Showing papers on "Substrate (printing) published in 1988"

Spatial light modulator

Abstract: A deflectable beam spatial light modulator formed from a structure of a reflecting layer, typically metal, on a spacer layer, typically photoresist, which in turn is on a substrate containing electronic addressing circuitry is disclosed. Also, the method of fabrication including a plasma etch after dicing of the substrate into chips is disclosed.

Physics and Applications of DIP Coating and Spin Coating

Abstract: Dip coating is a simple old way of depositing onto a substrate, especially small slabs and cylinders, a uniform thin film of liquid for solidification into a coating. The basic flow is steady, and in it film thickness is set by the competition among viscous force, capillary (surface tension) force and gravity. Thickness and uniformity can be sensitive to flow conditions in the liquid bath and gas overhead. The faster the substrate is withdrawn, the thicker the film deposited. This can be countered by using volatile solutes and combining rapid enough drying with the basic liquid flow. Then the physics grows more complicated, theoretical prediction of process performance more difficult, and control of the process more demanding. Outside product RD actually it is often modified.

Liquid crystal display element

Abstract: PURPOSE:To enable the entire surface of a liquid crystal display element to be seen clearly by setting the direction of a rubbing treatment to a curved line direction where main visual angle direction at respective positions on a substrate 1 are converged on a specific observing point, and thus converging the main visual angle directions on the optional position. CONSTITUTION:The rubbing direction 3 of an upper substrate 1 is as shown by curved lines which slant upward to right in the breadthwise direction of the upper substrate 1 and the curvature of the curved surfaces are so determined as to decrease gradually in the rightward direction along the lower edge of the upper substrate 1. The rubbing direction 4 of the lower substrate 2, on the other hand, is as shown by curved lines which slant down to right in the breadthwise direction of the lower substrate 1, and the curvature of the curved lines decrease gradually to left along the lower edge of the lower substrate 2 differently from the top substrate 1. Further, the main visual angle directions at all points A1-A3 where the rubbing directions of the upper and lower substrates 1 and 2 cross each other are converged on the specific observing point 5. Consequently, the substrate 1 and 2 where a liquid crystal display is made is viewed at the observing point 5 to obtain a clear image plane at any position.

Microelectrochemical sensor and sensor array

Abstract: The invention relates to a microelectrochemical electrode structure (10) comprising a monolithic substrate (12) having a front surface (14) and a back surface (16) facing generally away from one another, a first well (18) extending into the substrate from the front surface towards the back surface and ending in a first well bottom (20), and a first passage (22) extending into the substrate from the back surface to the first well bottom. A first electrode (24) is located wholly within the first well. A first conductor (26) in the first passage serves for electrically communicating the first electrode (24) to adjacent the back surface (16). A plurality of such electrode structures can be provided on a single substrate. The use of semiconductor processing technology allows the entire sensor to be extremely small. If desired, an integrated circuit (48) can be provided on the back surface of the substrate for amplifying or otherwise processing signals from the first electrode. Analysis can be carried out for vapors or dissolved species (ionic or non-ionic).

Wafer holding fixture for chemical reaction processes in rapid thermal processing equipment and method for making same

Abstract: A semiconductor wafer holding and support fixture having a low effective thermal mass comprises a planar surface having a recess for a wafer and consisting essentially of chemical vapor deposited silicon carbide. The wafer holder is specifically designed to isolate the wafer from regions of significant thermal mass of the holder. The wafer holder is particularly adapted for accomplishing chemical reactions in rapid thermal processing equipment in the fabrication of electronic integrated circuits. The method for making such an article comprises shaping a substrate, e.g. graphite, to provide a planar surface having a recess installing means for masking any regions of the substrate where silicon carbide is not desired, chemically vapor depositing a conformal outer coating of silicon carbide onto the substrate, removing the means for masking and removing the graphite by machining, drilling, grit-blasting, dissolving and/or burning.

