The science and technology of ultracapacitors are reviewed for a number of electrode materials, including carbon, mixed metal oxides, and conducting polymers. More work has been done using microporous carbons than with the other materials and most of the commercially available devices use carbon electrodes and an organic electrolytes. The energy density of these devices is 3¯5 Wh/kg with a power density of 300¯500 W/kg for high efficiency (90¯95%) charge/discharges. Projections of future developments using carbon indicate that energy densities of 10 Wh/kg or higher are likely with power densities of 1¯2 kW/kg. A key problem in the fabrication of these advanced devices is the bonding of the thin electrodes to a current collector such the contact resistance is less than 0.1 cm2. Special attention is given in the paper to comparing the power density characteristics of ultracapacitors and batteries. The comparisons should be made at the same charge/discharge efficiency.

Ultracapacitors: Why, How, and Where is the Technology

Radio frequency (RF) energy transfer and harvesting techniques have recently become alternative methods to power the next-generation wireless networks As this emerging technology enables proactive energy replenishment of wireless devices, it is advantageous in supporting applications with quality-of-service requirements In this paper, we present a comprehensive literature review on the research progresses in wireless networks with RF energy harvesting capability, which is referred to as RF energy harvesting networks (RF-EHNs) First, we present an overview of the RF-EHNs including system architecture, RF energy harvesting techniques, and existing applications Then, we present the background in circuit design as well as the state-of-the-art circuitry implementations and review the communication protocols specially designed for RF-EHNs We also explore various key design issues in the development of RF-EHNs according to the network types, ie, single-hop networks, multiantenna networks, relay networks, and cognitive radio networks Finally, we envision some open research directions

Wireless Networks With RF Energy Harvesting: A Contemporary Survey

This tutorial presents an overview of the technological advances in millimeter-wave (mm-wave) circuit components, antennas, and propagation that will soon allow 60-GHz transceivers to provide multigigabit per second (multi-Gb/s) wireless communication data transfers in the consumer marketplace. Our goal is to help engineers understand the convergence of communications, circuits, and antennas, as the emerging world of subterahertz and terahertz wireless communications will require understanding at the intersections of these areas. This paper covers trends and recent accomplishments in a wide range of circuits and systems topics that must be understood to create massively broadband wireless communication systems of the future. In this paper, we present some evolving applications of massively broadband wireless communications, and use tables and graphs to show research progress from the literature on various radio system components, including on-chip and in-package antennas, radio-frequency (RF) power amplifiers (PAs), low-noise amplifiers (LNAs), voltage-controlled oscillators (VCOs), mixers, and analog-to-digital converters (ADCs). We focus primarily on silicon-based technologies, as these provide the best means of implementing very low-cost, highly integrated 60-GHz mm-wave circuits. In addition, the paper illuminates characterization techniques that are required to competently design and fabricate mm-wave devices in silicon, and illustrates effects of the 60-GHz RF propagation channel for both in-building and outdoor use. The paper concludes with an overview of the standardization and commercialization efforts for 60-GHz multi-Gb/s devices, and presents a novel way to compare the data rate versus power efficiency for future broadband devices.

http://faculty.poly.edu/~tsr/wp-content/uploads/publications/abstract17.pdf

State of the Art in 60-GHz Integrated Circuits and Systems for Wireless Communications

Polymer based MEMS and microfluidic devices have the advantages of mechanical flexibility, lower fabrication cost and faster processing over silicon based ones. Also, many polymer materials are considered biocompatible and can be used in biological applications. A valuable class of polymers for microfabricated devices is piezoelectric functional polymers. In addition to the normal advantages of polymers, piezoelectric polymers can be directly used as an active material in different transduction applications. This paper gives an overview of piezoelectric polymers based on their operating principle. This includes three main categories: bulk piezoelectric polymers, piezocomposites and voided charged polymers. State-of-the-art piezopolymers of each category are presented with a focus on fabrication techniques and material properties. A comparison between the different piezoelectric polymers and common inorganic piezoelectric materials (PZT, ZnO, AlN and PMN?PT) is also provided in terms of piezoelectric properties. The use of piezopolymers in different electromechanical devices is also presented. This includes tactile sensors, energy harvesters, acoustic transducers and inertial sensors.

https://iopscience.iop.org/article/10.1088/0964-1726/23/3/033001/pdf

A review of piezoelectric polymers as functional materials for electromechanical transducers

Wearable biosensors have received tremendous attention over the past decade owing to their great potential in predictive analytics and treatment toward personalized medicine. Flexible electronics could serve as an ideal platform for personalized wearable devices because of their unique properties such as light weight, low cost, high flexibility and great conformability. Unlike most reported flexible sensors that mainly track physical activities and vital signs, the new generation of wearable and flexible chemical sensors enables real-time, continuous and fast detection of accessible biomarkers from the human body, and allows for the collection of large-scale information about the individual's dynamic health status at the molecular level. In this article, we review and highlight recent advances in wearable and flexible sensors toward continuous and non-invasive molecular analysis in sweat, tears, saliva, interstitial fluid, blood, wound exudate as well as exhaled breath. The flexible platforms, sensing mechanisms, and device and system configurations employed for continuous monitoring are summarized. We also discuss the key challenges and opportunities of the wearable and flexible chemical sensors that lie ahead.

