scispace - formally typeset
Patent

Copper alloy for electric and electronic parts

Reads0
Chats0
TLDR
In this paper, the authors proposed a method to improve the stamping workability by reducing the wear of a stamping die and the burrs and sagging in a copper alloy subjected to punching while satisfactorily maintaining its strength, electric conductivity, stress relaxation resistance and plating properties.
Abstract
PROBLEM TO BE SOLVED: To furthermore improve the stamping workability (the reduction of the wear of a stamping die and the burrs and sagging in a copper alloy subjected to punching) of a Cu-Ni-Si series alloy while satisfactorily maintaining its strength, electric conductivity, stress relaxation resistance and plating properties. SOLUTION: This invension is composed of a copper alloy having a compsn. contg., by weight, 0.1 to 4.0% Ni, 0.01 to 1.0% Si, 0.01 to 5.0% Zn and 0.0001 to 0.005% S, furthermore contg. one or >= two kinds of elements selected from the group of 0.00003 to 0.003% Se, 0.00003 to 0.003% Te, 0.00003 to 0.003% Sb and 0.00003 to 0.003% Bi by 0.00003 to 0.005% in total, and the balance Cu with inevitable impurities.

read more

Citations
More filters
Patent

High-mechanical strength copper alloy

TL;DR: A high-mechanical strength copper alloy, which comprises Ni 3.5 to 4.5% by mass, Zn 0.2 to 1.5%, Mg 0.01 to 0.20%, and S less than 0.005%, was proposed in this article.
Patent

Copper alloy material for parts of electronic and electric machinery and tools

TL;DR: In this paper, a specific crystal grain diameter and a specific ratio between the longer diameters of a crystal grain on a cross section parallel or perpendicular to a direction of final plastic working are defined.
Patent

High-strength high-conductivity copper alloy wire rod of excellent resistance to stress relaxation characteristics

TL;DR: A high-strength high-conductivity copper alloy wire rod of excellent resistance to stress relaxation characteristics, which exhibits a conductivity of 20 to 60% IACS and a tensile strength of 700 to 1300 MPa is described in this article.
Patent

High-strength, high-conductivity copper alloy wire excellent in resistance to stress relaxation

TL;DR: A high-strength, high conductivity copper alloy wire that is excellent in resistance to stress relaxation, which contains 1.0 to 4.5% by mass of Ni, 0.2 to 1.1%, and less than 0.005% of S, with the balance being Cu and inevitable impurities, is described in this paper.
Patent

Copper alloy plate material for electric and electronic components

TL;DR: In this paper, a copper alloy plate material for electric and electronic components comprising 1.5 to 4.0% by mass of Ni and 0.3 to 0.5% of Si with the balance consisting of Cu and unavoidable impurities.
Related Papers (5)