Biopotential sensing device and method for making

Abstract: A printed circuit biopotential sensing device is provided which is particularly adapted for endocardial or other deep body applications. The device has a predetermined printed circuit pattern formed on a thin film substrate, the pattern having at least one electrode pad at its distal end, at least one terminal pad at the proximal end, and conductor means selectively interconnecting the electrode pads and terminal pads. The substrate is secured to, and is preferably wrapped around an elongated member which is preferably tube-shaped in a manner such that the electrodes are exposed at the distal end of the member, and the terminal pads at the proximal end of the substrate are utilized in forming a suitable connector from the device. By forming the conductors on only a selected fraction of the width of the substrate and overlapping the portion of the substrate containing the conductors during the helical wrapping process, the substrate insulates and protects the conductors and eliminates the need for a separate protective layer. The device may, for example, be a percutaneous catheter with the electrodes being formed at the distal end thereof, or may be a sensing probe which includes a sensing support member, such as a solid plastic member or a balloon which has the distal end of the substrate containing the electrode pads secured thereto.

Connecting structure for electronic part and method of manufacturing the same

Abstract: Disclosed is a connecting structure for electrically connecting an electronic part such as an LSI chip to a substrate and a method of manufacturing the same The present invention is suitable especially for electrical connection between a plurality of chips and a substrate which is required to have a function of absorbing a difference in thermal expansion in the horizontal direction and to deform in the vertical direction, and characterized in that a conductive flat spring having a height not more than the minimum length in the lateral direction is provided between the electronic part such as a chip and a wires substrate

Electrochemical microsensors and method of making such sensors

Abstract: Electrochemical microsensors formed of a substrate containing means for sensing potential or current, including active and passive electronic devices and electronic circuits, and a micromachined structure containing at least one cavity overlying the sensing means, wherein the structure and substrate are bonded together at a temperature less than about 400° C., in the absence of high voltage fields, using means not requiring highly planarized surfaces. A wide variety of materials can be utilized for both the substrate and overlying structure. Diverse embodiments are possible, having in common a cavity containing a chemically sensitive material and means for sensing potential or current. The resulting structural organization of materials transduces a chemical signal, such as concentration, to an electrical signal, which is then "processed" by the underlying FET or metallic connections. The present invention resolves the problems of the prior art in combining sensing devices with chemically sensitive material(s) to form a functional microsensor in a conveniently manufacturable fashion.

A review of the methods for the measurement of coating-substrate adhesion☆

Abstract: Modern coating techniques now offer the possibility of modifying the surface of an engineering component to achieve improvements in both performance and reliability. One important and often overriding factor is the degree of adhesion between the coating and its substrate, and the aim of this paper is to discuss the methods which can be used to assess this critical property of the coating-substrate system. The advantages and disadvantages of each technique, e.g. the pressure-sensitive tape test, indentation testing, the scratch test, laser methods etc., are reviewed.

Electrosurgical spatula blade with ceramic substrate

Abstract: A surgical cutting blade for use in an electrosurgical scalpel includes a thin flat ceramic substrate having a rounded tip where the edge portion of the substrate on the opposed major surfaces thereof are beveled. A pattern of metallization is provided on the opposed major surfaces of the blade substrate with the metallization extending over the tapered portions. The substrate is then back-ground to form a blunt edge extending between the tapered surfaces at the edge of the substrate. The metallization pattern further includes traces extending from the conductors along the blunt working edge of the blade to the handle receiving portion thereof and provide a means whereby RF energy may be conducted to the metallized working edge of the blade.

Optical recording medium

Abstract: PURPOSE:To rapidly and accurately make an access to an optical recording medium by setting up band-like areas each of which is pinched with respective reference lines out of juxtaposed plural lines as data track areas, providing track number parts on the part of the reference line or the data track area along its longitudinal direction and providing clock bits on the reference line. CONSTITUTION:Plural band-like reference lines 4 are juxtaposed on a recording medium 2 provided on a card type substrate 1 and the band-like area pinched with respective reference lines 4 are set up as the data track areas 3. A 1st track number part B1 and a 2nd track number part B2 are formed on the data track area 3 and band-like lines from a 1st leading part A1 up to the 1st track number part B2 and from a 2nd track number part B2 up to a 2nd leading part A2 are continuously formed on the reference line 4. In addition, clock bits 5 are provided on the reference line 4 corresponding to a data recording part C. Consequently, a card type optical recording medium on which many data tracks are arranged can be also rapidly and accurately accessed.

Coated article and method of manufacturing the article

Abstract: Disclosed is a coated article having a substrate with an adherent, abrasion resistant carbon coating. In a preferred examplification the coating is substantially transparent to visible light and partially absorbing to ultraviolet light. The coating has a relatively disordered portion at the substrate-coating interface and a relatively ordered portion remote from the substrate-coating interface. The coating is a microwave deposited coating with deposition initially at a low microwave energy, and thereafter at a high microwave energy.

