A copper alloy for an electronic device containing Mg in a range of 2.6 atomic % or more and 9.8 atomic % or less, Al in a range of 0.1 atomic % or more and 20 atomic % or less, and the balance substantially consisting of Cu and unavoidable impurities.

Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device

A copper alloy that consists essentially of, by weight, from 0.15% to 0.7% of chromium, from 0.005% to 0.3% of silver, from 0.01% to 0.15% of titanium, from 0.01% to 0.10% of silicon, up to 0.2% of iron, up to 0.5% of tin, and the balance copper and inevitable impurities has high strength, a yield strength in excess of 80 ksi, and high electrical conductivity, in excess of 80% IACS. The alloy further has substantially isotropic bend characteristics when the processing route includes a solution heat anneal above 850° C. and subsequent cold rolling into sheet, strip or foil interspersed by bell annealing. As a result, the alloy is particularly suited for forming into box-type electrical connectors for both automotive or multimedia applications. The alloy is also suitable for forming into a rod, wire or section.

Silver containing copper alloy

A high-mechanical strength copper alloy, which comprises Ni 3.5 to 4.5% by mass, Si 0.7 to 1.0% by mass, Mg 0.01 to 0.20% by mass, Sn 0.05 to 1.5% by mass, Zn 0.2 to 1.5% by mass, and S less than 0.005% by mass (including 0% by mass), with the balance being made of Cu and inevitable impurities, wherein a crystal grain diameter is from more than 0.001 mm to 0.025 mm; and the ratio (a/b), between a longer diameter a of a crystal grain on a cross section parallel to a direction of final plastic-working, and a longer diameter b of a crystal grain on a cross section perpendicular to the direction of final-plastic working, is 1.5 or less, and wherein the alloy has a tensile strength of 800 N/mm 2 or more.

High-mechanical strength copper alloy

A copper alloy material for parts of electronic and electric machinery and tools contains 1.0 to 3.0 mass % of Ni, 0.2 to 0.7 mass % of Si, 0.01 to 0.2 mass % of Mg, 0.05 to 1.5 mass % of Sn, 0.2 to 1.5 mass % of Zn, and less than 0.005 mass % (including 0 mass %) of S, with the balance being Cu and inevitable impurities, wherein the copper alloy material has: (1) a specific crystal grain diameter, and a specific ratio between the longer diameters of a crystal grain on a cross section parallel or perpendicular to a direction of final plastic working; and/or (2) a specific surface roughness after the final plastic working.

Copper alloy material for parts of electronic and electric machinery and tools

A high-strength high-conductivity copper alloy wire rod of excellent resistance to stress relaxation characteristics, the copper alloy wire rod comprising 1.0 to 4.5 mass% of Ni, 0.2 to 1.1 mass% of Si, 0.05 to 1.5 mass% of Sn, less than 0.005 mass% (including zero) of S and the remainder consisting of Cu and unavoidable impurities, which exhibits a conductivity of 20 to 60% IACS and a tensile strength of 700 to 1300 MPa. Also, there is provided a process for producing the same.

High-strength high-conductivity copper alloy wire rod of excellent resistance to stress relaxation characteristics

PROBLEM TO BE SOLVED: To furthermore improve the stamping workability (the reduction of the wear of a stamping die and the burrs and sagging in a copper alloy subjected to punching) of a Cu-Ni-Si series alloy while satisfactorily maintaining its strength, electric conductivity, stress relaxation resistance and plating properties. SOLUTION: This invension is composed of a copper alloy having a compsn. contg., by weight, 0.1 to 4.0% Ni, 0.01 to 1.0% Si, 0.01 to 5.0% Zn and 0.0001 to 0.005% S, furthermore contg. one or >= two kinds of elements selected from the group of 0.00003 to 0.003% Se, 0.00003 to 0.003% Te, 0.00003 to 0.003% Sb and 0.00003 to 0.003% Bi by 0.00003 to 0.005% in total, and the balance Cu with inevitable impurities.

Copper alloy for electric and electronic parts

PROBLEM TO BE SOLVED: To provide a Cu-Mg-Zn alloy for electrical and electronic parts, excel lent in stamping characteristic (minimal in burr and sagging as well as in wear of a stamping die). SOLUTION: This alloy has a composition consisting of, by weight, 0.01-2.0% Mg, 0.01-10.0% Zn, 0.00001-0.005%, in total, of one or >=2 elements selected from the group consisting of 0.00001-0.000% Se, 0.00001-0.003% Te, 0.00001-0.003% Sb, and 0.00001-0.003% Bi, 0.00001-0.003% S, and the balance Cu with inevitable impurities.

健志金尾

Papers

Copper alloy for electric and electronic parts

Copper alloy for electrical and electronic part

健志 金尾

Papers

Copper alloy for electric and electronic parts

Copper alloy for electrical and electronic part

健志金尾