permeable base transistor, fabrication method

Abstract: A layer of material such as the metal base of a transistor is embedded in single crystal. A layer of the material with small, uniformly dimensioned and uniformly spaced openings is formed on a single crystal substrate, and the single crystal is grown from the exposed portions of the substrate over the layer of material. For best results, the layer of material to be embedded is deposited relative to the crystal orientation to provide a much greater rate of crystal growth laterally across the layer than away from the crystal substrate. The method is particularly useful in fabricating a permeable base transistor having slits formed in the metal base layer. An integrated circuit can be fabricated by forming a pattern of conductive material on a single crystal, that pattern having continuous regions which inhibit further crystal growth and narrow regions or regions having openings therein which permit lateral crystal growth across those regions. In that way, the conductive pattern is selectively embedded with the continuous regions left exposed after crystal growth. Connections can be made between the exposed regions and a pattern on the new crystal layer. This method has particular usefulness in fabricating multi-level integrated circuits.

Copper conductor compositions containing copper oxide and Bi{hd 2{b O{HD 3{B -based glass

Abstract: Compositions useful for making electrical conductor patterns on a nonconductive (dielectric) substrate, the compositions comprising certain proportions of finely divided copper, copper oxide and glass powders, dispersed in a vehicle. The compositions may be printed on a substrate and fired in a neutral atmosphere to produce conductor patterns adherent to the substrate.

Multi-layer coating protective film form

Abstract: An article with multi-layer protective coatings, comprising a substrate and two protective coating layers, in which said protective coating layers consist of a vacuum-coated ceramic layer and a resin layer, coated in any desired order.

Identification card with hallmarks adapted to be inspected by transmitted and incident light and a process for the production thereof

Abstract: A hallmark for example for a solid plastic identification card consisting of a plurality of layers is described. The hallmark is formed by means of only partially overlapping color coatings on a monochromatic or monochromatically printed substrate foil. More plastic foils are laminated onto the substrate foil, if desired. Single-layer printed portions of the surface appear bright in transmitted light and dark in incident light; multi-layer printed portions of the surface appear dark in transmitted light and bright in incident light, thus producing a watermark-like effect.

Method of metallizing materials

Abstract: A method of metallizing materials by coating a substrate material with a hydrophilic composite material; electrolessly metal plating the hydrophilic composite material with a metal to render the surface conductive; followed by electroplating a metal onto the conductive surface. The method can, for example, be utilized to produce metallized foams, embossing plates for reproduction of grains and textures, and decorative coatings for substrate materials.

X-ray mask

Abstract: An X-ray transparent mask (51) is comprised of a support ring (42) with a planar substrate stabilizer (41) thereon, the stabilizer having a plurality of apertures (43) therethrough, arranged in a "checkerboard" fashion. A thin X-ray transparent mask substrate (52) is placed over the stabilizer (41), the substrate having X-ray absorptive metallized patterns (53) thereon which are aligned with the apertures (43). The mask (51) is positioned proximate a semiconductor wafer (56) having a photoresist coating (30) thereon. X-rays (14) are directed at the photoresist coating (30) through the apertures (43) to selectively expose the coating. The mask (51) is then indexed one aperture position and the remaining portion of coating (30) is exposed to the X-rays (14).

Air treating device

Abstract: An air treating device in which the exhaustion of the operative fluid is visually signaled by a run-out signal system. The operative fluid and an immiscible signal fluid are held in a reservoir having associated therewith a substrate that selectively first wicks the operative fluid onto the evaporative surface portion of said substrate and, when the operative fluid is substantially depleted, the substrate then transports the signal fluid to the evaporative surface. The signal fluid is of a different hue from the operative fluid to provide an easily observed signal denoting exhaustion of the operative fluid.