An electronic component has an electronic circuit and a rubber-elastic elevation. The rubber-elastic elevation is formed of an insulating rubber-elastic material disposed on a surface of the electronic component and has a conductive land on its crest. The rubber-elastic elevation also has on its sloping side or in its volume a conduction path between the land and the electronic circuit.

Electronic component with flexible contacting pads and method for producing the electronic component

The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a complexing agent. In describing a process by which a durable tin layer which can be soldered is created, which, at the same time, prevents liberation of the base material, this invention discloses that the electrolytes have at least one foreign metal added to form a diffusion barrier in the tin layer.

Process for the non-galvanic tin plating of copper or copper alloys

PROBLEM TO BE SOLVED: To provide a wiring board permitting normal electrical connection between an electrode and a connecting pad of an electronic component all the time, and provide a manufacturing method of the same. SOLUTION: In a wiring board, a connecting pad 2a (2b) comprising copper is formed on the surface of an insulating substrate having a wiring conductor, and the surface of the connecting pad 2a (2b) is successively coated with an electroless nickel plating film 11, a reduction type electroless palladium plating film 12 and a substitutional reduction type electroless gold plating film 13. There is provided also a manufacturing method of the same. COPYRIGHT: (C)2007,JPO&INPIT

Wiring board and manufacturing method of the same

Disclosed is an electroless palladium plating bath containing a palladium compound, at least one complexing agent selected from ammonia and amine compounds, at least one reducing agent selected from phosphinic acid and phosphinates, and at least one unsaturated carboxylic acid compound selected from unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, unsaturated carboxylates and unsaturated carboxylic acid derivatives. Such an electroless palladium plating bath has high bath stability, and decomposition of the bath hardly occurs. Consequently, the electroless palladium plating bath of the present invention has a longer bath life than conventional electroless palladium plating baths. In addition, this electroless palladium plating bath enables to obtain excellent solder bonding characteristics and wire bonding characteristics since it does not affect plating film characteristics even when it is used for a long time.

Electroless palladium plating bath and electroless palladium plating method

PROBLEM TO BE SOLVED: To provide a reduction precipitation type electroless gold plating liquid which can be directly precipitated on a palladium film, and is favorable, in particular, for the surface treatment of a conductor circuit of a printed circuit board. SOLUTION: The reduction precipitation type electroless gold plating liquid which is used to directly deposit a gold plating film on a palladium film consists of an aqueous solution containing a water-soluble gold compound, a reducing agent and a complexing agent, and contains at least one kind of compound selected from a group consisting of formaldehyde bisulfites, rongalit, and hydrazines as the reducing agent. An electroless nickel plating film, an electroless palladium plating film, and an electroless gold plating film deposited by using the reduction precipitation type electroless gold plating liquid are successively deposited on the conductor part of the printed circuit board. COPYRIGHT: (C)2008,JPO&INPIT

Reduction precipitation type electroless gold plating liquid for palladium film

PROBLEM TO BE SOLVED: To provide an electroless tin plating bath and plating method capable of suppressing an amount of melting of a backing metal and forming a circuit board improved in plating wettability and connection reliability. SOLUTION: In the electroless tin plating method for forming a tin plating film on a material to be plated, the tin plating film is formed by the reduction reaction by a borohydride compound, using an electroless tin plating bath containing at least a tin compound and a borohydride compound as a reducing agent. COPYRIGHT: (C)2009,JPO&INPIT

Electroless tin plating bath and electroless tin plating method

PURPOSE: To improve plating bath stability, depositing rate and plating film property by adding an inorganic sulfur compound such as thiosulfate into an electroless palladium plating solution containing a palladium compound, a reducing agent and a complexing agent. CONSTITUTION: The inorganic sulfur compound is added into the electroless palladium plating solution containing the palladium compound, the reducing agent and the complexing agent. As the palladium compound, a water soluble salt such as palladium chloride is suitable and is used by 0.001-0.5mol/l. Hypophosphorous acid, its salt, phosphorous acid, its salt, a borohydride, aminoborans as the reducing agent and ammonia, amins as the complexing agent are respectively used. As the inorganic sulfur compound, thiosulfate, polythionate, dithionite, sulfite and dithionate or the like is used by 0.01-10mmol/l. A plating film hardly causing cracks is rapidly formed by controlling the pH of the plating solution to 4-10 and dipping a material to be plated thereinto.