Thermal transfer printing

Abstract: A retransfer intermediate sheet for receiving an image to be printed onto an article by thermal retransfer comprises a substrate; and an image-receiving coating on one side of the substrate for receiving an image by printing of dye-containing ink, the coating comprising a fluid-absorbing layer and a superposed dye management layer comprising functionalised polyvinyl alcohol and/or an ionic polymer. The dye management layer functions to reduce back diffusion and to increase dye transfer efficiency, resulting in production of printed images of improved optical density. The sheet can be heat-deformable, and finds particular use in printing on 3D articles, e.g. being heated and vacuum formed to conform to an article. The invention also covers a method of printing and an article bearing a printed image.

Scan and repeat high resolution projection lithography system

Abstract: This scan and repeat lithography system has high resolution capability, large effective image field size, and high substrate exposure speed, and comprises: (a) a substrate stage capable of scanning a substrate in one dimension and, when not scanning in said dimension, capable of moving laterally in a direction perpendicular to the scan direction so as to position the substrate for another scan; the substrate stage exposing the full substrate by breaking up the substrate area into parallel strips, and exposing each of the strips by scanning the length of the strip across a fixed illumination region; (b) a mask stage capable of scanning in the same direction as, and synchronized with, the substrate stage, at a speed faster than the substrate stage scanning speed by a certain ratio M; (c) an illumination subsystem having an effective source plane in the shape of a polygon, and capable of uniformly illuminating a polygon-shaped region on the mask; (d) a projection subsystem having an object-to-image reduction ratio M, and having a polygon-shaped image field of an area smaller than the desired effective image field size of the lithography system; and (e) provision of complementary exposures in an overlap region between the areas exposed by adjacent scans in such a way that a seam in the exposure dose distribution received on the substrate is absent between the scans, and such that the exposure dose delivered across the entire substance is uniform.

Method of forming a thin film by plasma CVD and apapratus for forming a thin film

Abstract: With the method and apparatus for forming a thin film by plasma CVD according to this invention, a substrate is disposed between a pair of feed-gas supplying electrodes, and plasma is generated by applying a high frequency electric power to the substrate as an object to be processed. Feed gas is supplied from the feed-gas supplying electrodes into the plasma and is activated, whereby a film is formed on the substrate. Therefore, a solid and fine thin film which has corrosion-resistive and abrasion-resistive properties is formed on the substrate.

Image marker device

Abstract: A marker device for body scanning which permits the location of internal parts of a patient's body by reference to image reference points produced by marks on the device attached to the surface of the patient's skin during the scanning process. The device comprises a flexible tape which includes a substrate with marks, usually lines, thereon, the substrate being relatively transparent to the scanning waves, while the reference lines are relatively opaque with respect thereto. The substrate is conveniently formed from plastic, while the reference lines are advantageously metallic in character, preferably copper strips. The substrate is ordinarily coated with a pressure sensitive adhesive to allow its attachment to the patients outer skin, and it may be perforated with holes to accommodate insertion of biopsy needles.

Printed microporous material

Abstract: Microporous material substrate comprising (1) a matrix consisting essentially of linear ultrahigh molecular weight polyolefin, (2) a large proportion of finely divided water-insoluble siliceous filler, and (3) interconnecting pores is printed with printing ink

An interconnect structure for PC boards and integrated circuits

Abstract: An interconnect structure for electrically coupling conductive paths (14′,28′) on two adjacent, rigid substrates, such as PC boards or IC chips, comprises a number of buttons (16) formed on a first substrate (12), and a number of contacts (28) formed on a second substrate (26). The buttons are elastically deformable, and include a resilient core (18) made from an organic material such as polyimide, and a metallic coating (20) formed over the core. The two substrates are compressed (F) between mounting plates such that the buttons (16) are pressed against the contacts (28) to make electrical contact.

Solid-state imaging apparatus

Abstract: This solid state imaging apparatus is provided within the tip part of an insertable part of an endoscope and is provided with an image forming optical system for forming images. This image forming optical system forms an optical image on the imaging surface of a solid state imaging chip provided in the rear of this image forming optical system. This solid state imaging chip is affixed to a circuit substrate extending substantially at right angles with the imaging surface and electrically connected with the solid state imaging chip. This circuit substrate is connected with a signal cable transmitting input and output signals of the solid state imaging chip.

