B
Bernhard Wunderle
Researcher at Chemnitz University of Technology
Publications - 309
Citations - 2673
Bernhard Wunderle is an academic researcher from Chemnitz University of Technology. The author has contributed to research in topics: Delamination & Temperature cycling. The author has an hindex of 20, co-authored 272 publications receiving 2337 citations. Previous affiliations of Bernhard Wunderle include Fraunhofer Society.
Papers
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Proceedings ArticleDOI
A novel experimental approach to calibrating cohesive zone elements for advanced risk analysis of interface delamination in semiconductor packages
TL;DR: In this paper, the authors present a novel idea that enables determining the interface stiffness and critical fracture energy in shear mode by means of the Advanced Button Shear Test Setup (ABST).
Proceedings ArticleDOI
Nanoindentation as part of material characterization of thin metal films
TL;DR: In this paper, the applicability and challanges of nanoindentation on thin metal films are discussed, together with finite element simulations to obtain elastic-plastic material properties.
Proceedings Article
Combined and accelerated in-situ measurement method for reliability and aging analyses of thermal interface materials
M. AboRas,R. Haug,R. Schacht,C. Monory-Plantier,Daniel May,Bernhard Wunderle,Thomas Winkler,Bruno Michel +7 more
TL;DR: In this article, a new automated test system for in-situ reliability testing of thermal interface materials (TIMs) is developed and will be presented in this paper, which is designed to be able to analyze the aging and reliability behavior of most common TIMs.
Journal ArticleDOI
Transport of moisture at epoxy–SiO2 interfaces investigated by molecular modeling
O. Holck,Jörg Bauer,Tanja Braun,Hans Walter,Olaf Wittler,Bernhard Wunderle,Klaus-Dieter Lang,Klaus-Dieter Lang +7 more
TL;DR: An analysis of moisture transport through the bulk of a crosslinked epoxy has been performed experimentally and by molecular dynamics simulations and it was shown that results of the diffusion coefficient compare well for the investigated system.
Proceedings ArticleDOI
Comparative Die-Attach Failure Analysis by Thermoreflectance, Infrared Thermography and Scanning Acoustic Microscopy
Dan R. Wargulski,Florian Loffler,Daniel May,J. Heilmann,Bernhard Wunderle,Ana Borta-Boyon,Afshin Ziaei,Mohamad Abo Ras +7 more
TL;DR: In this article, three different failure analysis methods for die-attaches are presented and compared and compared in the present work and the results of these methods are compared to and verified by the common and widely used scanning acoustic microscopy, which has wide-ranging failure detection abilities but compared to thermographic methods it lacks on production line integration capabilities for 100% in-line inspections.