Showing papers on "Substrate (printing) published in 1984"

Wire and cable

Abstract: An article of manufacture, for example a conductor (1) for an electrical wire or cable, is provided with a refractory coating (2) preferably formed from a refractory metal or semi-metal oxide or nitride and preferably deposited on the surface of the article by a vacuum deposition process such as a sputter ion plating method. Adhesion of the refractory coating, especially at high temperatures may be improved, and migration of the substrate metal (1) through the coating (2) may be suppressed, by varying the stoichiometry of the coating through its thickness and/or by the provision of a metallic or refractory intermediate layer. The articles are particularly suitable for use in circuit and signal integrity cables.

Coatings on glass

Abstract: Introduction and history composition, structure and properties of inorganic and organic glasses nature of a surface cleaning of substrate surfaces glass and thin films film formation methods film thickness properties of thin films applications of coatings on glass.

Silver halide photosensitive material

Abstract: PURPOSE:To obtain the entitled material having a backing layer nonpeeled during handling, by forming the light absorbing backing layer contg a specified compd on one side of a glass substrate having a silver halide emulsion layer on the other side CONSTITUTION:A silver halide photosensitive material suitable for the masking material of microelectronic integrated circuit is obtained by coating and drying one side of a glass substrate having a silver halide emulsion layer on the other side with a coating soln obtd by dissolving in a solvent, 1g binder made of a copolymer of a vinyl type unsatd acid or salt, such as acrylic acid, and a hydrophobic alpha,beta-vinyl type satd monomer, such as styrene, 001-10g light absorbing substance, such as naphthol green, and a compd having the shown formula in which R1 is 1-8C optionally substd alkoxy, (a) is 0-3, B is 1 or 2, and 1<=a+ b<=3

Photosensitive planographic printing plate

Abstract: PURPOSE:To obtain an inexpensive base for a planographic printing plate having favorable contamination resistance and high durability to printing, by a construction wherein a hydrophilic surface of a plastic layer laminated on a substrate is roughened, and a microporous layer is laminated on the roughened surface. CONSTITUTION:The surface of a plastic film 2 is roughened, then a microporous layer 7 having an open pore diameter of 0.5-5mum is laminated thereon, thereafter a hydrophilic layer 8 is provided, if required, at the laminating surface between the roughened surface and the microporous layer 7, and the resultant laminate is laminated on a substrate 4 through an adhesive layer 3 to obtain a base. A photo-solubilizable type or photo-insolubilizable type photosensitive layer 1 is provided on the base by coating, to obtain a laminate photosensitive planographic printing plate. The printing plate is exposed imagewise to light, and is subjected to a developing treatment, whereby an undissolved image part 5 and a dissolved non-image part 6 are formed.

Light-emitting diode

Abstract: A light-emitting element of a light-emitting diode is mounted on a lead frame, stem or substrate, and is molded with resin so as to form a lens portion. A cap made of a light-transparent resin and having a hollow portion at the center thereof and an outer pheripheral surface, is mounted on the lens portion with the lens portion in the hollow portion thereof. The outer peripheral surface is formed approximately as a parabolic surface so as to reflect side directed light emitted from said light-emitting element toward an illumination output portion of the light-emitting diode. The lens portion and the cap may be integrally molded as one piece.

Anti-reflective coating

Abstract: A light absorbing medium to be interposed under photosensitive layers, such as a photo-resist for integrated circuit "chips" to eliminate defects caused by reflected light, has a polymer vehicle which can penetrate into small depressions of a substrate and form a thin, smooth and uniform coating The coating includes a light absorbing dye This light absorbing layer is imageable in the process The light absorbing material eliminates many of the defects caused by reflected light resulting in increased sharpness of the images in the photo-resist The material reduces the losses due to defects and increases the yield of useable product

Procedure for fabrication of microstructures over large areas using physical replication

Abstract: The present invention is an improved replication process which copies a master pattern onto an intermediate transfer mask which is then used to form a lithographic mask on the surface of a substrate. A pattern derived from the original master pattern is then produced in the substrate by an etching process.