Apparatus for atomic layer epitaxial growth

Abstract: An apparatus for carrying out atomic layer epitaxial growth of a thin semiconductor layer on a substrate surface has a cylindrical chamber in which a substrate holder is coaxially mounted so as to define an annular gap therebetween. The substrate holder can be in the form of a rotatable turbine wheel and a funnel-shaped hood introduces a reactant gas onto the substrate at an oblique angle.

Manufacture of semiconductor device

Abstract: PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a semiconductor device by simplifying the manufacturing process of a semiconductor device, having a reinforcing body for supporting a film substrate. SOLUTION: A wiring pattern 16 is formed on one face of a base film, and a loading part for jointing the electrode terminal formation face of a semiconductor element is formed on one face or the other face of the base, and an opening 15 at which the electrode terminal of the semiconductor element is exposed, when the semiconductor element is loaded is formed in this film substrate 12. Then, each film substrate 12 is separated piece by piece from a film substrate tape on which the plural film substrates 12 are continuously arranged, and the film substrate separated piece by piece is positioned and adhered to each reinforcing body 42 of a reinforcing body frame 40, on which the plural reinforcing bodies 42 having a housing hole 44 for housing the semiconductor element are continuously arranged. Then, the semiconductor element is supported by the film substrate 12 by adhering the electrode terminal formation face of the semiconductor element to the loading part exposed in the housing hole, the electrode terminal of the semiconductor element is electrically connected with a wiring pattern, and after the opening is resin-sealed, each reinforcing body is separated piece by piece from the reinforcing frame.

Process for applying reinforcing material to a diaper cover material

Abstract: A technique for adhering individual patches of substrate material to spaced-apart regions of a moving web layer comprises a transporting mechanism for moving the web layer and a supplying mechanism for providing a selected substrate material. An applicating mechanism deposits a selected coating of hotmelt adhesive onto the substrate material, and a regulating mechanism automatically maintains a selected cross-directional registry between the substrate material and the deposited coating of adhesive. The coated substrate is cooled, and a directing mechanism engages the coated substrate to feed it to a separating mechanism at a selected rate. The separating mechanism segments the coated substrate into individual patches. A phasing mechanism provides a selected spatial segregation between the individual patches, and an assemblying mechanism adhesively secures the segregated patches onto selected spaced regions of the moving web layer. An indexing mechanism selectively displaces the coated substrate material from the separating mechanism when the directing mechanism is disengaged from the substrate material.

Multi-readable information system

Abstract: A multi-readable information system includes a substrate material and one type of printed information that is readable by a first entity, such as information in machine readable bar code that is printed on an area of the substrate material A different type of printed information occupies the same field area of the substrate material, such as information in human-readable symbology that is printed in at least a portion of the area occupied by the bar code The bar code is printed in a first ink that can be read utilizing energy of a first wavelength and the human-readable symbols are printed in a second ink that can be read in a humanly visible wavelength The humanly visible ink absorbs insufficient energy in the first wavelength to prevent reading of the bar code by a bar code-reading machine and the bar code does not interfere with the readability of the human-readable symbols

Optical information recording medium

Abstract: PURPOSE:To improve mass productivity and to reduce production cost by using a polyolefin copolymer to form the substrate of an optical recording medium formed by providing a recording film on the substrate having tracking grooves on the surface and forming the recording film by coating an org. compd. film. CONSTITUTION:The substrate of the optical recording medium formed by providing the recording film on the substrate having the tracking grooves on the surface is formed by using a polyolefin (PO) resin, blended polymer essentially consisting of the PO resin, or copolymer essentially consisting of olefin. The recording film is formed by coating on the substrate. The substrate consisting of such PO resin can be prepd. by, for example, injection molding and is highly resistant to solvents. Even if, therefore, the recording film is formed by wet process coating, the dissipation of the tracking grooves of the substrate, the decreased reflectivity by the infiltration, etc., of the solvent, and the impaired focusing, tracking and signal reading out of a recording and reproducing device are obviated and the range of solvent selection is widened. The mass productivity is thereby enhanced, the cost is greatly reduced and the good performance is stably obtd.

Water resistant communications cable

Abstract: A communications cable comprising a core of at least one transmission medium and a plastic jacket includes provisions for preventing the movement of water within the cable. An impregnated tape (35) is interposed between the core and the jacket and is wrapped about the core to form a longitudinal overlapped seam. The tape comprises a substrate tape (37) which is impregnated with a superabsorbent material which upon contact with water swells and inhibits the further movement of the water. The tape and its thickness are controlled so that the thickness is minimal while the tensile strength of the tape and its porosity prior to impregnation are optimized.