Wearable and flexible electronics for continuous molecular monitoring.

A radio frequency integrated circuit (RFIC) chip package is provided having an RFIC chip and an integrated antenna structure. The integrated antenna structure includes an on-chip antenna having one or more radiator elements formed as part of a back-end-of-line structure of the RFIC chip. The antenna structure further includes a superstrate structure disposed on the back-end-of-line structure of the RFIC chip. The superstrate structure includes at least one substrate layer and a focusing metal element. The focusing metal element has a structure that is complementary to the on-chip radiator elements and which is configured to focus electromagnetic radiation to and from the planar antenna structure. The superstrate structure improves the performance (e.g., antenna gain and bandwidth) of the on-chip antennas for millimeter-wave applications.

Package structures to improve on-chip antenna performance

This paper has presented a comprehensive overview of on-chip antennas, which remain the last bottleneck for achieving true SoC RF solutions. CMOS remains the mainstream IC technology choice but is not well suited for on-chip antennas, requiring the use of innovative design techniques to overcome its shortcomings. Codesign of circuits and antennas provide leverage to the designer to achieve optimum performance. The layout of on-chip antennas is dictated by foundry specific rules whereas characterization of on-chip antennas requires special text fixtures. For future highly integrated SoC solutions, foundries will have to provide special layers for efficient on-chip antenna implementations, as they currently do for on-chip inductors. In many of the emerging applications such as THz communication, implantable systems and energy harvesting, on-chip antennas have shown immense potential and are likely to play a major role in shaping up future communication systems.

The last barrier: on-chip antennas

A complete characterization of the inkjet printing process using metallic nanoparticle inks on a paper substrate for microwave frequencies up to 12.5 GHz as well as its application to low-cost, high gain and wideband antenna design are demonstrated in this work. Laser and heat sintering of metallic nanoparticles are compared on paper substrate for the first time which demonstrate immense cost and time benefits of laser sintering. The antennas fabricated using the characterized process include a Vivaldi for the UWB band which exhibits a significantly higher gain of up to 8 dBi as compared to the currently published inkjet printed antennas, and a novel slow-wave log periodic dipole array which employs a new miniaturization technique to show 20% width reduction.

Inkjet Printing of Novel Wideband and High Gain Antennas on Low-Cost Paper Substrate

The increasing energy demands of the world's population and the quickly diminishing fossil fuel reserves together suggest the urgent need to secure long-lasting alternative and renewable energy resources. Here, we present a THz antenna integrated with a rectifier (rectenna) for harvesting infrared energy. We demonstrate a resonant bowtie antenna that has been optimized to produce highly enhanced localized fields at the bow tip. To benefit from this enhancement, the rectifier is realized between the overlapped antenna's arms using a 0.7 nm copper oxide. The thin film diode offers low zero bias resistance of 500 Ω, thus improving the impedance matching with the antenna. In addition, the rectenna prototype demonstrates high zero bias responsivity (4 A/W), which is critical in producing DC current directly from THz signals without the application of an external electric source, particularly for energy harvesting applications.

/pdf/design-optimization-and-fabrication-of-a-28-3-thz-nano-3wv9vr95pd.pdf

Design, Optimization and Fabrication of a 28.3 THz Nano-Rectenna for Infrared Detection and Rectification

A low-cost inkjet-printed multiband antenna envisioned for integration into flexible and conformal mobile devices is presented. The antenna structure contains a novel triangular iterative design with coplanar waveguide (CPW) feed, printed on a Kapton polyimide-based flexible substrate with dimensions of $ 70\times 70\times 0.11~\hbox{mm}^{\bf 3}$ . The antenna covers four wide frequency bands with measured impedance bandwidths of 54.4%, 14%, 23.5% and 17.2%, centered at 1.2, 2.0, 2.6 and 3.4 GHz, respectively, thus, enabling it to cover GSM 900, GPS, UMTS, WLAN, ISM, Bluetooth, LTE 2300/2500 and WiMAX standards. The antenna has omnidirectional radiation pattern with a maximum gain of 2.1 dBi. To characterize the flexibility of the antenna, the fabricated prototype is tested in convex and concave bent configurations for radii of 78 mm and 59 mm. The overall performance remains unaffected, except a minor shift of 20 MHz and 60 MHz in S11, for concave bending at both radii. The compact, lightweight and conformal design as well as multiband performance in bent configurations, proves the suitability of the antenna for future electronic devices.

/pdf/a-compact-kapton-based-inkjet-printed-multiband-antenna-for-3dg8jqu2z1.pdf

Atif Shamim

Papers

Package structures to improve on-chip antenna performance

The last barrier: on-chip antennas

Inkjet Printing of Novel Wideband and High Gain Antennas on Low-Cost Paper Substrate

Design, Optimization and Fabrication of a 28.3 THz Nano-Rectenna for Infrared Detection and Rectification

A Compact Kapton-Based Inkjet-Printed Multiband Antenna for Flexible Wireless Devices