B
Beomsu Shin
Researcher at Chonbuk National University
Publications - 6
Citations - 146
Beomsu Shin is an academic researcher from Chonbuk National University. The author has contributed to research in topics: Nanocomposite & Carbon black. The author has an hindex of 4, co-authored 5 publications receiving 48 citations.
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Journal ArticleDOI
Flexible thermoplastic polyurethane-carbon nanotube composites for electromagnetic interference shielding and thermal management
TL;DR: In this paper, the effect of different length of CNTs on the EMI shielding, electrical and thermal conductivity performance of TPU nanocomposites have been studied explicitly.
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Combination effect of carbon nanofiber and ketjen carbon black hybrid nanofillers on mechanical, electrical, and electromagnetic interference shielding properties of chlorinated polyethylene nanocomposites
Subhadip Mondal,Subhadip Mondal,Revathy Ravindren,Poushali Bhawal,Beomsu Shin,Sayan Ganguly,Changwoon Nah,Narayan Ch. Das +7 more
TL;DR: In this article, the authors reported the fabrication of chlorinated polyethylene (CPE) nanocomposites filled with hybrid nanofillers of functionalized carbon nanofiber (FCNF) and nano-structured ketjen carbon black (K-CB) by using solution blending approach.
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Electrical conductivity and electromagnetic interference shielding effectiveness of nano‐structured carbon assisted poly(methyl methacrylate) nanocomposites
Subhadip Mondal,Revathy Ravindren,Beomsu Shin,Suhyun Kim,Hyunsang Lee,Sayan Ganguly,Narayan Ch. Das,Changwoon Nah +7 more
Journal ArticleDOI
Highly stretchable wrinkled electrode based on silver ink‐elastomer nanocomposite with excellent fatigue resistance
Joohye Won,Subhadip Mondal,Jongho Park,Wonseok Wang,Hyunsang Lee,Suhyun Kim,Beomsu Shin,Shibulal Gopi Sathi,Changwoon Nah +8 more
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Amphiphilic block co-polymer and silica reinforced epoxy composite with excellent toughness and delamination resistance for durable electronic packaging application
Min-Kyung Lee,Sarbaranjan Paria,Subhadip Mondal,Beomsu Shin,Suhyun Kim,Sungjune Park,Changwoon Nah +6 more
TL;DR: In this paper , a triblock BCP, poly(methyl methacrylate)-b-poly(butyl acrylate) b-polypoly(poly(methyl methyl methacyl) (PMMA-b-PBuA-B-PMMA), is employed in silica-epoxy system to study its structural and mechanical properties.