C
Cornelia K. Tsang
Researcher at IBM
Publications - 113
Citations - 4941
Cornelia K. Tsang is an academic researcher from IBM. The author has contributed to research in topics: Wafer & Silicon. The author has an hindex of 37, co-authored 113 publications receiving 4841 citations. Previous affiliations of Cornelia K. Tsang include Ultratech, Inc. & GlobalFoundries.
Papers
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Journal ArticleDOI
Three-dimensional silicon integration
John U. Knickerbocker,P.S. Andry,B. Dang,R. Horton,Mario J. Interrante,Chirag S. Patel,Robert J. Polastre,Katsuyuki Sakuma,R. Sirdeshmukh,Edmund J. Sprogis,Sri M. Sri-Jayantha,A. M. Stephens,Anna W. Topol,Cornelia K. Tsang,B. C. Webb,Steven L. Wright +15 more
TL;DR: 3D technology from IBM is highlighted, including demonstration test vehicles used to develop ground rules, collect data, and evaluate reliability, and examples of 3D emerging industry product applications that could create marketable systems are provided.
Patent
Package structures to improve on-chip antenna performance
TL;DR: In this paper, a radio frequency integrated circuit (RFIC) chip package is provided having an RFIC chip and an integrated antenna structure, which includes an on-chip antenna having one or more radiator elements formed as part of a back-end-of-line structure.
Journal ArticleDOI
Terabus: Terabit/Second-Class Card-Level Optical Interconnect Technologies
Laurent Schares,Jeffrey A. Kash,Fuad E. Doany,Clint L. Schow,Christian Schuster,Daniel M. Kuchta,Petar Pepeljugoski,Jeannine M. Trewhella,Christian W. Baks,Richard A. John,L. Shan,Young H. Kwark,Russell A. Budd,Punit P. Chiniwalla,Frank R. Libsch,J. Rosner,Cornelia K. Tsang,Chirag S. Patel,Jeremy D. Schaub,Roger Dangel,Folkert Horst,Bert Jan Offrein,D. Kucharski,D. Guckenberger,S. Hegde,H. Nyikal,Chao-Kun Lin,Ashish Tandon,Gary R. Trott,M. Nystrom,David P. Bour,M.R.T. Tan,D.W. Dolfi +32 more
TL;DR: In this paper, a chip-like optoelectronic packaging structure (Optochip), assembled directly onto an organic card (Optocard), is developed for supporting terabit/second chip-to-chip data transfers over organic cards within high-performance servers, switch routers, and other intensive computing systems.
Patent
Silicon chip carrier with conductive through-vias and method for fabricating same
Daniel C. Edelstein,Paul S. Andry,Leena Paivikki Buchwalter,Jon A. Casey,Sherif A. Goma,Raymond Robert Horton,Gareth G. Hougham,Michael Lane,Xiao Hu Liu,Chirag S. Patel,Edmund J. Sprogis,Michelle L. Steen,Brian R. Sundlof,Cornelia K. Tsang,George Frederick Walker +14 more
TL;DR: A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is more than or close to the substrate.
Journal ArticleDOI
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
John U. Knickerbocker,P.S. Andry,Leena Paivikki Buchwalter,Alina Deutsch,R. Horton,Keith A. Jenkins,Young H. Kwark,Gerard McVicker,Chirag S. Patel,Robert J. Polastre,Christian Schuster,Arun Sharma,Sri M. Sri-Jayantha,C.W. Surovic,Cornelia K. Tsang,Bucknell C. Webb,Steven L. Wright,Samuel McKnight,Edmund J. Sprogis,B. Dang +19 more
TL;DR: The technical challenges and recent progress made in the development of silicon carrier technology for potential new applications are described.