Manufacture of color filter

Abstract: PURPOSE:To eliminate color shading and also to obtain a titled filter at a low cost by forming a dyeing film separated like a stripe, etc. on a substrate, and thereafter, executing the dyeing of the first color to the whole surface, and thereafter, repeating alternately dyeing-proof and dyeing, and forming successively plural color filters. CONSTITUTION:A metallic layer 20 is provided like a stripe or a mosaic on a substrate 21, and a dyeing base film 22 is formed on said layer. Subsequently, a photomask 43 having a prescribed light shielding pattern 42 is placed on the film 22, exposure and development are executed, and a groove 41 for separating each picture element like a stripe, etc. is provided on the metallic layer 20. Subsequently, the whole surface is formed to a resin film 22CY by the first color, for instance, a cyan dye bath. Subsequently, a photosensitive resin layer 23 is provided on the film 22CY, exposure and development are executed through the light shielding pattern, and a dyeing-proof film 28A is formed. Subsequently, the film 22CY which is not covered with the film 28A is all dyed by the second color, for instance, a green dye bath, and it is formed to a resin film 22G. In the same way, a resin film 22R of the third color, for instance, red is provided by repeating the dyeing-proof film 28B forming process, and in the end, the top coating is performed, and a color filter dyed separately to plural colors is obtained.

Cooling module for integrated circuit chips

Abstract: This invention concerns a cooling module for integrated circuit chips, characterized in that it is provided with cooling members through which a coolant circulates, and which are connected directly, or via insulating plates, to a plurality of integrated circuit chips mounted on a wiring substrate, and pipes which introduce the coolant into the cooling members and which have a resiliency which is high enough to enable the pipes to expand and contract in the direction perpendicular to the wiring substrate.

Manufacture of liquid-crystal panel

Abstract: PURPOSE:To obtain a panel which has the improve linearity and adhesion of a seal part by superposing the 2nd transparent substrate upon the 1st transparent substrate after a specific amount of liquid crystal was dropped thereon, cooling them to a low temperature until the liquid crystal is frozen, and removing excessive liquid crystal and sealing the circumferential part of the substrates with resin. CONSTITUTION:The specific amount of liquid crystal is dropped on the 1st transparent substrate and the 2nd transparent substrate 1' is put thereupon so that the liquid crystal is held to specific thickness; and they are cooled to freeze the liquid crystal 5, and its projecting part is removed. Then, the circumference of the substrates 1 and 1' and liquid crystal 3 is sealed with a sealant 6. Thus, the display device which has good linearity of the seal part, a wide display window, and superior adhesive strength of the seal part without the mixing of foams nor spread of sealing resin into the liquid-crystal layer is obtained in a shorter time than when an injection hole is formed in the liquid-crystal panel for injecting the liquid crystal.

Integrated circuit chip-and-substrate assembly

Abstract: In the interest of enhanced yield in the manufacture of "wafer-scale" integrated circuits an assembly of integrated circuit chips is made by placing chips on a substrate Chips have beveled edges as produced by crystallographically anisotropic chemical etching, and the substrate has wells, grooves, or openings having sloping walls Chips are positioned on the substrate by bringing sloping walls and beveled edges in juxtaposition, and circuitry on chips is connected to circuitry on the substrate

Thin film solar cell array

Abstract: A thin-film solar cell device in which multiple series-connected cell elements are formed in units which can then be readily joined together in either a series or parallel connection. At least two terminal electrodes are provided on the opposite side of the insulating substrate of each unit, connected to the respective end electrodes of the elements at the extreme ends on the obverse surface of the substrate. This may be done either by bending the flexible substrate around at opposite ends at angles of 180°, or by forming through-holes in the substrate at opposite ends and filling the through-holes with a conductive material. Units can then be joined merely by overlapping their edge portions and connecting them with a conductive adhesive.

Surface treatment apparatus

Abstract: A surface treatment apparatus comprising a vacuum chamber, means for introducing a gas into the vacuum chamber, a gas furnace for heating and activating the gas while it is being introduced, apertures for injecting the heated gas, and a substrate stage for holding a substrate of which the surface is to be treated by the injected gas. The gas that is heated and activated is blown onto the surface of the substrate to treat the surface without causing the surface to be damaged. Therefore, the apparatus can be employed very effectively for a process for producing semiconductor elements.

Micro-coaxial substrate

Abstract: A support board or substrate is disclosed for interconnecting various electronic components. One or more conductors are imbedded within the substrate for interconnecting the components. Each conductor is provided with shielding to permit the exchange of high frequency signals between the components without cross-coupled interference.

Additive adhesive based process for the manufacture of printed circuit boards

Abstract: An additive process, for manufacturing multiple- (single or double) sided printed circuit boards, which advantageously provides substantial adhesion, very fine resolution and significant manufacturing time and cost savings over prior art processes, is disclosed. Specifically, a seed layer, comprised of conductive particles, such as carbon, dispersed throughout a binder capable of adhering to an unclad insulating printed circuit board substrate, is first applied over pre-defined locations on each surface of the substrate above which corresponding portions of a conductive pattern are to appear. This seed layer is also applied to coat substantially all the surface area of the walls of one or more holes formed through the substrate which are, in turn, to become plated-through holes. Thereafter, a conductive layer, such as copper, is electrolytically plated onto the seed layer in order to produce the conductive pattern and the plated-through holes.

