PROBLEM TO BE SOLVED: To provide an electroconductive material for connecting parts, which employs a base metal of Cu or a Cu alloy having plated multilayers formed on the surface, and keeps low contact resistance in a high-temperature atmosphere for a long time. SOLUTION: This conducting material employs the base metal of Cu or the Cu alloy having plated layers comprising a Ni layer, a Cu-Sn alloy layer and an Sn layer formed on the surface in the sequence, wherein the Ni layer has a thickness of 0.1-1.0 μm, the Cu-Sn alloy layer has a thickness of 0.1-1.0 μm and a Cu concentration of 35-75 atom%, and the Sn layer has a thickness of 2.0 μm or thinner and contains carbon of 0.001-0.1 mass %. When the material has an Sn layer with a thickness of 0.5 μm or thinner, it has a lower insertion force for a fit type terminal with multipolars, and when it has the Sn layer thicker than 0.5 μm, it has an ensured wettability with solder even after receiving a heat treatment like reflow soldering, and is suitable for non-fit type connecting parts such as JB. COPYRIGHT: (C)2004,JPO

Conducting material for connecting parts and manufacturing method therefor

A method and structure for good adhesion of Intermetallic Compounds (IMC) on Cu pillar bumps are provided. The method includes depositing Cu to form a Cu pillar layer, depositing a diffusion barrier layer on top of the Cu pillar layer, and depositing a Cu cap layer on top of the diffusion barrier layer, where an intermetallic compound (IMC) is formed among the diffusion barrier layer, the Cu cap layer, and a solder layer placed on top of the Cu cap layer. The IMC has good adhesion on the Cu pillar structure, the thickness of the IMC is controllable by the thickness of the Cu cap layer, and the diffusion barrier layer limits diffusion of Cu from the Cu pillar layer to the solder layer. The method can further include depositing a thin layer for wettability on top of the diffusion barrier layer prior to depositing the Cu cap layer.

Method and structure for adhesion of intermetallic compound (imc) on cu pillar bump

PROBLEM TO BE SOLVED: To obtain a surface treated material which maintains solderability, whisker resistance and heat resistant reliability as a plating material and good moldability. SOLUTION: An Ni or Ni alloy layer 12 having a thickness of 0.05 to 1.0 μm is formed on the surface of copper or a copper alloy 10 and an Sn or Sn alloy layer 16 is formed on the extreme surface side. Diffusion layers essentially consisting of Cu and Sn or diffusion layers 14 (18) essentially consisting of Cu, Ni and Sn are formed in ≥1 layers between the Ni or Ni alloy layer 12 and the Sn or Sn alloy layer 16 and the thickness of the diffusion layers 14 (18) contacting with the Sn or Sn alloy layer 16 among the diffusion layers is 0.2 to 20 μm and the Cu content thereof is ≤50 wt.% and the Ni content thereof is ≤20 wt.%. COPYRIGHT: (C)2004,JPO

Copper or copper alloy subjected to plating and method for manufacturing the same

PROBLEM TO BE SOLVED: To provide a manufacturing method of a fitting type connecting terminal, being capable of decreasing an insertion force of a terminal with stable contact resistance maintained, even if a base material of a copper zinc alloy is used. SOLUTION: A nickel plating layer 2, a copper plating layer 3, and a tin plating layer 4 are formed in order from the side closer to the surface of a base material 1. This is heat-treated under the temperature condition of 150 deg.C or above and 170 deg.C or below. In this temperature range, copper is easily diffused in tin to form a Cu6 Sn5 layer 5 from the vicinity of an interface between the tin plating layer 4 and the copper plating layer 3, and the alloying is accelerated. As the Cu6 Sn5 layer 5 grows uniformly parallel to the surface of the tinning layer 4, the apparent hardness of a terminal surface can be increased and the insertion force of the terminal can be reduced with stable contact resistance maintained, if the heat treatment condition is set so that the tinning layer 2 can thinly remain. As the nickel plating layer 2 acts as a layer for preventing the zinc diffusion, the zinc in the base material 1 is diffused into the surface of the tin plating layer 4 to prevent the formation of zinc oxide.

Manufacture of fitting type connecting terminal

A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 μm. The copper-tin alloy layer has a thickness of 0.1-1.0 μm and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 μm for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 μm for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

Plated copper alloy material and process for production thereof

PURPOSE:To provide a copper lead frame material for a tantalum capacitor having excellent heat peeling resistance and exhibiting satisfactory solder wettability even after heat treatment. CONSTITUTION:A copper lead frame material for a tantalum capacitor has a base material 4 made of German silver, a nickelplated layer 2 formed on the material 4, an intermetallic compound layer 3 of tin and copper formed in thickness of 0.1 to 2.0mum on the layer 2, and a tin-plated layer 1 (or solder- plated layer) formed on the layer 3. The layer 3 is formed by forming, for example, a copper-plated layer of 0.1 to 1.0mum thick on the nickel-plated layer, forming a tin- or solder-plated layer on the copper-plated layer, and then reflowing or melted tin-plating or melted solder-plating on the copper-plated layer.