Electroless palladium plating solution and plating method

PROBLEM TO BE SOLVED: To provide a method for maintaining the plating capability of an electroless gold-plating bath stably for a long period of time, which can provide the plated film of gold showing excellent appearance without causing a poor appearance due to a progress of the intergranular corrosion of a nickel surface, and to further provide a method for maintaining the electroless gold-plating bath in which a gold cyanide salt has been consumed due to plating treatment, stably for a long period of time. SOLUTION: The method for stably maintaining the plating capability of the electroless gold-plating bath containing a gold cyanide salt, a complexing agent, a formaldehyde bisulfite adduct and an amine compound in a state of having kept the bath at 70 to 90°C includes periodically supplying an alkali cyanide, a formaldehyde bisulfite adduct and an amine compound as first supply components to the plating bath, and further supplying only a gold cyanide salt, a formaldehyde bisulfite adduct and an amine compound as second supply components to the plating bath in which the gold has been consumed due to the plating treatment. COPYRIGHT: (C)2008,JPO&INPIT

Method for maintaining plating capability of electroless gold-plating bath

PROBLEM TO BE SOLVED: To solve a problem of a thick-film formation of a gold plating film in a short time and the problem of fin flaws of nickel by applying a nickel plating using an electroless nickel plating soln containing an inorg sulfur compd as a gold plating pretreatment of a circuit pattern for an electronic substrate SOLUTION: An electroless gold plating is executed after applying nickel plating by using an electroless plating soln to which thiosulfate, dithionate, polythionate or dithionite having S-S sulfur bond are added The addition of the compd having S-S sulfur bond is 001-100mg/l, especially preferably 05-50mg/l, and the plating is executed by a conventional method Further, at the time of the elecroless gold plating after nickel plating with this plating soln, the plating is executed by using a plating bath containing gold cyanate as a starting material of the gold and having a pH of 4-9 COPYRIGHT: (C)1997,JPO

Thick-film formation in electroless gold plating

PROBLEM TO BE SOLVED: To obtain non-reddish, good appearance at the time of thick forming of a gold plating film by adding acid amide and acid imide compd. into an electroless gold plating bath. SOLUTION: The acid amide and acid imide compd. are added into the electroless gold plating bath contg. a gold raw material and a complexing agent. A material to be plated is immersed into this plating bath and is subjected to electroless gold plating, by which the thick forming of the gold plating film is executed. The acid amide and acid imide compd. are added to this electroless strike gold plating bath in the case electroless strike gold plating is executed. The concn. of the gold in the plating bath is preferably about 0.5 to 10g/l. The complexing agent is usually compounded at about 5 to 300g/l. Formamide, dimethyl formamide, etc., are usually used for the acid amide and succinic imide, glutarimide, etc., are used for the axis imide. The compounding rate thereof is usually preferably in a range of 0.1 to 50g/l. This plating bath is used usually in a range of pH 3.5 to 9. COPYRIGHT: (C)1997,JPO

徹上玉利

Papers

Electroless tin plating bath and electroless tin plating method

Electroless palladium plating solution and plating method

Method for maintaining plating capability of electroless gold-plating bath

Thick-film formation in electroless gold plating

Electroless gold plating bath and electroless gold plating method

徹 上玉利

Papers

Electroless tin plating bath and electroless tin plating method

Electroless palladium plating solution and plating method

Method for maintaining plating capability of electroless gold-plating bath

Thick-film formation in electroless gold plating

Electroless gold plating bath and electroless gold plating method

徹上玉利