Many of the recent advances in enhancing the thermoelectric figure of merit are linked to nanoscale phenomena found both in bulk samples containing nanoscale constituents and in nanoscale samples themselves. Prior theoretical and experimental proof-of-principle studies on quantum-well superlattice and quantum-wire samples have now evolved into studies on bulk samples containing nanostructured constituents prepared by chemical or physical approaches. In this Review, nanostructural composites are shown to exhibit nanostructures and properties that show promise for thermoelectric applications, thus bringing together low-dimensional and bulk materials for thermoelectric applications. Particular emphasis is given in this Review to the ability to achieve 1) a simultaneous increase in the power factor and a decrease in the thermal conductivity in the same nanocomposite sample and for transport in the same direction and 2) lower values of the thermal conductivity in these nanocomposites as compared to alloy samples of the same chemical composition. The outlook for future research directions for nanocomposite thermoelectric materials is also discussed.

https://www.bc.edu/content/dam/files/schools/cas_sites/physics/pdf/Ren/AdvMater_19_1043_2007.pdf

New Directions for Low-Dimensional Thermoelectric Materials**

Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

A colloidal mixture of nano-sized particles in a base fluid, called nanofluids, tremendously enhances the heat transfer characteristics of the original fluid, and is ideally suited for practical applications due to its marvelous characteristics. This article addresses the unique features of nanofluids, such as enhancement of heat transfer, improvement in thermal conductivity, increase in surface volume ratio, Brownian motion, thermophoresis, etc. In addition, the article summarizes the recent research in experimental and theoretical studies on forced and free convective heat transfer in nanofluids, their thermo-physical properties and their applications, and identifies the challenges and opportunities for future research.

Enhancement of heat transfer using nanofluids—An overview

Cooling of photovoltaic cells under concentrated illumination: a critical review

Light emitting diodes reliability review

Condensation on Finned Surfaces

Heat Transfer Characteristics for a Single Fin in a Boiling Liquid

Three quarters of a century ago, a paper by Harper and Brown (1922) appeared as an NACA report. It was an elegant piece of work and appears to be the first really significant attempt to provide a mathematical analysis of the interesting interplay between convection and conduction in and upon a single extended surface. Harper and Brown called this a cooling fin, which later became known merely as a fin. It is most probable that Harper and Brown were the pioneers even though Jakob (1949) pointed out that published mathematical analyses of extended surfaces can be traced all the way back to 1789. At that time, Ingenhouss demonstrated the differences in thermal conductivity of severalmetals by fabricating rods, coating themwithwax, and then observing the melting pattern when the bases of the rods were heated. Jakob also pointed out that Fourier (1822) and Despretz (1822, 1828a,b) published mathematical analyses of the temperature variation of the metal bars or rods. Although these ancient endeavors may have been quite significant at the time they were written, it appears that the Harper–Brown work should be considered as the forerunner of what has become a burgeoning literature that pertains to a very significant subject area in the general field of heat transfer. The NACA report of Harper and Brown was inspired by a request from the EngineeringDivisionof theU.S.Armyand theU.S.BureauofStandards in connection with the heat-dissipating features of air-cooled aircraft engines. It is interesting to note that this request came less than halfway through the time period between the first flight of the Wright Brothers at Kitty Hawk and the actual establishment of the U.S. Air Force. The work considered longitudinal fins of rectangular profile and trapezoidal profile (which Harper and Brown called wedge-shaped fins) and radial fins of rectangular profile (which Harper and Brown called circumferential fins). It

Allan D. Kraus

Papers

Condensation on Finned Surfaces

Heat Transfer Characteristics for a Single Fin in a Boiling Liquid

Convection with Simplified Constraints

Longitudinal Fin Double‐Pipe Exchangers

Fins with Radiation