Copper lead frame material for tantalum capacitor and manufacture thereof

PROBLEM TO BE SOLVED: To furthermore improve the stamping workability (the reduction of the wear of a stamping die and the burrs and sagging in a copper alloy subjected to punching) of a Cu-Ni-Si series alloy while satisfactorily maintaining its strength, electric conductivity, stress relaxation resistance and plating properties. SOLUTION: This invension is composed of a copper alloy having a compsn. contg., by weight, 0.1 to 4.0% Ni, 0.01 to 1.0% Si, 0.01 to 5.0% Zn and 0.0001 to 0.005% S, furthermore contg. one or >= two kinds of elements selected from the group of 0.00003 to 0.003% Se, 0.00003 to 0.003% Te, 0.00003 to 0.003% Sb and 0.00003 to 0.003% Bi by 0.00003 to 0.005% in total, and the balance Cu with inevitable impurities.

Copper alloy for electric and electronic parts

PROBLEM TO BE SOLVED: To obtain an Ni or Ni alloy plating material for a heat radiating board excellent in resin adhesion by specifying the intensity ratio of the peak of the oxide and hydroxide of Ni2P to the peak of a metal by ESCA analysis. SOLUTION: In an Ni or Ni alloy plating material for a heat radiating board, the intensity ratio of the peak of the oxide and hydroxide of Ni2P to the peak of unoxidized Ni by ESCA (X-ray photoelectron spectroscopy) analysis is controlled to 0.1 to 0.8, and the glossiness of the Ni or Ni alloy plating is preferably controlled to <=1.5. The Ni2P of the Ni or Ni alloy plating is different in accordance with the kinds of the plating and the conditions of the plating, i.e., the current density of the cathode and the temp. of the plating soln., and, by selecting the optimum plating conditions, the intensity ratio can be controlled to the range of 0.1 to 0.8. Moreover, as the Ni or Ni alloy plating material for heat radiating board, the one obtd. by applying Ni or Ni alloy plating on a copper or copper alloy material is used.

Plating material for heat radiating board of electronic parts

PURPOSE: To produce a plating material excellent in oxidation resistance by plating a copper material with a tin material and forming an org. film consisting of a phosphoric ester and a phosphorous ester on the plating material. CONSTITUTION: The surface of copper or a copper alloy is plated with tin or tin alloy, and an aq. soln. contg. ≥0.1g/l of a phosphoric ester (diphenyl ester of phosphoric acid, etc.), a phosphorous ester (diphenyl ester of phosphorous acid, etc.) or a mixture of phosphoric ester and phosphorous ester is applied on the surface of the plating material to form an org. film. Consequently, the terminal, connector and contact with the discoloration resistance, wettability with solder, contact resistance, etc., hardly deteriorated and excellent in oxidation resistance are obtained. COPYRIGHT: (C)1995,JPO

Tin and tin alloy plating material excellent in oxidation resistance and its production

PROBLEM TO BE SOLVED: To obtain a copper alloy material capable of being directly and excellently plated with silver without applying a substrate plating by pickling the copper alloy material contg. Fe with an aq. acidic soln. contg. sulfuric acid, an oxidizing agent and ethylene glycol in specified concn. at least after final annealing. SOLUTION: The oxide of Fe is completely dissolved in an aq. acidic soln. contg. sulfuric acid, an oxidizing agent and 1 to 100 g/l ethylene glycol, and its redeposition is effectively prevented by the soln. Hydrogen peroxide and a persulfate are preferably used as the oxidizing agent. When sulfuric acid is combined with hydrogen peroxide, the sulfuric acid concn. is controlled to 100 to 500 g/l and the hydrogen peroxide concn. to 5 to 100 g/l from the standpoint of etching power and economy. While both concns. are controlled in such a range, the molar ratio (sulfuric acid/hydrogen peroxide) is adjusted to >=0.35. Meanwhile, pickling is preferably carried out in the aq. acidic soln. at 20 to 70 deg.C for 1 to 300 sec to sufficiently improve the silver plating property.

聡丸尾

Papers

Copper lead frame material for tantalum capacitor and manufacture thereof

Copper alloy for electric and electronic parts

Plating material for heat radiating board of electronic parts

Tin and tin alloy plating material excellent in oxidation resistance and its production

Production of copper alloy material for electronic parts having good silver plating property

聡 丸尾

Papers

Copper lead frame material for tantalum capacitor and manufacture thereof

Copper alloy for electric and electronic parts

Plating material for heat radiating board of electronic parts

Tin and tin alloy plating material excellent in oxidation resistance and its production

Production of copper alloy material for electronic parts having good silver plating property

聡丸尾