Proceedings ArticleDOI
Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
Joris Jourdon,Sandrine Lhostis,Stephane Moreau,J. Chossat,M. Arnoux,C. Sart,Yann Henrion,P. Lamontagne,Lucile Arnaud,N. Bresson,V. Balan,C. Euvrard,Y. Exbrayat,Daniel Scevola,E. Deloffre,S. Mermoz,A-L. Martin,H. Bilgen,F. Andre,C. Charles,D. Bouchu,Alexis Farcy,S. Guillaumet,A. Jouve,Hélène Fremont,S. Cheramy +25 more
TLDR
In this paper, a study of the influence of hybrid bonding pitch shrinkage on a 3D stacked backside illuminated CMOS image sensor was performed from a process, device performance and robustness perspectives.Abstract:
Hybrid bonding is a high-density technology for 3D integration but further interconnect scaling down could jeopardize electrical and reliability performance. A study of the influence of hybrid bonding pitch shrinkage on a 3D stacked backside illuminated CMOS image sensor was performed from a process, device performance and robustness perspectives, from $8.8\ \mu\mathrm{m}$ down to $1.44\ \mu \mathrm{m}$ bonding pitches. As a result no defect related to smaller bonding pads was evidenced neither by thermal cycling nor by electromigration, thus validating fine-pitch hybrid bonding robustness and introduction for next generation image sensors.read more
Citations
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Journal ArticleDOI
A kinetic model of copper-to-copper direct bonding under thermal compression
TL;DR: In this paper, a surface creep model is presented for analyzing Cu-to-Cu direct bonding under thermal compression, where the driving force is a pressure gradient, which squeezes layers of atoms to fill voids at the bonding interface.
Journal ArticleDOI
Wafer-to-Wafer Hybrid Bonding Development by Advanced Finite Element Modeling for 3-D IC Packages
TL;DR: In this article, the 3D modeling methodology developed for the wafer-to-wafer hybrid bonding (W2W-HB) annealing process has been investigated.
Proceedings ArticleDOI
Characterization of Fine Pitch Hybrid Bonding Pads using Electrical Misalignment Test Vehicle
Imed Jani,Didier Lattard,Pascal Vivet,Lucile Arnaud,Severine Cheramy,Edith Beigne,Alexis Farcy,Joris Jourdon,Yann Henrion,E. Deloffre,Halim Bilgen +10 more
TL;DR: In this paper, a misalignment test structure was fabricated in a Wafer-to-Wafer (W2W) assembly configuration with a pitch of 3.42µm and 1.44 µm using a very small measurement step for an accurate mis alignment measurement (respectively 45nm and 22nm).
Journal ArticleDOI
Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces
Jia Juen Ong,Wei Lan Chiu,Ou-Hsiang Lee,Chia-Wen Chiang,Hsiang-Hung Chang,Chin-Hung Wang,Kai Cheng Shie,Shihe Yang,Dinh Phuc Tran,King-Ning Tu,Chih Chen +10 more
TL;DR: In this paper , the authors adopted (111)-oriented Cu with high surface diffusivity to achieve low-temperature and low-pressure Cu/SiO2 hybrid bonding.
Proceedings ArticleDOI
Development of face-to-face and face-to-back ultra-fine pitch Cu-Cu hybrid bonding
Yoshihisa Kagawa,Takumi Kamibayashi,Yuriko Yamano,Kenya Nishio,A. Sakamoto,Taichi Yamada,Kan Shimizu,Tomoyuki Hirano,Hayato Iwamoto +8 more
TL;DR: In this paper , the robust ultra-fine pitch, 1 μm pitch, wafer level face-to-face Cu-Cu hybrid bonding has been realized and the 1.4μm pitch level hybrid bonding was successfully introduced into face to back bonding interface.
References
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Proceedings ArticleDOI
Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding
Y. Kagawa,N. Fujii,K. Aoyagi,Y. Kobayashi,S. Nishi,N. Todaka,S. Takeshita,J. Taura,Hirotsugu Takahashi,Y. Nishimura,K. Tatani,M. Kawamura,H. Nakayama,Takashi Nagano,K. Ohno,Hayato Iwamoto,Shingo Kadomura,Teruo Hirayama +17 more
TL;DR: Wang et al. as mentioned in this paper have successfully mass-produced novel stacked back-illuminated CMOS image sensors (BI-CIS), which introduced advanced Cu2Cu hybrid bonding that had developed.
Proceedings ArticleDOI
Cu/SiO 2 hybrid bonding: Finite element modeling and experimental characterization
C. Sart,Rafael Estevez,Vincent Fiori,Sandrine Lhostis,E. Deloffre,Guillaume Parry,Roberto Gonella +6 more
TL;DR: In this article, a 3D finite element model for the thermal annealing of Cu/SiO 2 hybrid bonded pads is presented, taking into account the dishing effect.
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Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors
Sandrine Lhostis,Alexis Farcy,E. Deloffre,F. Lorut,Sébastien Mermoz,Yann Henrion,L. Berthier,F. Bailly,Daniel Scevola,Francois Guyader,F. Gigon,C. Besset,S. Pellissier,N. Hotellier,A. L. Le Berrigo,Stephane Moreau,V. Balan,Frank Fournel,A. Jouve,S. Cheramy,M. Arnoux,Bernhard Rebhan,G. A. Maier,L. Chitu +23 more