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Bernhard Wunderle
Researcher at Chemnitz University of Technology
Publications - 309
Citations - 2673
Bernhard Wunderle is an academic researcher from Chemnitz University of Technology. The author has contributed to research in topics: Delamination & Temperature cycling. The author has an hindex of 20, co-authored 272 publications receiving 2337 citations. Previous affiliations of Bernhard Wunderle include Fraunhofer Society.
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Proceedings ArticleDOI
Design, technology, numerical simulation and optimization of building blocks of a micro and nano scale tensile testing platform with focus on a piezoresistive force sensor
Peter Meszmer,Karla Hiller,Daniel May,Steffen Hartmann,Alexey Shaporin,Jan Mehner,Bernhard Wunderle +6 more
TL;DR: In this paper, the building blocks of a MEMS tensile testing platform are presented, which include a thermo-mechanical MEMS actuator, driven by an aluminum thin-film heater on a thermal oxide for electrical insulation, a capacitative displacement sensor and a piezoresistive force sensor, capable of measuring forces on a nano-newton scale.
Proceedings ArticleDOI
Stress impact of moisture diffusion measured with the stress chip
Florian Schindler-Saefkow,Florian Rost,Alexander Otto,Remi Pantou,R. Mrossko,Bernhard Wunderle,Bruno Michel,S. Rzepka,J. Keller +8 more
TL;DR: In this article, a stress sensing system has been developed by the publicly funded project that allows measuring the magnitudes and the distribution of the stresses induced in the silicon dies by thermomechanical loads.
Proceedings ArticleDOI
Nanomechanics of CNTs for sensor application
Christian Wagner,Steffen Hartmann,Bernhard Wunderle,Jörg Schuster,Stefan E. Schulz,Thomas Gessner +5 more
TL;DR: In this article, a nanoscopic simulation for an acceleration sensor is aimed based on the piezoresistive effect of carbon nanotubes (CNTs), and a compact model is built from density functional theory (DFT), compared with results of molecular dynamics (MD) that describes the mechanics of CNTs in a parameterized way.
Proceedings ArticleDOI
Molecular modelling of microelectronic packaging materials - basic thermo-mechanical property estimation of a 3D-crosslinked epoxy / SiO 2 interface
TL;DR: In this article, the authors present a procedure for the construction of 3D networked epoxy molding compounds and an estimation of basic thermodynamic properties by molecular dynamics simulations and present a first property analysis of an industry near molding compound material.
Proceedings ArticleDOI
Non-destructive in-situ monitoring of delamination of buried interfaces by a thermal pixel (Thixel) chip
TL;DR: In this paper, a thermal transducer matrix of thermal pixels is used for in-situ monitoring of delamination of interfaces for electronic packages, where the transducers are small metal wire meanders driven and electrically read out using the well-known 3-omega method.