C
Chih-Ming Chen
Researcher at National Chung Hsing University
Publications - 327
Citations - 9729
Chih-Ming Chen is an academic researcher from National Chung Hsing University. The author has contributed to research in topics: Educational technology & Dye-sensitized solar cell. The author has an hindex of 44, co-authored 317 publications receiving 8328 citations. Previous affiliations of Chih-Ming Chen include University of Education, Winneba & Academia Sinica.
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Journal ArticleDOI
Adsorption and photodegradation of methylene blue using a bulk Ti material with porous titania layer prepared by chemical oxidation
TL;DR: In this article, a chemical oxidation method was adopted to prepare a porous titania network on Ti bulk for dye adsorption and photodegradation, and the prepared titania layer was characterized by SEM, AFM, ATR-FTIR, XRD, and zeta potential.
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Phase Equilibria of Sn-Co-Cu Ternary System
TL;DR: In this paper, a new ternary compound, Sn3Co2Cu8, was found and equilibrated at 523k, 1073k, and 1273k (250k, 800k, 1000k) and the equilibrium phases were experimentally determined.
Proceedings ArticleDOI
A Novel and Efficient Neuro-Fuzzy Classifier for Medical Diagnosis
TL;DR: Experimental results indicated that the proposed neuro-fuzzy network with feature reduction can discover very simplified and easily interpretable fuzzy rules to support medical diagnosis.
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Suppression effect of Ni grain size on the Ni3Sn4 growth at the Sn/Ni interface
TL;DR: In this paper, the effect of Ni grain size on the formation and growth kinetics of intermetallic compounds at the Sn/Ni interface is studied and the suppression effect on Ni 3 Sn 4 growth is attributed to the diffusion barrier effect of a thin Ni 3 SN 2 phase formed on the Ni electroplated layer.
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Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers
TL;DR: In this article, the microstructural evolution of the Cu/solder/Cu pillar-type bonding structures with a reduced solder volume subjected to thermal aging at 423 K to 473 K (150 °C to 200 °C) was investigated.