Geckos are exceptional in their ability to climb rapidly up smooth vertical surfaces1,2,3. Microscopy has shown that a gecko's foot has nearly five hundred thousand keratinous hairs or setae. Each 30–130 µm long seta is only one-tenth the diameter of a human hair and contains hundreds of projections terminating in 0.2–0.5 µm spatula-shaped structures2,4. After nearly a century of anatomical description2,4,5,6, here we report the first direct measurements of single setal force by using a two-dimensional micro-electro-mechanical systems force sensor7 and a wire as a force gauge. Measurements revealed that a seta is ten times more effective at adhesion than predicted from maximal estimates on whole animals. Adhesive force values support the hypothesis that individual seta operate by van der Waals forces8,9. The gecko's peculiar behaviour of toe uncurling and peeling2 led us to discover two aspects of setal function which increase their effectiveness. A unique macroscopic orientation and preloading of the seta increased attachment force 600-fold above that of frictional measurements of the material. Suitably orientated setae reduced the forces necessary to peel the toe by simply detaching above a critical angle with the substratum.

Adhesive force of a single gecko foot-hair

Non-invasive precise thermometers working at the nanoscale with high spatial resolution, where the conventional methods are ineffective, have emerged over the last couple of years as a very active field of research. This has been strongly stimulated by the numerous challenging requests arising from nanotechnology and biomedicine. This critical review offers a general overview of recent examples of luminescent and non-luminescent thermometers working at nanometric scale. Luminescent thermometers encompass organic dyes, QDs and Ln3+ions as thermal probes, as well as more complex thermometric systems formed by polymer and organic–inorganic hybrid matrices encapsulating these emitting centres. Non-luminescent thermometers comprise of scanning thermal microscopy, nanolithography thermometry, carbon nanotube thermometry and biomaterials thermometry. Emphasis has been put on ratiometric examples reporting spatial resolution lower than 1 micron, as, for instance, intracellular thermometers based on organic dyes, thermoresponsive polymers, mesoporous silica NPs, QDs, and Ln3+-based up-converting NPs and β-diketonate complexes. Finally, we discuss the challenges and opportunities in the development for highly sensitive ratiometric thermometers operating at the physiological temperature range with submicron spatial resolution.

/pdf/thermometry-at-the-nanoscale-1g42e25p96.pdf

Thermometry at the nanoscale

Present a new scanning-probe-based data-storage concept called the "millipede" that combines ultrahigh density, terabit capacity, small form factor, and high data rate. Ultrahigh storage density has been demonstrated by a new thermomechanical local-probe technique to store, read back, and erase data in very thin polymer films. With this new technique, nanometer-sized bit indentations and pitch sizes have been made by a single cantilever/tip into thin polymer layers, resulting in a data storage densities of up to 1 Tb/in/sup 2/. High data rates are achieved by parallel operation of large two-dimensional (2-D) atomic force microscope (AFM) arrays that have been batch-fabricated by silicon surface-micromachining techniques. The very large-scale integration (VLSI) of micro/nanomechanical devices (cantilevers/tips) on a single chip leads to the largest and densest 2-D array of 32/spl times/32 (1024) AFM cantilevers with integrated write/read/erase storage functionality ever built. Time-multiplexed electronics control the functional storage cycles for parallel operation of the millipede array chip. Initial areal densities of 100-200 Gb/in/sup 2/ have been achieved with the 32/spl times/32 array chip.

The "millipede" - nanotechnology entering data storage

Piezoresistive sensors are among the earliest micromachined silicon devices. The need for smaller, less expensive, higher performance sensors helped drive early micromachining technology, a precursor to microsystems or microelectromechanical systems (MEMS). The effect of stress on doped silicon and germanium has been known since the work of Smith at Bell Laboratories in 1954. Since then, researchers have extensively reported on microscale, piezoresistive strain gauges, pressure sensors, accelerometers, and cantilever force/displacement sensors, including many commercially successful devices. In this paper, we review the history of piezoresistance, its physics and related fabrication techniques. We also discuss electrical noise in piezoresistors, device examples and design considerations, and alternative materials. This paper provides a comprehensive overview of integrated piezoresistor technology with an introduction to the physics of piezoresistivity, process and material selection and design guidance useful to researchers and device engineers.

