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Bernhard Wunderle

Researcher at Chemnitz University of Technology

Publications -  309
Citations -  2673

Bernhard Wunderle is an academic researcher from Chemnitz University of Technology. The author has contributed to research in topics: Delamination & Temperature cycling. The author has an hindex of 20, co-authored 272 publications receiving 2337 citations. Previous affiliations of Bernhard Wunderle include Fraunhofer Society.

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Design, technology, numerical simulation and optimization of building blocks of a micro and nano scale tensile testing platform with focus on a piezoresistive force sensor

TL;DR: In this paper, the building blocks of a MEMS tensile testing platform are presented, which include a thermo-mechanical MEMS actuator, driven by an aluminum thin-film heater on a thermal oxide for electrical insulation, a capacitative displacement sensor and a piezoresistive force sensor, capable of measuring forces on a nano-newton scale.
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Stress impact of moisture diffusion measured with the stress chip

TL;DR: In this article, a stress sensing system has been developed by the publicly funded project that allows measuring the magnitudes and the distribution of the stresses induced in the silicon dies by thermomechanical loads.
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Nanomechanics of CNTs for sensor application

TL;DR: In this article, a nanoscopic simulation for an acceleration sensor is aimed based on the piezoresistive effect of carbon nanotubes (CNTs), and a compact model is built from density functional theory (DFT), compared with results of molecular dynamics (MD) that describes the mechanics of CNTs in a parameterized way.
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Molecular modelling of microelectronic packaging materials - basic thermo-mechanical property estimation of a 3D-crosslinked epoxy / SiO 2 interface

TL;DR: In this article, the authors present a procedure for the construction of 3D networked epoxy molding compounds and an estimation of basic thermodynamic properties by molecular dynamics simulations and present a first property analysis of an industry near molding compound material.
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Non-destructive in-situ monitoring of delamination of buried interfaces by a thermal pixel (Thixel) chip

TL;DR: In this paper, a thermal transducer matrix of thermal pixels is used for in-situ monitoring of delamination of interfaces for electronic packages, where the transducers are small metal wire meanders driven and electrically read out using the well-known 3-omega method.