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Bernhard Wunderle
Researcher at Chemnitz University of Technology
Publications - 309
Citations - 2673
Bernhard Wunderle is an academic researcher from Chemnitz University of Technology. The author has contributed to research in topics: Delamination & Temperature cycling. The author has an hindex of 20, co-authored 272 publications receiving 2337 citations. Previous affiliations of Bernhard Wunderle include Fraunhofer Society.
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Proceedings ArticleDOI
Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging
TL;DR: In this paper, a modular and parametric approach to FE-modeling is presented which allows rapid virtual prototyping for MEMS and other microelectronics packages with respect to some topical reliability issues: Thermal management and thermo-mechanical fatigue.
Proceedings ArticleDOI
Molecular dynamics simulation and mechanical characterisation for the establishment of structure-property correlations for epoxy resins in microelectronics packaging applications
Bernhard Wunderle,E. Dermitzaki,O. Holck,J. Bauer,Hans Walter,Q. Shaik,Klaus Rätzke,Franz Faupel,Bruno Michel +8 more
TL;DR: In this paper, the potential of molecular dynamics simulation for structure-property correlations in epoxy-resins is discussed, which is relevant for a multi-scale framework to lifetime prediction in microelectronics packaging.
Proceedings ArticleDOI
Material characterization and non-destructive failure analysis by transient pulse generation and IR-thermography
TL;DR: In this article, the authors evaluated the applicability of different pulse excitation modes to detect flaws and damages as well as to determine material properties, and found that cracks are detectable unambiguously and its advantage over the ohmic test.
Proceedings ArticleDOI
Performance and thermo-mechanical reliability of micro-channel coolers - a parametric study
TL;DR: In this article, the authors present an approach based on this principle to design reliable thermal management solutions for high power applications, which is measured and calculated for a flip-chip mounted die with a hot-spot using reverse-side micro-channel water cooling as cooling concept.
Proceedings ArticleDOI
Transient thermal analysis as failure analytical tool in electronic packaging
TL;DR: The system-in-package (SiP) concept as mentioned in this paper brings different technologies, material combinations and processes together in one package to ensure the reliability of such a package reliable, fast and non-destructive failure analysis are needed.