In a conductive material, on the surface of a base material composed of a Cu plate strip, a Cu-Sn alloy covering layer, which contains a Cu of 20-70at% and has an average thickness of 0.1-3.0µm, and an Sn covering layer having an average thickness of 0.2-5.0µm are formed in this order, and a part of the Cu-Sn alloy covering layer is exposed from the surface of the Sn covering layer at an exposing area rate of 3-75%. Reflow process is performed to the material surface, and preferably, the arithmetic average roughness Ra at least in one direction is 0.15µm or more, the arithmetic average roughness Ra in all the directions is 3.0µm or less, and the average thickness of the Cu-Sn alloy covering layer is 0.2µm or more. The conductive material is manufactured by forming an Ni plating layer, and further, a Cu plating layer and an Sn plating layer as needed on the roughened base material surface, then by performing reflow process.

Conductive material for connecting part and method for manufacturing the conductive material

A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region.

Whisker-free lead frames

A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 μm. The copper-tin alloy layer has a thickness of 0.1-1.0 μm and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 μm for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 μm for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

Plated copper alloy material and process for production thereof

Disclosed is a conductive material for a connecting part, including: a base material made up of a Cu strip; a Cu—Sn alloy covering layer having an average thickness of 0.2 to 3.0 μm; and an Sn covering layer, the Cu—Sn alloy covering layer being provided between the base material and the Sn covering layer, wherein in a cross section perpendicular to the surface of the conductive material, the diameter [D 1] of the minimum inscribed circle of the Sn covering layer is 0.2 μm or less, the diameter [D 2] of the maximum inscribed circle of the Sn covering layer is 1.2 to 20 μm, the difference in elevation [y] between the outermost point of the material and the outermost point of the Cu—Sn alloy covering layer is 0.2 μm or less, and a bright or semi-bright tin electroplating layer having an average thickness of 0.01 μm or more in an approximately uniform thickness is formed on the outermost layer as part of the Sn covering layer.

Conductive material for a connecting part

A high-mechanical strength copper alloy, which comprises Ni 3.5 to 4.5% by mass, Si 0.7 to 1.0% by mass, Mg 0.01 to 0.20% by mass, Sn 0.05 to 1.5% by mass, Zn 0.2 to 1.5% by mass, and S less than 0.005% by mass (including 0% by mass), with the balance being made of Cu and inevitable impurities, wherein a crystal grain diameter is from more than 0.001 mm to 0.025 mm; and the ratio (a/b), between a longer diameter a of a crystal grain on a cross section parallel to a direction of final plastic-working, and a longer diameter b of a crystal grain on a cross section perpendicular to the direction of final-plastic working, is 1.5 or less, and wherein the alloy has a tensile strength of 800 N/mm 2 or more.

High-mechanical strength copper alloy

PROBLEM TO BE SOLVED: To furthermore improve the stamping workability (the reduction of the wear of a stamping die and the burrs and sagging in a copper alloy subjected to punching) of a Cu-Ni-Si series alloy while satisfactorily maintaining its strength, electric conductivity, stress relaxation resistance and plating properties. SOLUTION: This invension is composed of a copper alloy having a compsn. contg., by weight, 0.1 to 4.0% Ni, 0.01 to 1.0% Si, 0.01 to 5.0% Zn and 0.0001 to 0.005% S, furthermore contg. one or >= two kinds of elements selected from the group of 0.00003 to 0.003% Se, 0.00003 to 0.003% Te, 0.00003 to 0.003% Sb and 0.00003 to 0.003% Bi by 0.00003 to 0.005% in total, and the balance Cu with inevitable impurities.

Copper alloy for electric and electronic parts

PROBLEM TO BE SOLVED: To reduce the inserting force of an automobile multi-pole terminal, and to lessen the fatigue of operators and the reduction of operability on assembling au automobile. SOLUTION: The tin or tin alloy plated copper alloy for a multi-pole terminal has a first layer with a thickness of 0.1 to 0.4 μm consisting of a copper-tin intermetallic compound or a nickel-tin intermetallic compound, and a tin or tin alloy plating layer of 0.1 to 1.2 μm on the surface thereof. The dynamic friction coefficient between the materials is ≤0.3. The terminal obtained form the plating materials has a low friction coefficient, and the inserting force of the terminal can be reduced. COPYRIGHT: (C)2004,JPO

Tin or tin alloy plated copper alloy for multi-pole terminal, and method of producing the same

PROBLEM TO BE SOLVED: To reduce the insertion force of the miltipole terminal for an automobile, to relieve the fatigue of an operator at the time of assembling an automobile and to lessen the deterioration of operability. SOLUTION: This tin or tin alloy-plated copper alloy for a multipole terminal has a first layer having 0.1-0.4μm thickness and consisting of the intermetallic compd. of copper and tin or that of nickel and tin and a tin or tin alloy plating layer having 0.1-1.2μm thickness thereon, and the coefficient of kinetic friction between the layers is controlled to <=0.3. The terminal obtained from the alloy is low in friction coefficient, and the insertion force of the terminal is reduced.

Tin or tin alloy-plated copper alloy for multipole terminal and its production

PROBLEM TO BE SOLVED: To provide an Sn or Sn alloy plating material for engaging type terminals and connectors in which electrical reliability (low contact resistance) can be maintained even in a high temperature atmosphere such as in an automobile engine room, and also, inserting force can be reduced. SOLUTION: The surface of a copper or copper alloy stock is formed with an Ni or Ni alloy plating film having a plating thickness of 0.1 to 5 μm and containing 0.5 to 5,000 ppm hydrogen, and the surface thereof is formed thereon with an Sn or Sn alloy plating film. COPYRIGHT: (C)2002,JPO

隆弘真名子

Papers

Copper alloy for electric and electronic parts

Tin or tin alloy plated copper alloy for multi-pole terminal, and method of producing the same

Tin or tin alloy-plated copper alloy for multipole terminal and its production

Sn OR Sn ALLOY PLATING MATERIAL FOR TERMINAL AND CONNECTOR

隆弘 真名子

Papers

Copper alloy for electric and electronic parts

Tin or tin alloy plated copper alloy for multi-pole terminal, and method of producing the same

Tin or tin alloy-plated copper alloy for multipole terminal and its production

Sn OR Sn ALLOY PLATING MATERIAL FOR TERMINAL AND CONNECTOR

隆弘真名子