Introduction to Electromagnetic Compatibility

T van Duzer and C W Turner 1981 London: Edward Arnold xii + 369 pp price £20 In reviewing this book it is useful to distinguish between the authors' intention, as stated in the preface, and what they have actually done. What they have written is an extremely good physics text on the theory of Josephson junctions and the microscopic theory of superconductivity.

https://iopscience.iop.org/article/10.1088/0031-9112/33/2/040/pdf

Principles of Superconductive Devices and Circuits

Mitigating power distribution network (PDN) noise is one of the main efforts for power integrity (PI) design in high-speed or mixed-signal circuits. Possible solutions, which are based on decoupling or isolation concept, for suppressing PDN noise on package or printed circuit board (PCB) levels are reviewed in this paper. Keeping the PDN impedance very low in a wide frequency range, except at dc, by employing a shunt capacitors, which can be in-chip, package, or PCB levels, is the first priority way for PI design. The decoupling techniques including the planes structure, surface-mounted technology decoupling capacitors, and embedded capacitors will be discussed. The isolation approach that keeps part of the PDN at high impedance is another way to reduce the PDN noise propagation. Besides the typical isolation approaches such as the etched slots and filter, the new isolation concept using electromagnetic bandgap structures will also be discussed.

Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation

This paper reviews the fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades. Most results in this field are based on the very rich and highly educational literature produced by Prof. C. Paul in his long scientific career. The inclusion of parameters variability effects is also considered, and it is demonstrated how statistical simulations can become affordable by means of recently-introduced stochastic methods. Finally, the necessity of practical training of designers is mentioned, and an experience relying on realistic PCB demonstrators is illustrated.

Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress

In this paper, a new modeling method for estimating the impedance properties in a chip-package hierarchical power distribution network (PDN) is proposed. The key ideas of the proposed modeling method are to decompose the chip-package hierarchical PDN into several structures, independently calculate the decomposed structures, and extract the whole structure's impedance by using a segmentation method. For the impedance calculations of the independently decomposed structures, a new method based on proposed analytic expressions is introduced for a chip level PDN, a resonant cavity model is used for a package level PDN, and equivalent circuit models are used for interconnections. The proposed method has been successfully verified by comparisons with measurements using a fabricated test vehicle in the frequency domain range up to 20 GHz, and it shows improved accuracy as well as computational superiority compared to EM simulations. Finally, the impedance properties in a chip-package hierarchical PDN are thoroughly investigated and analyzed.

Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method

The signal propagating along a microstrip line over a slot on the power plane will suffer from composite effects of reflected noise by a discontinuity in signal return path and ground bounce between power and ground planes. A new equivalent circuit model is proposed and simulations are performed for multilayer structures to characterize these composite effects. An experimental setup is devised to demonstrate significant coupling between signal lines due to the slot-induced ground bounce. Favorable comparison between the simulation and measured results validates the proposed equivalent circuit model and analysis approach.

Composite effects of reflections and ground bounce for signal line through a split power plane

An improved expression of the thin-slot formalism has been proposed to alleviate the gridding of the finite-difference time-domain (FDTD) solution for electromagnetic problems involving narrow slots. By applying the conformal mapping technique, the varying field distribution near the slots is analytically derived and fully cast into a unit FDTD cell with effective permittivity and permeability. As a result, this formalism permits narrow slots to be modeled without reducing spatial grid size, even when the slot gap width is much smaller than a one space grid. The method has been applied to several transmission line problems and the results are compared with traditional FDTD and other thin-slot formalisms. It is verified that the proposed method is easy to implement, numerically efficient, and accurate.

An improved formalism for FDTD analysis of thin-slot problems by conformal mapping technique

A compact ultra-wideband (UWB) bandpass filter (BPF) is presented for applications to short-range and high-speed wireless communication. Superconducting YBa2Cu3Oy (YBCO) stepped impedance resonators and coupled-line sections as inverter circuits are designed to form the basic filter structure. In the filter design, connected high-low stepped impedance microstrip lines construct the resonators, and open-stub lines are utilized to add return-loss poles in the pass-band and create transmission zeros in the lower/upper stop-band region. Simulation results show that the passband from 3.0 GHz to 8.6 GHz has a 3-dB fractional bandwidth of 99 percent, computed insertion losses better than 0.03 dB, and return losses greater than 15 dB. Rejection levels in the upper/lower stop-bands are better than 20 dB. For fabrication, high-Tc superconducting (HTS) YBCO films were deposited on double-side-polished 0.5-mm-thick MgO (100) substrates by a radio-frequency sputtering system. The filter was made out of patterned double-sided deposited YBCO films integrated with a gold-coated housing. The realized HTS UWB BPF shows a wide passband within 2.9-8.3 GHz with a maximum insertion loss of 0.88 dB. The measured results show good HTS UWB BPF performance. Moreover, the temperature-dependent frequency responses and the insertion loss can be described by the modified two-fluid-model-based formulas, indicating that the frequency shift and the increase in insertion loss for HTS BPF are both dominated by the temperature dependence of the magnetic penetration depth.

Characteristics of Ultra-Wideband Bandpass YBCO Filter With Impendence Stub

This study aims to prepare an aluminum doped zinc oxide (AZO)/silver nanowire (AgNWs) composite transparent conducting film on a glass substrate via radio-frequency (RF) magnetron sputtering and spin-coating. The effects of AgNWs content and AZO deposition temperature and pressure on the structural, electrical, and optical properties were investigated. Under the optimal conditions, the resistivity and transmittance of the AZO/AgNWs stacked films were 2.15 × 10−4 Ω·cm and 80.28%, respectively, in the 400–800 nm range. Finally, a wide-band transparent antenna with an operational frequency of 2.4 GHz was built from AZO/AgNWs stacked films. This antenna is useful for Bluetooth communication.

AZO/silver nanowire stacked films deposited by RF magnetron sputtering for transparent antenna

The factors affecting the flux-to-voltage transfer function of the series-SQUID array with grain-boundary Josephson junctions were investigated. By using the proposed critical-current-modulation model, it is found that the voltage swing of the series-SQUID array is suppressed greatly by the spread in critical currents of Josephson junctions. For the inductance L = 80 pH and the logarithmic average critical current 2I/sub ave/ = 20 /spl mu/A of the component SQUID, the allowed spread in critical currents of Josephson junctions is 0.4I/sub ave/ to 2.2I/sub ave/ for achieving the low flux noise with the series SQUID array.

Chun-Te Wu

Papers

Composite effects of reflections and ground bounce for signal line through a split power plane

An improved formalism for FDTD analysis of thin-slot problems by conformal mapping technique

Characteristics of Ultra-Wideband Bandpass YBCO Filter With Impendence Stub

AZO/silver nanowire stacked films deposited by RF magnetron sputtering for transparent antenna

Flux-to-Voltage transfer function of the series-SQUID array with grain-boundary Josephson junctions