T
Takahiro Manako
Publications - 4
Citations - 40
Takahiro Manako is an academic researcher. The author has contributed to research in topics: Alloy & Intermetallic. The author has an hindex of 4, co-authored 4 publications receiving 40 citations.
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Patent
Copper alloy for electric and electronic parts
Masaaki Isono,Kanao Kenji,Takahiro Manako,Satoshi Maruo,Matsui Takashi,聡 丸尾,隆 松井,隆弘 真名子,誠昭 磯野,健志 金尾 +9 more
TL;DR: In this paper, the authors proposed a method to improve the stamping workability by reducing the wear of a stamping die and the burrs and sagging in a copper alloy subjected to punching while satisfactorily maintaining its strength, electric conductivity, stress relaxation resistance and plating properties.
Patent
Tin or tin alloy plated copper alloy for multi-pole terminal, and method of producing the same
TL;DR: In this paper, a first layer with a thickness of 0.1 to 0.4 μm consisting of a copper-tin intermetallic compound or a nickel-tin intrametric compound was used to reduce the inserting force of an automobile multi-pole terminal and to lessen the fatigue of operators and the reduction of operability on assembling an automobile.
Patent
Tin or tin alloy-plated copper alloy for multipole terminal and its production
TL;DR: In this article, the insertion force of the miltipole terminal for an automobile was reduced to relieve the fatigue of an operator at the time of assembling an automobile and to lessen the deterioration of operability.
Patent
Sn OR Sn ALLOY PLATING MATERIAL FOR TERMINAL AND CONNECTOR
TL;DR: In this paper, the surface of a copper or copper alloy stock is formed with an Ni or Ni alloy plating film having a plating thickness of 0.1 to 5 μm and containing 0.5 to 5,000 ppm hydrogen.