C
C. Euvrard
Researcher at University of Grenoble
Publications - 3
Citations - 66
C. Euvrard is an academic researcher from University of Grenoble. The author has contributed to research in topics: Electromigration & Scalability. The author has an hindex of 3, co-authored 3 publications receiving 45 citations.
Papers
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Proceedings ArticleDOI
Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
Joris Jourdon,Sandrine Lhostis,Stephane Moreau,J. Chossat,M. Arnoux,C. Sart,Yann Henrion,P. Lamontagne,Lucile Arnaud,N. Bresson,V. Balan,C. Euvrard,Y. Exbrayat,Daniel Scevola,E. Deloffre,S. Mermoz,A-L. Martin,H. Bilgen,F. Andre,C. Charles,D. Bouchu,Alexis Farcy,S. Guillaumet,A. Jouve,Hélène Fremont,S. Cheramy +25 more
TL;DR: In this paper, a study of the influence of hybrid bonding pitch shrinkage on a 3D stacked backside illuminated CMOS image sensor was performed from a process, device performance and robustness perspectives.
Proceedings ArticleDOI
300 mm Multi Level Air Gap Integration for Edge Interconnect Technologies and Specific High Performance Applications
R. Gras,F. Gaillard,D. Bouchu,Alexis Farcy,E. Petitprez,B. Icard,Jean-Christophe Le-Denmat,Laurent Pain,J. Bustos,P. H. Haumesser,P. Brun,G. Imbert,L. Clement,C. Borowiak,Maurice Rivoire,C. Euvrard,Vincent Arnal,S. Olivier,Stephane Moreau,M. Mellier,Thierry Chevolleau,Gérard Passemard,Joaquim Torres +22 more
TL;DR: In this paper, a low cost integration of localized air cavities using a sacrificial material to solve via misalignment issues was proposed, which is shown to be mechanically robust and presents excellent electrical results with high gains on RC delays.
Proceedings ArticleDOI
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability
Lucile Arnaud,Stephane Moreau,A. Jouve,Imed Jani,Didier Lattard,Frank Fournel,C. Euvrard,Y. Exbrayat,V. Balan,N. Bresson,Sandrine Lhostis,Joris Jourdon,E. Deloffre,S. Guillaumet,Alexis Farcy,Simon Gousseau,M. Arnoux +16 more
TL;DR: This paper presents the description of direct hybrid bonding technology for the fabrication of vertical interconnects thanks to wafer-to-wafer bonding through morphological and electrical results.