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Akira Yamauchi

Researcher at Keio University

Publications -  56
Citations -  530

Akira Yamauchi is an academic researcher from Keio University. The author has contributed to research in topics: Surface activated bonding & Anodic bonding. The author has an hindex of 13, co-authored 54 publications receiving 494 citations. Previous affiliations of Akira Yamauchi include Panasonic & Oki Electric Industry.

Papers
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Proceedings ArticleDOI

Surface activated bonding for new flip chip and bumpless interconnect systems

TL;DR: In this article, surface activated bonding (SAB) was introduced, which enables the bonding in an inert ambient atmosphere of N/sub 2,/ under atmospheric pressure, and decreased the process cost.
Journal ArticleDOI

Thyrotropin-producing microadenoma associated with pituitary resistance to thyroid hormone.

TL;DR: One year postoperatively, neither residual tumor nor recurrence were seen by computed tomography and magnetic resonance imaging, however TSH, as well as free T3 or T4, was still high and overresponsive to TRH.
Journal ArticleDOI

Combined Surface Activated Bonding Technique for Low-Temperature Cu/Dielectric Hybrid Bonding

TL;DR: In this paper, a combined surface activated bonding (SAB) technique for low-temperature Cu-Cu, SiO2-SiO2, and SiO 2-SiNx bonding is presented.
Proceedings ArticleDOI

A new wafer-bonder of ultra-high precision using surface activated bonding (SAB) concept

TL;DR: In this paper, a robot-controlled wafer bonding machine was developed for the bonding of different sizes of wafers ranging up to 8 inches diameter, which achieved a margin of error within /spl plusmn/1 /spl mu/m.