Method of applying a hydrophilic coating to a polymeric substrate and articles prepared thereby

Abstract: A method to impart increased lubricity to the surface of a polymeric substrate includes contacting the substrate with a solution of a hydrophilic polymer in a solvent and heating the substrate to evaporate the solvent. The substrate retains a coating of the hydrophilic polymer, which, when dry, has about the same lubricity as the uncoated substrate. When wet, the coating becomes significantly more lubricious than when dry. The invention includes articles which have a lubricious surface when wet prepared by the method of the invention.

Device for the presentation of information with rollable plastic substrate

Abstract: An information liquid crystal display device includes rows of liquid crystal elements for forming alpha-numeric characters. A single, lightweight, flexible, light transparent, plastic sheet supports the liquid crystal elements in an arrangement enabling roll up of the support for transport to a display window, for example, for attachment. No contrast-forming foil is included as a second support. The plastic support has contact formed on an edge thereof for connecting the liquid crystal elements to a microprocessor having a keyboard for inputting information for display for selected liquid crystal elements.

Chip Substrate Resistance Modeling Technique for Integrated Circuit Design

Abstract: With the advent of VLSI and the use of statistical simulation techniques to perform integrated circuit design, modeling of chip substrate resistance is becoming increasingly important to successful chip design. This paper will present a substrate resistance modeling technique which may be applied to the design of both FET and bipolar chips. After briefly presenting the theory behind the technique, we will describe its use in developing a substrate resistance model required for studying a disturb problem encountered with a high-speed array chip. The steps involved in building and simplifying the substrate model will be described. The effect on circuit simulations and noise sensitivity will then be shown.

Porous metal coating process and mold therefor

Abstract: A process and mold for applying a porous metal coating to a metal substrate or a portion thereof, especially for forming a medical prosthesis The substrate to be coated is cleaned, then positioned in a rigid mold of ceramic or metal material having a defined mold cavity The space between the mold cavity surface and the substrate is filled with a metal powder and the mold, powder and substrate assembly is pre-sintered The pre-sinter conditions are selected such that the powder lightly sinters together and adheres to the substrate, but not to the mold cavity surface After removal of the mold, the coated substrate is further sintered to obtain the proper desired bond strength and pore volume Sintering is carried out in a protective atmosphere

Electrostatic Powder Coating

Abstract: : The distribution of a liquid in an even, thin protective layer over a surface has for many years been the method adopted for either protecting the substrate and/or enhancing its appearance. Distribution of the coating, or paint, is usually effected by one of three ways: brush, roller or spraying. Liquid paint is widely used in manufacturing industries where invariably some type of coating is deposited on the finished product. Distribution of the paint by atomization into a fine aerosol lends itself very well to substrate coating, and numerous commercial coating systems are available. Some systems use air atomization while others adopt centrifugal forces for disruption of the continuous phase liquid into fine droplets. jg p.12

Glow discharge method of applying a carbon coating onto a substrate

Abstract: Disclosed is a method of forming a hard, carbonaceous film on a substrate and the hard carbonaceous film formed thereby. The hard carbonaceous film is formed by decomposing a gaseous hydrocarbon having carbon atoms tetrahedrally coordinated to carbon nearest neighbors through carbon-carbon single bonds. The gaseous hydrocarbon is decomposed in a radio frequency maintained plasma and the plasma decomposition products are deposited on a cathodic substrate. Optionally, fluorocarbons may be present in a decomposition gas.

Carbon composite article and method of making same

Abstract: A composite structural ceramic article and method of fabrication thereof. The article of the invention is specifically designed for use in high temperature, corrosive and erosive environments such as those found in heat engines, heat exchangers, stationary power equipments and industrial process equipments. The article comprises a porous carbon fibrous substrate or other suitable high temperature fibrous substrate which may include: a pyrolytic carbon or appropriate chemical vapor deposited sheath formed about each fiber of the substrate; a chemically vapor deposited metallic carbide, oxide, boride or nitride coating over the coated fibers of the substrate; and an impermeable metallic carbide, oxide, boride or nitride outer protective layer formed about the entire periphery of the coated substrate. In accordance with the method of the invention, the metallic coating is applied to the fibers in such a manner such that internal porosity of the article is precisely controlled and a flaw resistant, tough, non-catastrophic failing structural ceramic body is formed.

Directional accelerometer and its microlithographic fabrication process

Abstract: A directional accelerometer and a process for the microlithographic fabrication of such an accelerometer. The accelerometer includes a substrate having at least one recess to define at least one beam in the substrate. One of the ends of the beam is integrally formed with the remainder of the substrate. The beam, which is oriented in the first direction, is deformable into the recess in a second direction only, parallel to the substrate surface and perpendicular to the first direction. The second direction corresponds to the acceleration component to be measured. Electrical connections and contacts are formed in the substrate for the device measuring the deformations of the beam. These measurements make it possible to determine the acceleration components.

