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Chih-Ming Chen

Researcher at National Chung Hsing University

Publications -  327
Citations -  9729

Chih-Ming Chen is an academic researcher from National Chung Hsing University. The author has contributed to research in topics: Educational technology & Dye-sensitized solar cell. The author has an hindex of 44, co-authored 317 publications receiving 8328 citations. Previous affiliations of Chih-Ming Chen include University of Education, Winneba & Academia Sinica.

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Journal ArticleDOI

Electromigration of Sn-9wt.%Zn Solder

Abstract: The morphological evolution of Sn-9wt.%Zn solder under electromigration at a current density of about 105 A/cm2 was examined. Sn extrusion was observed, suggesting that Sn is the dominant moving species under electromigration. In contrast, Zn appeared to be immobile. It was also found that the microstructure of the solder had a significant effect on the electromigration behavior. For the solder with fine Zn precipitates, the surface morphology of the solder was almost unchanged except for the formation of Sn extrusion sites at␣the anode side after electromigration. However, for the solder with coarse Zn precipitates, more Sn extrusion sites were observed, and they were located not only at the anode side but also within the solder. Coarse Zn precipitates appeared to block Sn migration, thus Sn migration was intercepted in front of the Zn precipitates. The Sn atoms accumulated there, which led to its extrusion. The blocking effect was found to depend strongly on the size and orientation of the Zn precipitates.
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Well-organized organosilane composites for adhesion enhancement of heterojunctions

TL;DR: In this article, a co-silanization method is proposed to functionalize the polyimide (PI) surface for efficient metal immobilization and adhesion enhancement, which features the establishment of a barricade-like network structure by the assistant organosilane, trimethoxyphenylsilane (TMPS), to generate spatial confinement effect (SCE) to effectively control the positioning and grafting orientation.
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Effect of temperature on microstructural changes of the Sn-9 wt.% Zn lead-free solder stripe under current stressing

TL;DR: In this paper, microstructural changes of the Sn-9 ¼wt.% Zn solder stripe under current stressing with a density of 105 ¼ A cm−2 at 80 −140 ¼ c for 240h were investigated.
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WO3 Nanoparticles or Nanorods Incorporating Cs2CO3/PCBM Buffer Bilayer as Carriers Transporting Materials for Perovskite Solar Cells

TL;DR: The results revealed that the combination of WO3 nanomaterials and Cs2CO3/PCBM bilayer provides an effective solution for improving performances of PSCs.
Proceedings ArticleDOI

Assessing the Attention Levels of Students by Using a Novel Attention Aware System Based on Brainwave Signals

TL;DR: A novel attention aware system capable of recognizing students' attention levels accurately based on EEG signals, thus having high potential to be applied in providing timely alert for conveying low-attention level feedback to online instructors in an e-learning environment.