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Bernhard Wunderle
Researcher at Chemnitz University of Technology
Publications - 309
Citations - 2673
Bernhard Wunderle is an academic researcher from Chemnitz University of Technology. The author has contributed to research in topics: Delamination & Temperature cycling. The author has an hindex of 20, co-authored 272 publications receiving 2337 citations. Previous affiliations of Bernhard Wunderle include Fraunhofer Society.
Papers
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Proceedings ArticleDOI
Transient cooling of power electronic devices using thermoelectric coolers coupled with phase change materials
TL;DR: The system design for integrating Si and SiC power dies along with thermo-electric coolers and phase change materials in order to thermally manage transient overloads occurring during operation for motor drive application is dealt with.
Proceedings ArticleDOI
Reliability of sputtered thin aluminium films under accelerated stress testing by vibration loading and modeling
Bernhard Wunderle,T. Onken,J. Heilmann,Dorothee Silbernagl,J. Arnold,Tomasz Bieniek,Reinhard Pufall +6 more
TL;DR: In this article, the authors proposed a method for accelerated stress testing and lifetime modelling of thin aluminium films in the high-cycle fatigue regime by isothermal mechanical loading, which allows simple in-situ monitoring of failure.
Journal ArticleDOI
An in-situ numerical–experimental approach for fatigue delamination characterization in microelectronic packages
Emad A. Poshtan,Emad A. Poshtan,Emad A. Poshtan,Sven Rzepka,Christian Silber,Bernhard Wunderle +5 more
TL;DR: An in-situ and cost-effective numerical-experimental approach for fatigue characterization of bi-material interfaces in Microelectronic Packages is presented and shows that, although some of the molding compound particles are left on the LF surface, the interfacial fracture is the dominant failure mode.
Proceedings ArticleDOI
An In-line Failure Analysis System Based on IR Thermography Ready for Production Line Integration
Dan R. Wargulski,Daniel May,Florian Loffler,Torsten Nowak,Jan Petrick,Corinna Grosse,Bernhard Wunderle,E. Boschman,Mohamad Abo Ras +8 more
TL;DR: In this paper, an infrared failure analysis system is presented to automatically detect defects in various samples from different fields of application in electronic industries using a production line simulator with a sample transfer via conveyor belt and an integrated pulsed infrared thermography system.
Proceedings ArticleDOI
Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
TL;DR: In this article, the authors present a comprehensive method for obtaining urgently required critical interface delamination data of material pairings used in electronic packaging, which enables rapid, inexpensive and accurate lifetime prediction for that failure mode.