Vertical magnetic recording medium

Abstract: A vertical magnetic recording medium comprises a non-magnetic substrate, a permalloy film consisting of plural permalloy layers separated by at least one non-magnetic layer placed therein, each of said plurality of permalloy layers being 2000 Å or less thick, and a Co-Cr vertical magnetization film formed on the permalloy film directly or through another non-magnetic layer.

Multilayer coating and method

Abstract: Multilayer protective coatings that are applied over a substrate are disclosed that comprise a plurality of superimposed multilayer units. Each multilayer unit contains two or more superimposed thin layers in which at least two layers are compositionally different. The properties of the resulting coating are a combination of the properties of the individual layers. One layer of a multilayer unit may provide hardness or wear resistance and another layer may provide lubricity, for example. The thickness of the individual layers can be related to the microscopic surface relief of the substrate to which the protective coating is applied. One disclosed multilayer unit comprises three layers: an oxidation resistant layer; a nitride layer; and a layer of disordered boron and carbon material.

Method of coating a transparent substrate

Abstract: Optical filters, e.g. for reflecting infrared radiation while passing visible light radiation is made by applying to the silver reflective coating a protective coating of a metal oxide by magnetron cathode sputtering and only thereafter is the dereflective layer applied by magnetron cathode sputtering. The protective coating-oxygen partial pressure and coating rate are substantially less than the dereflective coating-oxygen partial pressure and coating rate. Apparently the protective coating prevents damage to the reflective coating.

Hydrophobic substrate with coating receptive to inks

Abstract: A recording material, comprising a hydrophobic substrate material with a polymeric coating, has excellent receptivity for inks that do not normally wet hydrophobic substrates. The substrate material is coated with a mixture of polyvinylpyrrolidone and a compatible matrix-forming polymer. The matrix-forming polymer is a material, such as gelatin or polyvinyl alcohol, that is swellable by water and insoluble at room temperature but soluble at elevated temperatures. A transparent base sheet, such as cellulose acetate or polyethylene terephthalate, can be coated with the mixture of polymers to provide a sheet material which can be used in ink jet printers and in pen-type graphics recorders, operating at normal speeds, to record large color-filled areas without puddling, running, or wetness and with high color density and excellent resolution.

Optical recording medium

Abstract: PURPOSE:To obtain an economical optical recording medium which provides good long-period conservation and evidence and has high efficiency of utilization by forming the 1st recording area made of recording material which allows the plural-time erasure and rewriting of information and the 2nd recording area made of recording material which disallows the erasure and rewriting on the same substrate. CONSTITUTION:A reflecting film layer 42 of Al, etc., with a high coefficient of reflection and the recording layer 410 consisting of an amorphous alloy film which is made of a rare earth element such as Gd, Tb, Dy, and Ho and transition metal such as Fe and Co and has an easy magnetization axis at right angles to the film surface are laminated on the substrate 406 in the 1st recording area. A recording film 411 made of Te or Bi itself, their compounds of C, As, Sb, O, etc., or mixture, etc., is formed directly on the substrate 406 in the 2nd recording area. The 1st recording area 410 is used as a temporary storage area for a program to be debugged or data to be processed as a working area, and the 2nd recording area 411 is used as a long-period storage area for a program after debugging or information after statistical processing.

Manufacture of semiconductor device

Abstract: PURPOSE:To unnecessitate several items to be used for fine adjustment which will be externally attached by a method wherein, after a part of semiconductor chip has been sealed, the lead of the circuit for fine adjustment located inside the chip is partially cut using a laser light, and the entire body is covered by a light-shielding member. CONSTITUTION:A semiconductor chip 2 is attached to a substrate 1, and a sealing is performed using transparent resin 3. A crystal vibrator 4 is soldered on exposed terminals T1 and T2, and oscillation frequency is measured. At this time, a desired oscillation frequency is obtained by selecting from a capacitor group 5. For example, when a capacitor G2 is to be removed, the lead on the line L is cut off using the laser light of a laser device 6. Then, the entire chip 1 is sealed by an opaque resin material for the purpose of preventing the penetration of alpha rays, and the semiconductor device is completed. According to this constitution, the size of the semiconductor can be made smaller and its manufacturing process can also be simplified.

Fragrance-releasing microcapsules on a see-through substrate

Abstract: Fragrance releasing appliques are provided which comprise a transparent or translucent substrate bearing microcapsules in a binder on one surface and an adhesive on the remaining surface.