/pdf/review-semiconductor-piezoresistance-for-microsystems-2i2jehwa4g.pdf

Review: Semiconductor Piezoresistance for Microsystems

If you've not been involved in MEMS (MicroElectroMechanical Systems) technology or had the cause to use MEMS devices, then you may wonder what all the fuss is about. What are MEMS anyway? What's the difference between MEMS and MST (MicroSystems Technology)? What are the advantages over existing technologies? If you have ever found yourself pondering over such questions, then this book may be for you. As the title suggests, the main aim is to provide an introduction to MEMS by describing the processes and materials available and by using examples of commercially available devices. The intended readership are those technical managers, engineers, scientists and graduate students who are keen to learn about MEMS but have little or no experience of the technology. I was particularly pleased to note that Maluf has dedicated a whole chapter to the important (and often difficult) area of packaging. The first three chapters provide a general overview of the technology. Within the first three pages we are introduced to the MEMS versus MST question, only to discover that the difference depends on where you live! The United States prefer MEMS, while the Europeans use the handle MST. (Note to self: tell colleagues in MEMS group at Southampton). A good account is given of the basic materials used in the technology, including silicon, silicon oxide/nitride/carbide, metals, polymers, quartz and gallium arsenide. The various processes involved in the creation of MEMS devices are also described. A good treatment is given to etching and bonding in addition to the various deposition techniques. It was interesting to note that the author doesn't make a big issue of the differences between bulk and surface micromachined devices; the approach seems to be `here's your toolbag - get on with it'. One of the great strengths of this book is the coverage of commercial MEMS structures. Arising as they have, from essentially a planar technology, MEMS devices are often elaborate three-dimensional creations, and 2D drawings don't do them much justice. I have to say that I was extremely impressed with the many aesthetic isometric views of some of these wonderful structures. Pressure sensors, inkjet print nozzles, mass flow sensors, accelerometers, valves and micromirrors are all given sufficient treatment to describe the fundamental behaviour and design philosophy, but without the mathematical rigour expected for a traditional journal paper. Chapter 5 addresses the promise of the technology as a means of enabling a new range of applications. The concept of using MEMS devices as key elements within complex systems (or even microsystems!) is explored. The so-called `lab-on-a-chip' approach is described, whereby complex analytical systems are integrated onto a single chip together with the associated micropumps and microvalves. The design and fabrication of MEMS devices are important issues by themselves. A key area, often overlooked, is that of packaging. Painstaking modelling and intricate fabrication methodologies can produce resonator structures oscillating at precisely, say, 125 kHz. The device is then mounted in a dual-in-line carrier and the frequency shifts by 10 kHz because of the additional internal stresses produced. Packaging issues can't be decoupled from those of the micromachined components. Many of these issues, such as protective coatings, thermal management, calibration etc, are covered briefly in the final chapter. Overall, I found this book informative and interesting. It has a broad appeal and gives a good insight into this fascinating and exciting subject area. Neil White

An Introduction to Microelectromechanical Systems Engineering

We report a simple atomic force microscopy-based concept for a hard disk-like data storage technology. Thermomechanical writing by heating a Si cantilever in contact with a spinning polycarbonate disk has already been reported. Here the medium has been replaced with a thin polymer layer on a Si substrate, resulting in significant improvements in storage density. With this new medium, we achieve bit sizes of 10–50 nm, leading to data densities of 500 Gbit/in.2. We also demonstrate a novel high-speed and high-resolution thermal readback method, which uses the same Si cantilevers that are used in the writing process, and the capability to erase and rewrite data features repeatedly.

Ultrahigh-density atomic force microscopy data storage with erase capability

Single-crystal silicon cantilevers 1 /spl mu/m thick have been demonstrated for use in high-density atomic-force microscopy (AFM) thermomechanical data storage. Cantilevers with integrated piezoresistive sensors were fabricated with measured sensitivities /spl Delta/R/R up to 7.5/spl times/10/sup -7/ per /spl Aring/ in close agreement with theoretical predictions. Separate cantilevers with integrated resistive heaters were fabricated using the same basic process. Electrical and thermal measurements on these heating devices produced results consistent with ANSYS simulations. Geometric variants of the cantilever were also tested in order to study the dependence of the thermal time constant on device parameters. Depending on the design, time constants as low as 1 /spl mu/s were achieved. A thermodynamic model was developed based on the cantilevers geometry and material properties, and the model was shown to predict device behavior accurately. A comprehensive understanding of cantilever functionality enabled us to optimize the cantilever for high-speed thermomechanical recording.

http://nanoheat.stanford.edu/sites/default/files/publications/A26.pdf

Low-stiffness silicon cantilevers with integrated heaters and piezoresistive sensors for high-density AFM thermomechanical data storage

Low‐stiffness silicon cantilevers have been developed for proposed data storage devices based on the atomic force microscope, in particular thermomechanical recording. The cantilevers combine a sharp tip with an integrated piezoresistive sensor for data readback from a rotating polycarbonate disk. A novel process was developed to make shallow piezoresistors in cantilevers 1 μm thick, significantly thinner and therefore softer than previously possible. Readback was demonstrated at linear velocities up to 120 mm/s. Separate cantilevers with resistively heated tips were fabricated for writing data marks on polycarbonate, with measured thermal time constants of 30 μs.

Low‐stiffness silicon cantilevers for thermal writing and piezoresistive readback with the atomic force microscope

A dual-axis atomic force microscope (AFM) cantilever with independent piezoresistive sensors has been developed for simultaneous detection of vertical and lateral forces. The cantilever consists of a flat, triangular probe connected to a base by four tall, narrow ribs. The vertically compliant triangular probe and the laterally compliant ribs incorporate separate piezoresistors for vertical and lateral force sensing. In the fabrication process, a special oblique ion implant technique is used to produce electrical elements on vertical sidewalls and horizontal surfaces of the cantilever structure at the same time. The dual-axis cantilever has been used to perform microfriction measurements as well as obtain simultaneous vertical-force and lateral-force AFM images.

Independent detection of vertical and lateral forces with a sidewall-implanted dual-axis piezoresistive cantilever

A variety of micromachined sensors and actuators use coupled electrical and thermal transport in doped silicon bridges and cantilevers. One example is thermomechanical data storage cantilevers, in which Joule heating and atomic-scale forces yield indentations in an organic substrate. The thermal isolation of these structures augments the temperature rise during Joule heating, which can generate more intrinsic carriers and lead to thermal runaway in the presence of a constant bias voltage. This article develops a simple model for the thermal runaway effect in doped silicon cantilevers. The model relates the electrical conductivity in the cantilever to the temperature-dependent carrier concentrations in silicon and is consistent with the available experimental data.

B. W. Chui

Papers

Ultrahigh-density atomic force microscopy data storage with erase capability

Low-stiffness silicon cantilevers with integrated heaters and piezoresistive sensors for high-density AFM thermomechanical data storage

Low‐stiffness silicon cantilevers for thermal writing and piezoresistive readback with the atomic force microscope

Independent detection of vertical and lateral forces with a sidewall-implanted dual-axis piezoresistive cantilever

Intrinsic-carrier thermal runaway in silicon microcantilevers