Thermally-Responsive Record Material

Abstract: An improved heat-sensitive recording material is disclosed comprising a substrate, a binder, a chromogenic material, an electron-accepting color developer which reacts with said chromogenic material to form a color, and a color-stabilizing resin. The color stabilizing resin comprises an addition product of a diolefinic alkylated or alkenylated cyclic hydrocarbon or, an addition product of a phenol and a diolefinic alkylated or alkenylated cyclic hydrocarbon. The color-stabilizing resin, dye, and developer, have a weight percent resin phenolic group of about 5 or less. The heat-sensitive recording material has a fade index greater than 45. Imaged recording materials according to the invention resist fading when exposed to temperatures of 60°C for prolonged periods such as twenty-four hour oven tests.

Apparatus for sprayed adhesive diaper construction

Abstract: A distinctive method and apparatus for depositing a pattern of material, such as hot-melt adhesive, onto a substrate comprises a supplying mechanism for forming a first and at least a second substantially continuous stream of the selected material, and a gas-directing mechanism for forming a plurality of gas streams. The gas streams have selected velocities and are arranged to entrain the material streams to impart a swirling motion to each of the material streams as it moves toward the substrate. A transport mechanism moves the substrate relative to the supply mechanism along a selected machine direction. A regulating mechanism controls the supplying mechanism and gas-directing mechanism to direct the material stream in a selected path toward the substrate and deposit the material in adjacent semi-cycloidal patterns on the substrate while closely controlling a selected cross-directional positioning of one or more of the deposited patterns.

Silicon nitride electrosurgical blade

Abstract: An electrosurgical blade having a silicon nitride ceramic substrate having a beveled working edge with first and second conductive metal traces adhered to opposed side surfaces of the substrate along the working edge so as to be closely spaced relative to one another across the thickness dimension of the beveled working edge. Further conductive traces are formed on opposed sides of the substrate along the other edge of the substrate. In use, when a high RF voltage is applied between the traces extending along the working edge and the surgical blade is brought into contact with tissue, the relatively high current density causes relatively high heating to take place, bursting the cells and creating an incision. When a high RF voltage is applied between the traces separated by the width dimension of the substrate, the current density therebetween is significantly lower but sufficient to create enough heat to dehydrate tissue and blood cells whereby coagulation is achieved. The use of silicon nitride as the substrate material enhances the performance of the blade by inhibiting thermal runaway.

Disposable transdermal drug applicators

Abstract: A transdermal drug applicator for application to the skin or membrane of a patient and which is electrically powered The applicator includes a flexible, non-conductive substrate having a plurality of conductive coated areas The conductive coated areas include drug reservoir electrodes The flexible substrate and the conductive coated areas form a single, substantially flat, flexible member A plurality of separate drug reservoirs are in electrical contact with the drug reservoir electrodes At least one battery is connected in series with the drug reservoir electrodes The flexible substrate has opposed flat surfaces, the electrically conductive coated areas being electrically conductive coated areas on the flat surrfaces Electrical connection between the conductive coated areas in the vicinity of each reservoir is provided by electrically conductive material extending into a single hole, small holes, or slots which extend between the opposed surfaces of the substrate

Means for coupling an optical fiber to an opto-electronic device

Abstract: The disclosed means for coupling an optical fiber (52) and an opto-electronic device (e.g., LED, laser, or photodetector) (40) comprises a first body (10) having two substantially parallel major surfaces, with a recessed portion (a "well") (11) formed in one surface, and a through-aperture extending from the other surface to the well. Conductive means (21, 24) extend from the former surface onto the bottom of the well, and the opto-electronic device typically is mounted in the well such that the device does not protrude above the plane of the associated surface, such that the electrical contact is established between the device and the conductive means, and such that the active region of the device is centered upon the through-aperture. The first body is advantageously produced from a (100) Si wafer by means of standard Si processing techniques, including selective etching. The assembly can be mounted on a substrate, e.g., a Si wafer with appropriate metallization thereon, and the end of an optical fiber inserted into the through-aperture and secured to the first body. The assembly can be operated at relatively high speed, due to its relatively low parasitic capacitance and inductance, and can be mounted on the substrate in substantially the same was as IC chips are mounted, in close proximity to associated electrical components.